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September 1
- China slams US revocation of VEU authorisation for Intel, Samsung and Hynix
➀ The U.S. revoked VEU authorization for Intel, Samsung, and SK Hynix's China-based manufacturing operations, impacting their ability to export certain tech items without individual licenses;
➀ China's Ministry of Commerce criticized the move as politically driven and accused the U.S. of weaponizing export controls to hinder China's semiconductor development;
➂ The ministry warned the decision undermines global semiconductor supply chain stability and reflects unilateral U.S. actions.
- Q2 NAND revenues up 22% QoQ
➀ Q2 NAND revenue of the top five suppliers surged 22% QoQ to $14.67 billion, driven by price recovery and market demand;
➁ Samsung led with $5.2 billion revenue (up 23.8% QoQ) and 32.9% market share, followed by SK Hynix ($3.34 billion, up 52.5% QoQ) and Kioxia ($2.14 billion);
➂ Micron and SanDisk also saw growth, reflecting broader industry recovery in NAND memory.
- Ed Finds An AI Wheeze
➀ The UK Education Secretary expresses concerns about students using AI to generate coursework, threatening academic integrity;
➀ Ed proposes reviving medieval assessment methods, including oral exams, supervised handwritten tests, and QAA-certified university standards to identify rigorous institutions;
➂ A controversial AI detection tool developed by a private company is suggested for adoption, despite its questionable accuracy, with potential financial incentives for stakeholders.
August 29
- Monolithic flat-packs for ‘origami’ robots
➀ Researchers at Pusan National University developed a monolithic flat-pack design using carbon fiber and aramid cloth with rigid and flexible regions for origami-like robots;
➀ The technique employs multi-resin deposition, achieving 6.95GPa stiffness in rigid sections and 0.66GPa flexibility in hinges, enabling complex motions;
➂ Potential applications include transformable robots, spacecraft solar panels, and foldable electronics substrates.
- When UWB Was An Infant
➀ In 2008, Pulse-Link showcased early commercial progress in UWB technology, shipping initial products and reference designs for wireless HDMI and co-ax applications;
➁ The company's UWB tech achieved 890Mbits/sec throughput with JPEG2000 compression, addressing most HDMI needs despite lower rates than full 10.2Gbits/sec HDMI;
➂ Strong market interest emerged, with 80 reference designs sold post-CES, highlighting UWB's potential in high-speed data transmission.
- Rose petals inspire better sweat sensor for sport
➀ Researchers at Waseda University developed a sweat sensor inspired by the hydrophilic/hydrophobic properties of rose petals to monitor electrolyte loss during exercise;
➁ The sensor uses ion-selective membranes with microtextured surfaces mimicking rose petals, enabling water retention, self-cleaning, and motion resilience without adhesives;
➂ A 3D-printed wearable prototype demonstrated accurate sodium monitoring in sweat during running tests, with a self-cleaning mechanism triggered by increased sweat volume.
- Z-Wave Alliance publishes updated Certified Product Guide
➀ The Z-Wave Alliance launched an updated searchable database of 4,500 certified smart home devices, covering categories like lighting, sensors, and Z-Wave Long Range (ZWLR) products;
➁ The guide allows filtering by brand, protocol version, and regional frequencies, emphasizing interoperability and security through mandatory certifications;
➂ Z-Wave Long Range devices are highlighted for quadrupling wireless range and supporting 10x more nodes, aligning with the alliance's mission to expand smart home adoption.
- Most Read – Chips Act money, Navitas Semi, Prophesee’s GenX320
➀ The U.S. Chips Act faces backlash as companies like TSMC threaten to reject subsidies if required to offer equity to the government;
➁ Chris Allexandre appointed as Navitas Semiconductor’s new CEO, succeeding founder Gene Sheridan;
➂ Qualcomm launches the Dragonwing Q-6690, the first mobile processor with integrated UHF RFID, and Prophesee introduces its GenX320 Starter Kit for Raspberry Pi 5, enabling neuromorphic vision applications.
- 5G SA finally takes off
➀ 2025年Q2全球移动核心网络（MCN）市场同比增长19%，其中5G领域增长31%，语音核心网络增长18%，全年增长率预期翻倍至10%；
➁ 5G SA部署加速，全球71家运营商已启动消费者5G SA服务，RedCap技术降低物联网设备成本，MEC边缘计算及动态网络切片技术提升性能，AI应用驱动核心网络需求；
➂ 中国运营商积极推广5G SA覆盖，华为、爱立信、诺基亚和中兴占据全球市场主导，公共云和混合云策略重新成为5G核心网部署的关键选项。
- Unsourced Random Access
➀ Researchers from Skoltech have published a monograph on "Unsourced Random Access," targeting efficient communication for millions of IoT devices in 5G Advanced/6G networks;
➁ The proposed method allows devices to connect without pre-coordination or identification, reducing delays and improving energy efficiency;
➂ The monograph integrates theoretical frameworks with practical implementations, supported by collaborations with MIT and other institutions under the Russian Science Foundation.
