➀ South Korean fab equipment maker Justem is developing hybrid bonding equipment for future high-bandwidth memory (HBM) applications;

➁ The company secured a 14 billion won (approx. $10.2 million) government-supported project, with 7.5 billion won in direct funding from South Korea's Ministry of Trade, Industry and Energy;

➂ This initiative aims to advance hybrid bonding technology critical for next-generation memory manufacturing, with prototype development expected by 2026.

SFA has developed three different kinds of metrology and inspection (MI) machines and has supplied one of them to a major South Korean chipmaker.

The company has supplied a white light interferometry (WLI)-based height measurement machine to the conglomerate and plans to supply four additional units.

Zeus, a South Korean semiconductor equipment manufacturer, reported revenue of 315.7 billion won last year, a 69% increase from 2023, according to its filings on Monday. It also returned to profitability with an operating income of 39.1 billion won. This growth is attributed to Zeus's timely development of cleaners for high-bandwidth memory.

➀ Micron confirms plans to raise memory prices due to strong demand for DRAM and NAND flash.

➁ The price hike is expected to continue through 2025 and 2026.

➂ Factors include supply constraints and growing demand from AI, data centers, and consumer electronics.

SK Hynix's CEO announced that the company's high-bandwidth memory (HBM) production capacity for this year has already been sold out. Following discussions with a customer, it is also expected that next year's volume or production capacity will be sold out within the first half of this year.

DI Corporation’s subsidiary, Digital Frontier, has supplied samples of its wafer inspection kit to SK Hynix for use in the production of HBM4. The equipment is currently undergoing quality testing by the chipmaker, and official orders are expected within three to six months.

SK Hynix is planning to install equipment in its new M15X factory two months ahead of schedule, due to a surge in orders for its high-bandwidth memory (HBM) from customers, particularly Broadcom. The company is also expanding its production capabilities.

Hanwha Semitech announced on Friday that it has entered into a 21 billion won agreement to supply high-bandwidth memory (HBM) production equipment to SK Hynix. The company, previously known as Hanwha Precision Machinery, did not specify the equipment, but it is almost certain to be thermal compression (TC) bonders.

➀ Neil Druckmann discussed the evolving role of storytelling in video games with screenwriter Alex Garland, reflecting on the challenges and inspirations around narratives in games.

➁ Games like BioShock and The Last of Us demonstrated the full capability of narrative in gaming, challenging the industry's skepticism.

➂ Druckmann shared his early inspirations for narrative-driven games, including Monkey Island 2 and Half-Life 2.

➀ Reputable leaker Billbil-Kun reports that Death Stranding 2 pre-orders are expected to start in March, with a release date likely announced at SXSW 2025.

➁ The game will have a Standard Edition at $69.99 and a Collector's Edition at $229.

➂ The leak also confirms that Death Stranding 2 will launch with a physical Standard Edition, priced at $69.99 USD / 69.99 EUR, along with a Collector's Edition planned for North America and Europe, retailing at $229 USD.

➀ Dr. Prady Gupta is the Founder and Chief Scientist at Infinita Lab and Infinita Materials, focusing on materials testing and specialized chemicals for high-tech industries.

➁ Infinita Lab offers a network of over 2,000 accredited labs for comprehensive materials testing services.

➂ Infinita Materials specializes in custom inorganic chemicals for sectors like semiconductors and batteries.

➀ This paper discusses the post-silicon validation of the IBM POWER9 processor, highlighting its significance in the context of increasing multi-core processor adoption by hyperscalers.

➁ IBM's Threadmill, a tool for processor verification, has been enhanced since the POWER7, including optimized template allocation and debugging strategies for multi-core write drops.

➂ The validation methodology for POWER9 has significantly improved bug detection rates compared to POWER8, with new techniques like AI prioritization and hardware irritators to induce bugs.

➀ Traditional RF board design strategies are insufficient for high frequencies and dense layouts;

➁ Keysight and Modelithics collaborate on an advanced RF board simulation workflow;

➂ The use of 3D passive component models enhances simulation accuracy and reduces the risk of board re-spins.

Genesem, a fab equipment manufacturer, has supplied a package sorter for the final testing of high-bandwidth memory (HBM) to a South Korean chip-maker. This is Genesem's first deal of this kind with the chip-maker. The sorter is also compatible with HBM inspection equipment that Nvidia requested.

➀ Samsung's top chip executive visited Nvidia's headquarters in the US;

➁ He brought a sample of the company's latest 1b DRAM;

➂ The purpose of the visit was to discuss the potential use of the improved DRAM for HBM.

➀ The GeForce RTX 5060's launch has been pushed back to April 2025 due to 'chip supply constraints';

➁ The delay affects the RTX 5070, RTX 5080, and RTX 5090, with limited supply expected leading to instant sellouts;

➂ The AI boom is increasing semiconductor demand, impacting the availability of the new GeForce RTX 50 Series.

➀ Anduril Industries, led by Palmer Luckey, is set to take over the US Army's Integrated Visual Augmentation System (IVAS) program, pending Department of Defense approval.

➁ The program includes advanced headgear with AR capabilities, and Anduril will manage production and development with Microsoft Azure as the preferred cloud provider.

➂ Palmer Luckey, the founder of Oculus VR and Anduril Industries, sees this as a deeply personal achievement, emphasizing the potential of the technology to save lives.

Hanwha Precision Machinery is on the verge of officially securing orders from SK Hynix for thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM). Sources indicate that the equipment manufacturer is in the final stages of verification with the chip-maker.

➀ KLA报告第三季度营收31亿美元，非GAAP每股收益8.20美元；

➁ 预计未来季度营收30-35亿美元，非GAAP每股收益7.55-8.65美元；

➂ AI和HBM是推动高端市场增长的关键因素。

➀ Samsung has reportedly received approval to supply NVIDIA with its 8-layer HBM3E memory chips for less powerful AI GPUs destined for China.

➁ Despite previous distrust from NVIDIA's CEO, Samsung is now approved to supply these chips.

➂ SK hynix remains NVIDIA's main partner for advanced HBM memory, providing 12-layer HBM3E and working on next-gen HBM4 for future GPUs.