➀ Researchers developed lipid nanoparticles (LNPs) to deliver mRNA encoding the KRAS G12D neoantigen and cGAMP to reprogram the liver's immune environment and generate an antitumor response against metastatic pancreatic cancer.

➁ The LNPs successfully activated the type I interferon pathway, leading to the generation of CD8+ cytotoxic T cells capable of recognizing and attacking metastatic cancer cells.

➂ The study suggests that combining KRAS mRNA with a STING agonist strengthens the immune response against PDAC and offers a more effective approach than traditional immunotherapies.

➀ Ed reflects on the sources of €1trn and his strategy to secure a share of it;

➁ Ed discusses the possibility of the US raising €800 billion for 'ReArm Europe' and €200 billion for 'InvestAI';

➂ Ed's assignment to the EU as 'Digital Envoy' and his plan to spend on meals and indulgences to identify influential figures in the spending of the funds.

➀ A research team led by Professor Kyu-Young Park from POSTECH has developed technology to significantly increase the lifespan and energy density of electric vehicle (EV) batteries;

➁ The technology involves a 'nano-spring coating' technique that improves battery stability and performance;

➂ The research is published in ACS Nano and has the potential to revolutionize EV battery technology.

➀ Intel has achieved an exciting milestone with the first run of 18A (1.8nm-class) wafers at its Arizona fab;

➁ The milestone involves transferring the new fabrication process to a brand-new facility in Arizona;

➂ Intel plans to mass produce compute chiplets for Panther Lake processors and Xeon 7 processors for datacenters using the 18A technology.

➀ JEDEC and OCP announce new Chiplet Design Kits for EDA use;

➁ The kits cover Assembly, Substrate, Material, and Test;

➂ The kits aim to automate SiP design and build using chiplets.

➀ A new type of miniaturized pumps and valves using ultra-thin silicon films is presented at the Hannover Messe, developed by researchers at Saarland University. These pumps and valves operate without air pressure, motors, and lubricants, and can be operated in clean rooms. The team demonstrates a prototype of a new vacuum pump that can draw a vacuum up to 300 millibars.

➁ The technology is cost-effective, lightweight, and energy-efficient compared to current methods, with a 400 times lower energy consumption compared to conventional air-driven valves.

➂ The researchers have developed a novel actuator and pump technology that can be used in various applications, including robotic grippers, speakers, smart textiles, and haptic feedback.

➀ A team from Saarland University's Faculty of Engineering and Medicine is developing smart implants at the university and university hospital to monitor and promote healing in body bone fractures.

➁ The robotic implants can stiffen and soften through shape-memory technology, allowing for permanent monitoring of fracture healing.

➂ The research team is miniaturizing the technology for use in market screws as part of an EU project.

➀ Lois Rossmann, a renowned RepairTuber, expresses disappointment with Brother's shift towards becoming an 'anti-consumer printer company';

➁ Brother's recent firmware updates have disabled third-party toner and prevented color registration functionality on color devices;

➂ Older firmware versions are being removed from support portals, making it difficult for users to roll back updates.

➀ The 75th annual IEEE Electronic Components and Technology Conference (ECTC) will take place from May 27-30, 2025, featuring a range of technical sessions, special sessions, and workshops on cutting-edge topics in electronic packaging and microelectronics.

➁ Keynote speaker Samuel Naffziger will discuss achieving efficient zettascale compute in the AI era.

➂ The conference will also feature a Heterogeneous Integration Roadmap (HIR) workshop and 16 Professional Development Courses.

➀ MIT researchers have developed a chip-based terahertz wave generator that doesn't require bulky silicon lenses, making it scalable and cost-effective.

➁ The system uses a thin, patterned sheet attached to the back of the chip to improve efficiency, leveraging Intel's high-power transistors.

➂ This technology could be integrated into various applications such as security scanners and environmental monitors due to its scalability and high peak radiation power of 11.1 dBm.