- Being A Good Guesser
➀ Predicting the semiconductor industry's future remains highly uncertain, as seen in NVIDIA outpacing Intel in revenue and market cap despite past expectations;
➁ Industry dynamics hinge on technological shifts (e.g., CMOS adoption) and strategic bets (e.g., IBM's 8088 choice), with misaligned trends leading to failures;
➂ Success requires balancing investments, management, and engineering while navigating unpredictable market demands—making 'good guessing' a crucial skill.
August 1
- 5G core network to grow 6%
➀ The global 5G Mobile Core Network (MCN) market is projected to grow at a 6% CAGR (2024-2029), driven by 5G Standalone (SA) adoption and AI-driven network capacity demands;
➀ The Multi-Access Edge Computing (MEC) market is expected to expand at 17% CAGR due to dynamic network slicing, RedCap devices, and GSMA Open Gateway APIs;
➂ AI advancements, including Agentic AI, are key to achieving L4 autonomous networking, potentially reducing operational costs for mobile operators, while 3G shutdowns spur IMS Core upgrades and 5G SA deployments expand globally.
- Infineon adds thermally optimised CoolSiC MOSFET
➀ Infineon launched the CoolSiC MOSFET 1200 V G2 in a top-side-cooled Q-DPAK package, targeting industrial applications like EV chargers and solar inverters;
➁ The new generation reduces switching losses by 25%, improves thermal resistance by over 15%, and supports operation up to 200°C junction temperature;
➂ Enhanced package design enables compact heat dissipation, minimized parasitic inductance, and compatibility with automated manufacturing for scalable solutions.
July 31
- Fable: The Scientist Who Slipped Away
➀ A renowned scientist abruptly leaves Vienna, sending farewell notes to friends;
➁ He departs on the Orient Express accompanied by Napoleon Bonaparte’s great-grandniece;
➂ The fable concludes with a moral: 'Give shit the slip when you can,' emphasizing the value of avoiding unnecessary conflict.
- Automotive UFS 4.1 flash memory up to 1Tbyte
❶ Kioxia introduces 128GB, 256GB, and 1TB UFS 4.1 embedded flash memory for automotive applications, supporting up to 115°C; 512GB version to follow.
❷ Compliant with AEC-Q100/104 Grade 2 standards, targeting infotainment, ADAS, telematics, and vehicle computers.
❸ Delivers 2.1x sequential read, 2.5x write, and up to 3.7x random write improvements over UFS 3.1.
- Photo-relay has 1.8kV output mosfets for 800V batteries
➀ Toshiba introduced the TLX9165T photoelectric relay with 1.8kV output MOSFETs, targeting 800V battery systems in electric vehicles;
➁ The device features back-to-back MOSFETs for bidirectional switching, ≤600Ω on-resistance (at 12mA/10mA), and an 8mm creepage-distance SO16 package compliant with automotive standards;
➂ It achieves 5kVrms isolation, meets AEC-Q101 and IEC 60664-1 certifications, and is designed for battery management and mechanical relay fault detection.
- Space-grade SMA connector-saver for satellite testing
➀ Cinch Connectivity Solutions launched the SQM-4733-MF-29M-02, a stainless steel space-grade SMA connector-saver supporting SMA, 3.5mm, and 2.92mm interfaces with 40GHz operation;
➁ Designed for space missions, it meets NASA out-gassing standards and is used for satellite thermo-vacuum testing, pre-flight evaluation, and multi-orbit platform development;
➂ Offers VSWR ≤1.2:1 up to 40GHz, operates in -65°C to +125°C, and is distributed via DigiKey and Mouser.
- Automotive decline hits Europe component market, says DMASS
➀ European semiconductor distribution sales fell 14% YoY in Q2 2025 due to automotive sector decline, with Austria (-36.6%), France (-20%), and Germany (-17%) hit hardest, while Iberia saw a 2.4% rise.
➁ Component categories varied widely: power and programmable logic sales dropped 21%, while sensors/actuators and discrete components grew. IP&E rose 1.43%, driven by circular connectors (+122.7%) and power supplies.
➂ DMASS cites geopolitical tensions and supply chain volatility as key challenges, urging Europe to prioritize nearshoring and AI/IoT innovation to counter industrial stagnation.
- Harwin strengthens Kontrol industrial connector range
➀ Harwin expanded its surface-mount 'Kontrol' industrial connector range by adding through-hole retention options, introducing 72 new parts designed for high-vibration environments;
➁ The new connectors offer twice the PCB retention force of SMT options, withstanding 20G vibration for 12 hours and 500 mating cycles;
➂ Featuring 1.27mm pitch, up to 40+40 pins, and 3Gbit/s data transmission, the connectors include shrouding, polarization, and location pegs for precision assembly.
- Samsung Q2 chip profit down 94%
➀ Samsung's Q2 chip profit plunged 94% YoY to $288 million, with sales of $20 billion, compared to $4.7 billion profit in Q2 2024;
➁ The company secured a $16.5 billion order from Tesla for its Texas fab and anticipates more large foundry orders, with plans to ramp up 2nm process production in H2;
➂ Samsung noted HBM3E oversupply affecting pricing and is sampling HBM4, targeting volume production in 2025.
