➀ An international research team led by Prof. Qing-Tai Zhao proposes that operating computer chips at cryogenic temperatures could reduce energy consumption by up to 80%, addressing the high energy demands of data centers and AI infrastructure;

➁ Cryogenic computing leverages the improved efficiency of transistors at low temperatures but faces challenges like material defects and quantum tunneling, requiring novel materials and architectures (e.g., gate-all-around nanowires, high-k dielectrics) to optimize CMOS technology;

➂ Applications span quantum computing, space exploration, and high-performance data centers, with TSMC actively developing chips tailored for cryogenic environments to enhance energy efficiency and integrate with quantum processors.

➀ Dyson launched the Pencilback Fluffycones, the industry's slimmest cordless vacuum cleaner, featuring a 38mm diameter and 1.8kg weight;

➁ It includes a 360-degree rotating brush to prevent hair tangling, edge-cleaning design, and green LED illumination for dust detection;

➂ Powered by a 28mm Hyperdimium motor spinning at 140,000 RPM, offering powerful suction and compact performance.

➀ MO Valve Company shifts focus to industrial solid-state devices up to 6000 Mc/s, prioritizing communication bandwidth over high-power applications;

➁ An export division is established, with microwave equipment attracting attention in Paris, aiming for a 40% export share including indirect quotas;

➂ The company abandons domestic market products (e.g., color TVs) and concentrates on industrial valves, thyratrons, and cathode ray tubes, affirming valves' continued relevance.

➀ A German-Dutch research team led by Helmholtz-Zentrum Dresden-Rossendorf (HZDR) discovered that hydrogen bubbles in electrolyzers contain electrolyte microdroplets, revealing internal flow dynamics for the first time;

➁ The study identified that gas bubbles merge and create microjets of electrolyte, forming droplet clouds that reduce efficiency by altering electrode contact and delaying bubble detachment;

➂ Findings, published in Nature Communications, provide insights into improving electrolyzer efficiency, with ongoing research funded by BMBF and NWO to address technical challenges.

➀ The Hochschule Heilbronn developed "MEXLEfirst," a mobile electronic lab that integrates a smartphone app to provide real-time feedback and guidance for electrical engineering students, bridging theoretical learning and practical application;

➀ The system, tested in mechatronics and robotics programs, uses modular components and a "Lab-in-a-Box" design to simplify circuit-building tasks, with plans to expand to schools and vocational training by 2026;

➁ Funded by the Stiftung Innovation in der Hochschullehre, the project aims to enhance accessibility for remote learning and industrial training, while fostering partnerships with educational and corporate institutions.

➀ Fraunhofer IAPT showcases collaborative robots ("Cobots") at automatica 2025, focusing on automating additive manufacturing and reducing labor demands;

➁ Cobots integrate additively manufactured tools and grippers, enabling flexible automation with complex geometries;

➂ Digital production solutions enhance process stability and scalability across conventional and additive manufacturing workflows.

➀ Researchers at the University of Bristol developed gallium nitride (GaN) radio frequency amplifiers, pushing performance boundaries to enable 6G wireless communication;

➁ The discovery of a latch-effect in GaN devices and the use of superlattice castellated field effect transistors (SLCFETs) significantly improved radio frequency capabilities in the W-band (75–110 GHz);

➂ This breakthrough could facilitate future technologies like real-time remote healthcare and self-driving cars through enhanced semiconductor reliability and power density.

➀ Silicon Labs introduces SiXG301 and SiXG302 SoC families under its Series 3 portfolio, built on a 22nm process for enhanced IoT device efficiency and performance;

➁ SiXG301 targets line-powered applications with support for Matter, Bluetooth, Zigbee, and Thread, while SiXG302 focuses on ultra-low power consumption for battery-operated devices;

➂ The solutions address diverse use cases including smart homes, cities, healthcare, and industrial systems with integrated security and scalability.

➀ Nuvoton Technology launched its 4th-gen Gerda HMI display ICs with advanced image processing, safety (ASIL-B), and cybersecurity (EVITA-Full HSM) for automotive applications;

➁ The ICs address visibility challenges in electronic mirrors via real-time "local contrast" adjustment and enhance security through trusted software booting and OTA updates;

➂ Designed for cost-sensitive vehicles like motorcycles and small mobility devices, the chips balance functionality with affordability for cluster meters, HUDs, and HVAC systems.

➀ Researchers from Autonomous University of Querétaro developed solar cells using non-toxic (Ca,Ba)ZrS₃ chalcogenide perovskite and spinel oxides (NiCo₂O₄, ZnCo₂O₄, etc.) as hole transport layers (HTLs), achieving over 34% power conversion efficiency (PCE).

