➀ Chip power density has doubled from 50-100 W/cm² in 2010 to 200 W/cm² in 2020, driving the need for advanced thermal management strategies;
➁ Four key approaches include circuit design optimization, liquid/cryogenic cooling, architectural innovations, and novel materials like diamond scaffolds and copper nanomesh;
➂ AI-powered thermal modeling and multi-physics simulations are becoming critical for data center efficiency and 3D-IC designs.