- Arm’s FY begins with a record royalty quarter
➀ Arm's Q1 2026 revenue reached $1.05 billion, with royalty revenue up 25% year-over-year to $585 million, while licensing revenue dipped slightly to $468 million;
➁ Over 70,000 enterprises now use Arm Neoverse chips for AI workloads in data centers, powering platforms like NVIDIA Grace and AWS Graviton, with Arm projecting nearly 50% market share among hyperscalers this year;
➂ Arm launched Zena CSS, a compute subsystem for AI-driven automotive applications, accelerating vehicle development timelines by at least one year, with adoption by Tesla, Mercedes-Benz, and other major automakers.
- Socionext licenses ADAS IP from aiMotive
➀ Socionext licenses aiMotive's aiWare IP and tools to develop chiplet-based SoCs for automotive ADAS;
➁ The collaboration aims to accelerate AI adoption in automotive solutions, integrating energy-efficient neural network accelerators;
➂ Partnership focuses on mass production-ready Custom SoCs with SDK support, enhancing road safety and intelligence.
July 7
- Google invests in nuclear fusion, nuclear fission, geothermal and solar for datacentre electricity
➀ Google's datacentre electricity consumption surged to 30.8 million MWh in 2025, doubling since 2020, driving efforts to achieve carbon neutrality by 2030;
➁ Investments include 200MW from fusion startup Commonwealth Fusion Systems, 500MW from fission firm Kairos Power, geothermal projects with Fervo Energy, and 1,300MW solar energy procurement;
➂ Partnerships and $20B investments in carbon-free power plants aim to meet 95.8% of Google’s energy demand sustainably.
- Substrate market to be worth $31bn by 2030
➀ The substrate market is projected to reach $31 billion by 2030, driven by AI and HPC, with key technologies including Advanced IC Substrates (AICS), Glass Core Substrates (GCS), and Substrate-like PCBs (SLP);
➁ AICS rebounded to $14.2 billion in 2024, GCS is nearing commercialization via global investments, SLP shipments hit 392 million units (smartphone-led), and Embedded Die (ED) remains niche but critical for AI chip power delivery;
➂ Capacity expansion is driven by AI/HPC demand, CHIPS Act incentives, and Chinese investments, with Asia dominating production while U.S. and Europe lag but gain government support.
- Astrogazers school space club moves closer to CubeSat launch
➀ Croydon High School's Astrogazers space club completed final live testing of their CubeSat prototype aboard a research aircraft, supported by University of Bath engineers;
➁ The satellite successfully measured atmospheric air quality data during flight tests, with collaborative analysis involving ground and airborne measurements;
➂ Planned for 2026-27 launch, the project was funded by multiple institutions including Royal Society and backed by organizations like Surrey Space Centre, following the club's prior achievement of stratospheric weather balloon launches.
- Ed To Boost UK Semis
➀ Ed proposes leveraging the oversupply of mature semiconductor nodes to secure cost-effective fab capacity and establishes a fund to support UK semiconductor innovation;
➁ The initiative encourages UK designers and institutions to utilize AI-enabled EDA tools, potentially reducing chip design time by 30-50% and accelerating layout processes by 40-60%;
➂ A committee chaired by Ed will select projects under the scheme, positioning him as the gatekeeper for opportunities that may include personal incentives from applicants.
July 4
- Designer viruses may be used to produce logic
➀ Researchers at the 2011 Kavli Futures Symposium speculated that designer viruses could someday produce nano-scale logic components, such as 64-bit adders, for integration into chips;
➁ Professor David Awschalom envisioned multifunctional quantum systems combining logic, storage, and communication, potentially spanning biological, chemical, or solid-state platforms;
➂ The Kavli Foundation highlighted the potential of nanoscience for revolutionary applications in technology, medicine, and energy.
- Gadget Book: Designing Electronics That Work
➀ Introduces the book *Designing Electronics That Work*, a practical guide for designing and manufacturing electronics;
➁ Targets hobbyists, graduates, and professionals, aiming to save time and costs in the development process;
➂ Available exclusively to registered users, requiring a quick sign-up or login for access.
- Silanna signs Astute for Europe and India
➀ Silanna Semiconductor partners with Astute Group to distribute its configurable Plural ADCs in Europe and India;
➁ Plural ADCs feature 10-16-bit resolution, 20-250Msps rates, and reduce costs/supply risks through pre-configured SKUs;
➂ FirePower SL2002 laser driver integrates power/firing functions, enabling 100W+ pulses from 3V batteries for compact measurement systems.
- Phase-change heatsink for space
➀ University of Illinois researchers developed a phase-change heatsink (using paraffin wax) for satellites, enhancing thermal management in space where convection cooling is unavailable;
➁ The wax-filled heatsink absorbs peak heat through melting (170kJ/kg) and releases it via radiation, validated by CubeSat orbital tests showing gravity-independent performance;
➂ Simplified models were created for design optimization, with future studies to include solar heating effects during spacecraft orbits.