➀ The VTT Technical Research Centre of Finland has been awarded €29 million for chip packaging development under the EU APECS pilot line project.

➁ VTT will focus on radio frequency technologies for 6G networks and the development of optical microsystems and chip packaging methods.

➂ VTT is involved in FAMES and NanoIC pilot line projects and will operate in Kvanttinova, a microelectronics and quantum technology RDI Hub.

➀ OpenAI, the creator of ChatGPT, is about to finalize its first in-house AI chip design;

➁ The company plans to send the chips to TSMC for fabrication with an aim for mass production in 2026;

➂ This move is a significant step towards reducing reliance on NVIDIA.

➀ NVIDIA CEO Jensen Huang introduced new tools at CES 2025 aimed at democratizing AI access for everyone, not just researchers or large enterprises.

➁ These tools include Project DIGITS, NEMO, and Blackwell GPUs, which are designed to be portable, scalable, and easy to use, reducing the barriers to AI adoption.

➂ The introduction of these tools aims to simplify workflows, lower the barrier to entry, and empower individuals and small teams with AI capabilities.

➀ The Fraunhofer Society's Saxony microelectronics institutes are expanding their technological capabilities in the field of chiplet innovation and significantly contributing to the APECS Pilot Line under the European Chips Act. Saxony is investing 38 million euros in support.

➁ The total funding amounts to 730 million euros, provided by Chips Joint Undertaking, the Federal Ministry of Education and Research (BMBF), and other national funding. APECS is coordinated by the Fraunhofer Society and implemented by the Research Factory Microelectronics Germany (FMD).

➂ The APECS Pilot Line is a key component of the EU Chips Act to promote chiplet innovations and increase research and manufacturing capacities for semiconductors in Europe.

➀ The semiconductor industry is expected to see significant expansion in 2025 with plans to start construction on 18 new fabrication plants (fabs).

➁ According to SEMI's World Fab Forecast, the industry is projected to grow to $697 billion in 2025, marking an 11.2% increase from 2024.

➂ Some of these fabs are scheduled for production in 2026 or later.

➀ PseudolithicIC, a startup focused on RF chipsets, has secured a $6 million seed funding round led by investors such as Entrada Ventures, Foothill Ventures, and Uncork Capital.

➁ The company's products integrate compound semiconductor chiplets into silicon wafers, aiming to revolutionize the technical performance and economic aspects of the RF and millimeter-wave communication industry.

➂ PseudolithicIC's proprietary technology combines high-performance compound semiconductor chiplets with low-cost 300mm silicon wafers, offering enhanced performance, power efficiency, and scalability for RF applications.

➀ Leading Chinese semiconductor equipment makers reported significant revenue growth in 2024.

➁ AMEC, ACM, and Naura saw increases in sales and profitability despite increased R&D spending.

➂ The growth is attributed to the increasing demand for chipmaking tools and the construction of new fabs in China.

➀ Hua Hong Semiconductor, China's second-largest chip foundry, has appointed Bai Peng as its president to focus on advanced logic chip production.

➁ Bai Peng, with over three decades of experience at Intel, will help Hua Hong shift towards more advanced semiconductor production technologies.

➂ Hua Hong is expanding its production capabilities to include 40nm and above, aiming to become a key player in both legacy and advanced chip markets.

➀ Numem, a Sunnyvale startup, has developed MRAM-based chiplets designed for AI systems. Sampling is expected to start in late Q4'25.

➁ The chiplets offer up to 4TB/s memory throughput and support 4GB per stack package, making them scalable for demanding AI workloads.

➂ Numem's technology claims to significantly reduce standby power and deliver up to 4x faster performance than HBM while maintaining ultra-low power consumption.

➀ Blue Cheetah Analog Design has successfully taped out its next generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry's SF4X 4nm advanced manufacturing process.

➁ The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps.

➂ It achieves industry-leading silicon area footprint.