➀ Blue Cheetah Analog Design has successfully taped out its next generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry's SF4X 4nm advanced manufacturing process.

➁ The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps.

➂ It achieves industry-leading silicon area footprint.

➀ Multi Chip Modules (MCM) are emerging as a game-changing solution for faster and more powerful electronics.

➁ Traditional chip designs can no longer meet the growing need for performance and space-saving designs.

➂ MCMs integrate multiple chips into a single package, offering a sophisticated approach to semiconductor architecture.

➀ Heterogeneous integration is a solution that allows different materials and components to work together seamlessly, enhancing system performance.

➁ This approach enables the development of sophisticated electronic devices that are smaller, faster, and more efficient.

➂ Understanding heterogeneous integration involves grasping its key concepts and technologies.

➀ Chip Scale Packaging (CSP) is an advanced packaging technology that allows for smaller, more efficient electronic components.

➁ CSP is transforming device design and manufacturing processes across various industries.

➂ The technology optimizes space usage and enhances performance in microelectronics.

➀ The incoming U.S. Commerce Secretary supports the CHIPS and Science Act, indicating continuity despite political changes.

➁ Major semiconductor companies like Intel, GlobalFoundries, TSMC, Texas Instruments, and Samsung Foundry are investing heavily in U.S. fabs.

➂ Despite support from the new Commerce Secretary, some in Trump's team criticize the rapid distribution of funds before the transition.