Recent #HPC news in the semiconductor industry

2 days ago

➀ Biocomputers utilize living neurons instead of silicon, offering millionfold energy efficiency and potential for sustainable AI development;

➀ By integrating biological systems with optics and electronics, researchers enable neuron-based computing, though practical applications remain experimental;

➂ Market projections suggest growth to $17 billion by 2032, driven by biocomputing's niche advantages in neural simulations over traditional silicon.

AIHPCsemiconductor
7 days ago

➀ The EU-funded OPeraTIC project developed an ultrafast pulsed laser system integrating AI and real-time monitoring for efficient 3D surface treatment in industrial applications, tested across household appliances, lighting, aviation, and automotive sectors;

➁ Key advancements include 3D motion integration via robotics, versatile material structuring (stainless steel, aluminum, composites), real-time quality control, AI-driven process optimization, and Industry 4.0 compatibility;

➂ The platform aims to reduce errors, enhance efficiency, and enable sustainable high-performance manufacturing through scalable, intelligent laser technology.

AI3D ICHPC
7 days ago

➀ Researchers at the University of Würzburg developed a topological insulator that operates at higher temperatures (around -213°C), overcoming previous limitations of functioning near absolute zero;

➁ The material uses a three-layer quantum well structure (InAs/GaInSb/InAs) to enhance band-gap energy and structural symmetry, enabling robust spin-polarized electron transport;

➂ This breakthrough enables compatibility with existing silicon-chip technology, paving the way for energy-efficient topological electronics in practical applications.

semiconductorHPCPhysics
7 days ago

➀ Researchers at the University of Würzburg developed a topological insulator functioning at higher temperatures (−213°C), overcoming previous limitations requiring near-absolute-zero conditions;

➁ The material features a three-layer quantum well (InAs/GaInSb/InAs), enhancing bandgap energy and structural symmetry for robust, low-loss electron transport;

➂ This breakthrough paves the way for energy-efficient topological electronics compatible with silicon chip technology, enabling scalable and reliable applications.

semiconductorHPC3D IC
7 days ago

➀ TU Ilmenau launches a 3-year research project using EEG-based Brain-Computer Interfaces (BCIs) combined with rehabilitation robots to improve lower limb mobility recovery in stroke patients.

➁ The project focuses on developing novel convolutional neural network algorithms to enhance EEG signal analysis and "Motor Imagery" accuracy for legs and pelvis rehabilitation.

➂ This approach aims to provide new neurofeedback-driven rehabilitation strategies, potentially restoring quality of life for stroke survivors.

AIsemiconductorHPC
7 days ago

➀ Traditional chip cooling methods dissipate heat from the surface, creating localized hot spots (dark silicon) that limit performance and energy efficiency.

➁ Researchers propose photonic cooling using anti-Stokes fluorescence, where targeted laser light absorbs heat from inside the chip and converts it into higher-energy light, enabled by a thin photonic cold plate and optical layers.

➂ Early tests show this method outperforms conventional air/liquid cooling with lower power consumption, potentially boosting processing speeds, reducing energy use, and recycling waste heat as light energy.

CoolingsemiconductorHPC
7 days ago

➀ La Luce Cristallina developed 200-mm BaTiO₃ wafers to overcome silicon-photonics limitations, offering higher durability and foundry compatibility than lithium niobate.

➁ Its technology addresses datacom/data center demands for low-power optical interconnects and supports AI, quantum computing, and defense applications.

➂ The company differentiates through cost-effective scaled production and a U.S.-based supply chain to mitigate risks from geopolitical tensions.

SEMiconductorData centerHPC
8 days ago

➀ NVIDIA introduces a high-speed 800G OSFP to 2x 400G QSFP112 passive splitter DAC cable, designed for connecting its SN5610 switches and ConnectX-8 NICs;

➁ The cable utilizes 112G PAM4 signaling and splits an 800G port into two 400G ports, supporting next-gen networking demands;

➂ Highlights the evolving complexity of 400G/800G connectivity standards, including OSFP and QSFP112 connector variations for high-performance computing environments.

NVIDIANetworkingHPC
10 days ago

➀ Intel reported Q3 2025 revenue of $13.7B (+3% YoY) and $4.1B operating profit, driven largely by one-time asset sales and government funding;

➁ Key divisions showed mixed performance: Client Computing Group revenue rose 7.6% QoQ to $8.5B, while Foundry losses narrowed to $2.3B amid capacity shortages;

➂ Q4 guidance remains cautious ($12.8B-$13.8B revenue), prioritizing data center CPU production as demand outpaces supply.

IntelHPCAI
11 days ago

➀ EAH Jena secured €2.8 million in funding from the German Federal Ministry to develop autonomous Micro Air Vehicles (MAVs) for measuring atmospheric parameters like temperature, humidity, and wind speed;

➁ The MAVs feature energy-efficient designs, miniaturized sensors, and return-to-base functionality to minimize environmental impact and airspace risks;

➂ The project fosters interdisciplinary collaboration, student involvement, and a new MAV-Lab to advance applied research and sustainable technology development.