➁ The SrFe₂O₄ spinel HTL demonstrated optimal performance with 34.24% PCE, low energy loss (~0.11 V), and high light absorption (~42%), attributed to improved band alignment and interface engineering.

➂ This eco-friendly, lead-free approach combines stability, scalability, and superior efficiency, positioning spinel-integrated solar cells as a promising solution for next-generation renewable energy systems.

➀ Ed proposes a £20 million UK government prize for developing reconfigurable AI chip prototypes to address AI progress bottlenecks;

➁ The UK leverages Arm’s low-power design expertise, university photonics, packaging technologies, and phase-change materials research;

➂ HMG plans funding for a collaborative research hub, imec access, and manufacturing partnerships, with Ed positioning himself in profit-generating oversight roles.

➀ LG Innotek has launched an Automotive Application Processor Module (AP Module) aimed at the global automotive semiconductor market, marking its entry into automotive semiconductor components.

➁ The module integrates vehicle electronic systems, such as Advanced Driver Assistance Systems (ADAS) and digital cockpits, offering a compact design that improves system efficiency and control performance.

➂ LG Innotek plans to enhance the module's thermal management and is promoting it globally, with mass production expected in the second half of the year.

➀ TSMC held a capacity expansion ceremony at its 2nm fab in Kaohsiung to celebrate an early move to mass production.

➁ Mass production at the Kaohsiung fab and another in Hsinchu is expected to start in Q3, with a combined output forecast to generate $60 billion in revenue in Q3 and Q4.

➂ The two fabs have a maximum output of 80k wpm, with yields said to be 'well above' 60-70%. Initial clients include Apple, Nvidia, and Qualcomm.

➀ Bellezza's 2D graphene fusion process is being used for CMOS chip assembly, replacing copper with graphene.

➁ The process operates at temperatures below 400 degrees Celsius and as low as 200 degrees Celsius.

➂ This innovation aims to extend Moore's Law and eliminate copper circuits due to their limitations in size and electrical resistance.

➀ Micron confirms plans to raise memory prices due to strong demand for DRAM and NAND flash.

➁ The price hike is expected to continue through 2025 and 2026.

➂ Factors include supply constraints and growing demand from AI, data centers, and consumer electronics.

➀ Toray Engineering Co., Ltd. has developed the UC5000, a high-precision semiconductor packaging system for panel-level packaging (PLP), which is gaining popularity, especially for AI server applications.

➁ The UC5000 achieves chip packaging accuracy of ±0.8μm using thermal compression bonding (TCB) on large panels, supporting both silicon wafers and glass substrates.

➂ Key features include advanced TCB technology, high-accuracy packaging, and warp-correction transfer technology, addressing challenges such as warping and material expansion in glass panel processing.

➀ STMicroelectronics has introduced the STM32U3 microcontrollers with advanced power-saving features for IoT devices, enabling long-term operation with minimal maintenance and power usage.

➁ The STM32U3 series enhances IoT security with hardware protection, including secure storage of secret keys and factory-loaded attestation credentials.

➂ Key features include AI-driven voltage scaling, very low power consumption, high-performance peripherals, and support for operating in extreme temperature ranges.

➀ Texas Instruments (TI) has developed what it claims to be the 'first fully functional isolated modulators';

➁ These modulators, AMC0106M05, AMC0136, and AMC0106M25, offer increased precision and resolution for phase current sensing and DC voltage sensing;

➂ The modulators are designed to be compact, enabling more precise motor control in robotics designs.

➀ Researchers at Columbia University have successfully used DNA to create 3D electronic devices with nanoscale precision, which could significantly enhance computing power by transitioning from 2D to 3D architectures.

➁ This bottom-up approach, based on DNA origami, allows for self-assembly of DNA strands into precise nanostructures, offering a more efficient alternative to traditional top-down etching methods.

➂ The integration of electrodes and semiconductor materials like silicon oxide and tin oxide onto DNA-assembled structures demonstrates their potential application in future microchips, potentially revolutionizing semiconductor manufacturing.

21年前，在Globalpress 'Leading the Recovery'会议中，一个小组讨论了'何时会有量产的90nm SoC'的问题。

来自Cadence Design Systems的高级副总裁Ted Vucurevich表示，预计最早在2004年将出现基于90nm工艺的FPGA设计。

来自Synopsys的Anton Domic认为，到2004年，将会有非FPGA芯片在90nm工艺上实现量产。

台积电的Andrew Moore也提到，公司的发展路线图显示，90nm工艺将在2004年实现。

量产90nm设计面临的挑战包括预期良率问题、客户信心问题、验证问题和成本问题。