➀ A chip introduced in 1985 pioneered a new semiconductor category;

➁ Invented by a Zilog engineer through moonlighting at LSI Logic, leading to a startup's founding;

➂ The product's market surged to $12 billion, and the company was acquired for $50 billion—the largest semiconductor acquisition at the time.

➀ Effective dispersion of carbon nanotubes (CNTs) is crucial for their performance in energy storage and polymer composites, as agglomeration limits conductivity and mechanical benefits;

➁ Technical challenges include optimizing dispersion methods, balancing multifunctional properties, and integrating CNTs into industrial processes like battery slurries and composite materials;

➂ Commercial strategies focus on outsourcing dispersion to specialists (e.g., Toyocolor, NanoRial) or vertical integration by CNT suppliers (e.g., LG Chem, Cnano) to capture downstream value.

➀ Astute Group partners with UK-based Winslow Adaptics to tackle supply chain disruptions and long-term obsolescence in electronics;

➁ Winslow Adaptics provides custom adapters, interposers, and legacy system solutions for sectors like defense, aerospace, and automotive;

➂ The collaboration enhances access to engineering expertise, offering alternatives for obsolete components in high-reliability industries.

➀ TSMC's Q2 2025 profit surged 60.7% YoY to $12.8 billion, with revenue rising 44.4% YoY and 17.8% QoQ to $30 billion;

➁ Gross margin reached 58.6%, while 3nm/5nm/7nm technologies contributed 74% of total wafer revenue, dominated by 3nm (24%) and 5nm (36%) nodes;

➂ Advanced nodes (7nm and below) maintained strong adoption, reflecting TSMC's leadership in cutting-edge semiconductor manufacturing.

➀ Researchers developed the world's first comparator-free memory sorting chip using memristor-based PIM architecture and Tree Node Skipping algorithm;

➁ The system achieved 7.7× speed improvement and 160.4× energy efficiency compared to ASIC solutions, enabling real-time applications;

➂ Demonstrated versatility in path planning and AI acceleration, paving the way for next-gen edge computing and intelligent hardware.

➀ Littelfuse launched 5.0SMDJ-FB TVS diode series with foldback technology, reducing clamping voltage by up to 15% to protect sensitive DC power lines;

➁ Designed for data centers, AI servers, and industrial systems, it maintains power stability while handling 5000W peak pulse power;

➂ Features drop-in compatibility with legacy models and supports PoE, ICT equipment, and next-gen DC/DC converters.

➀ 2D materials address silicon's limitations by offering high carrier mobility and ultra-low power consumption at sub-nanometer scales, overcoming bottlenecks in traditional semiconductors;

➁ They enable flexible electronics, in-memory computing, and neuromorphic systems, powering applications like AI chips and IoT devices;

➂ Future integration with silicon and scalable manufacturing are critical to realizing their potential in next-gen high-density ICs and wearable tech.

➀ Panmnesia proposes a CXL-over-Xlink datacenter architecture combining GPU-optimized interconnects with CXL memory sharing, achieving 5.3x faster AI training and 6x lower inference latency versus PCIe/RDMA systems;

➁ Key enhancements include independent compute/memory scaling, dynamic resource pooling, hierarchical memory integration (HBM+CXL), and cascading CXL 3.1 switches for scalable low-latency fabrics;

➂ The architecture reduces communication overhead through accelerator-optimized links (sub-100ns latency) and enables petabyte-scale memory access for AI workloads, addressing bottlenecks in traditional GPU clusters.

➀ Edmund Optics offers off-the-shelf HOLO/OR Diffractive Diffusers and Beamsplitters for high-power laser systems, enabling precise beam shaping with high damage thresholds and uniform intensity distribution;

➁ The diffusers are optimal for applications like laser welding and medical treatment, while beamsplitters create uniform spot arrays for 3D sensing and industrial processes, supporting Nd:YAG and CO₂ wavelengths;

➂ With a Marketplace of 34,000+ products and Advanced Manufacturing division, Edmund Optics provides both ready-to-ship components and custom optical solutions, serving industries such as semiconductors, biomedical, and R&D.

➀ LG Innotek has launched an Automotive Application Processor Module (AP Module) aimed at the global automotive semiconductor market, marking its entry into automotive semiconductor components.

➁ The module integrates vehicle electronic systems, such as Advanced Driver Assistance Systems (ADAS) and digital cockpits, offering a compact design that improves system efficiency and control performance.