HPCAIsemiconductor
11 days ago

➀ French company Vsora announced the production of its Jotunn8 AI inference chip, targeting data centers with claims of energy efficiency and high performance (3,200 Tflop);

➁ The company emphasizes Europe's technological competitiveness but lacks details on floating-point operation type and power consumption benchmarks;

➂ Full-scale production is scheduled for Q1 2026, backed by $46 million in recent funding.

AI chipHPCIntegrated Circuits
11 days ago

➀ Google's Quantum AI team developed a 105-qubit 'Willow' quantum chip that solves calculations 13,000x faster than the fastest supercomputer;

➁ The chip uses a novel Quantum Echoes algorithm to measure information spread in quantum systems, enabling verifiable results with reduced errors;

➂ Demonstrated through 'out-of-time-order correlator' experiments, this breakthrough lays groundwork for quantum modeling of molecular interactions and energy transfer.

QuantumGoogleHPC
11 days ago

➀ NextSilicon's Maverick-2 accelerator chip adopts a dataflow architecture, emphasizing FP64 compute performance for HPC applications, differentiating itself from NVIDIA's shift away from FP64.

➁ The chip utilizes HBM3e memory and optimizes ALU density by reducing traditional CPU overheads (e.g., branch prediction), while its software identifies computational hotspots for efficient offloading to the accelerator.

➂ Maverick-2 employs adaptive "Mill Cores" to reconfigure dataflow paths dynamically, enabling high parallelism and flexibility akin to FPGAs, with early adoption by Sandia National Lab for real-world deployment.

HPCNextSiliconHBM3e
12 days ago

➀ PI's L-220 series linear actuators deliver sub-micrometer precision for applications in semiconductor testing, optics, and microscopy, with models available for rapid integration;

➁ Featuring travel ranges up to 77 mm, forces up to 125 N, and 0.1µm resolution, they employ closed-loop DC servo or stepper motors and are suitable for vacuum environments;

➂ Widely used in semiconductor fabs and optical labs, these actuators ensure high repeatability and enable fast project responses in industries like semiconductors, photonics, and medical technology.

semiconductorHPCMetrology
13 days ago

➀ Fraunhofer IAPT introduces AI-driven machine vision for additive manufacturing quality assurance, using synthetic data and cost-effective cameras to replace specialized sensors;

➁ A flexible gripping system and collaborative robots enable automated handling of diverse component geometries, even for small-batch production;

➂ Innovations include in-situ post-processing for plastic components, cutting production time by 50%, and hybrid manufacturing reducing titanium usage by over 50%.

AIAutomationHPC
13 days ago

➀ The U.S. government's 10% stake purchase in Intel led to a $73 billion market cap surge, benefiting both Intel and national revenue;

➁ Intel secured a strategic partnership with NVIDIA to supply data center CPUs and integrate GPUs, highlighting renewed industry confidence;

➂ The investment underscores U.S. efforts to strengthen domestic semiconductor sovereignty amid global tech supply chain tensions with China.

IntelNVIDIAHPC
13 days ago

➀ Three Empa researchers were awarded the 2025 Empa Entrepreneur Fellowship to advance innovative products based on their research in terahertz optics, infrastructure monitoring, and laser microstructuring;

➁ Projects include ultradünne Terahertz components for 6G communication (Elena Mavrona), high-resolution strain sensors for wind turbines (Mohammad Jafarpour), and scalable laser surface microstructuring for energy and healthcare (Nicolas Zaugg);

➂ The fellowship supports commercialization efforts, including prototype development, partnerships, and startup preparations aimed at bridging research excellence with industrial applications.

semiconductorEnergyHPC
13 days ago

➀ The Berlin University of Applied Sciences (HTW Berlin) will host its 10th Engineering Informatics Day on November 4, 2025, offering a platform for students, academics, and industry representatives to discuss technological developments;

➁ The event includes keynote speeches on industry trends, student project presentations, networking opportunities, and recruitment sessions for internships and research partnerships;

➂ Highlighted activities feature a poster session for master's students to showcase their research and corporate presentations from participating companies.

EducationInformation technologyHPC
14 days ago

➀ The 2026 IEEE/JSAP Symposium in Honolulu calls for papers on VLSI innovations to advance AI, covering CMOS platforms, advanced packaging, AI accelerators, and memory technologies;

➁ Key deadlines include paper submissions by January 2026 and Late News submissions by March 2026, with technical sessions, workshops, and student awards featured;

➂ Outstanding papers may be published in IEEE journals, emphasizing the event’s role in bridging VLSI technology and AI applications.

AI3D ICHPC
14 days ago

➀ The article depicts a fictional CEO, Ed, leveraging his political position to manipulate AI investment markets through strategic gossip and high-frequency trading algorithms;

➁ Ed creates both optimistic narratives (e.g., government investments, AI breakthroughs) and pessimistic rumors (e.g., unprofitability, technical limitations) to induce market volatility;

➂ The plan aims to profit from trading volatility but risks unintended consequences in an already unstable AI-driven financial landscape.

AIHPCSoftware