➂ LG Innotek plans to enhance the module's thermal management and is promoting it globally, with mass production expected in the second half of the year.

➀ TSMC held a capacity expansion ceremony at its 2nm fab in Kaohsiung to celebrate an early move to mass production.

➁ Mass production at the Kaohsiung fab and another in Hsinchu is expected to start in Q3, with a combined output forecast to generate $60 billion in revenue in Q3 and Q4.

➂ The two fabs have a maximum output of 80k wpm, with yields said to be 'well above' 60-70%. Initial clients include Apple, Nvidia, and Qualcomm.

➀ Bellezza's 2D graphene fusion process is being used for CMOS chip assembly, replacing copper with graphene.

➁ The process operates at temperatures below 400 degrees Celsius and as low as 200 degrees Celsius.

➂ This innovation aims to extend Moore's Law and eliminate copper circuits due to their limitations in size and electrical resistance.

➀ Micron confirms plans to raise memory prices due to strong demand for DRAM and NAND flash.

➁ The price hike is expected to continue through 2025 and 2026.

➂ Factors include supply constraints and growing demand from AI, data centers, and consumer electronics.

➀ Toray Engineering Co., Ltd. has developed the UC5000, a high-precision semiconductor packaging system for panel-level packaging (PLP), which is gaining popularity, especially for AI server applications.

➁ The UC5000 achieves chip packaging accuracy of ±0.8μm using thermal compression bonding (TCB) on large panels, supporting both silicon wafers and glass substrates.

➂ Key features include advanced TCB technology, high-accuracy packaging, and warp-correction transfer technology, addressing challenges such as warping and material expansion in glass panel processing.

➀ STMicroelectronics has introduced the STM32U3 microcontrollers with advanced power-saving features for IoT devices, enabling long-term operation with minimal maintenance and power usage.

➁ The STM32U3 series enhances IoT security with hardware protection, including secure storage of secret keys and factory-loaded attestation credentials.

➂ Key features include AI-driven voltage scaling, very low power consumption, high-performance peripherals, and support for operating in extreme temperature ranges.

➀ Texas Instruments (TI) has developed what it claims to be the 'first fully functional isolated modulators';

➁ These modulators, AMC0106M05, AMC0136, and AMC0106M25, offer increased precision and resolution for phase current sensing and DC voltage sensing;

➂ The modulators are designed to be compact, enabling more precise motor control in robotics designs.

➀ Researchers at Columbia University have successfully used DNA to create 3D electronic devices with nanoscale precision, which could significantly enhance computing power by transitioning from 2D to 3D architectures.

➁ This bottom-up approach, based on DNA origami, allows for self-assembly of DNA strands into precise nanostructures, offering a more efficient alternative to traditional top-down etching methods.

➂ The integration of electrodes and semiconductor materials like silicon oxide and tin oxide onto DNA-assembled structures demonstrates their potential application in future microchips, potentially revolutionizing semiconductor manufacturing.

21年前，在Globalpress 'Leading the Recovery'会议中，一个小组讨论了'何时会有量产的90nm SoC'的问题。

来自Cadence Design Systems的高级副总裁Ted Vucurevich表示，预计最早在2004年将出现基于90nm工艺的FPGA设计。

来自Synopsys的Anton Domic认为，到2004年，将会有非FPGA芯片在90nm工艺上实现量产。

台积电的Andrew Moore也提到，公司的发展路线图显示，90nm工艺将在2004年实现。

量产90nm设计面临的挑战包括预期良率问题、客户信心问题、验证问题和成本问题。

➀ Mazda and Rohm have signed a deal to develop GaN-based automotive power electronics.

➁ GaN can reduce power conversion losses and contribute to the miniaturisation of components through high-frequency operation.

➂ The collaboration aims to unveil a demonstration model within FY2025 and practical implementation for FY2027.

➀ The article discusses a 9.8-GHz wideband, low phase noise, continuous wave (CW) RF signal generator reference design by Texas Instruments (TI). The design uses a programmable clock generator to reduce spurs and optimize system complexity.

➁ Key components include the LMX2592 PLL, LMK61E2 programmable reference clock, and LP38798-ADJ linear regulator. The design can be controlled via a PC or microcontroller.

➂ The reference design is suitable for applications like test and measurement, wireless communications, military and aerospace, radar detection, and microwave backhaul. It offers excellent phase noise performance and low in-band spurious levels.