➀ Fraunhofer ISI and IZM researchers forecast resource demand for 34 emerging technologies (e.g., electric vehicles, AI, data centers) by 2045, identifying critical materials like lithium and cobalt;

➁ Data centers and AI infrastructure are highlighted as major resource consumers, with exponential growth in data traffic posing supply chain risks;

➂ The study aims to inform Germany’s national resource strategy to mitigate supply bottlenecks and maintain industrial competitiveness amid geopolitical and environmental challenges

➀ Researchers at European XFEL demonstrated ultrafast control of ferroelectric material polarization using light pulses, decoupling it from lattice distortion for the first time;

➁ The breakthrough, achieved via high-energy laser and X-ray analysis, enables polarization changes in under a trillionth of a second, driven by photoexcited electrons;

➂ This paves the way for light-controlled, energy-efficient electronics with applications in data processing, sensing, and next-gen memory technologies.

➀ Fraunhofer IMM and Ki'tech collaborate to develop a disposable microfluidic patch for at-home potassium monitoring via interstitial fluid analysis;

➁ The solution targets dialysis patients to prevent hyperkalemia risks, offering real-time potassium level tracking via a smartphone app and wireless data transmission;

➂ Clinical trials are planned to validate the device, aiming to reduce hospital visits and empower patients with autonomous health management.

➀ Fraunhofer IDMT developed a car prototype with advanced acoustic sensors to enhance road safety for autonomous/semi-autonomous vehicles, enabling detection of sounds like sirens and children’s voices;

➁ The system uses AI algorithms for acoustic event recognition, integrates weather-resistant microphones, and offers driver monitoring via EEG/radar sensors and personalized in-car sound experiences;

➂ Funded by German institutions, the technology aims to improve autonomous driving by combining audio analysis with visual systems and will debut at IAA MOBILITY 2025.

➀ Q2 NAND revenue of the top five suppliers surged 22% QoQ to $14.67 billion, driven by price recovery and market demand;

➁ Samsung led with $5.2 billion revenue (up 23.8% QoQ) and 32.9% market share, followed by SK Hynix ($3.34 billion, up 52.5% QoQ) and Kioxia ($2.14 billion);

➂ Micron and SanDisk also saw growth, reflecting broader industry recovery in NAND memory.

➀ In 2008, Pulse-Link showcased early commercial progress in UWB technology, shipping initial products and reference designs for wireless HDMI and co-ax applications;

➁ The company's UWB tech achieved 890Mbits/sec throughput with JPEG2000 compression, addressing most HDMI needs despite lower rates than full 10.2Gbits/sec HDMI;

➂ Strong market interest emerged, with 80 reference designs sold post-CES, highlighting UWB's potential in high-speed data transmission.

➀ Intel received $5.7 billion from the U.S. government in exchange for a 10% stake to prevent the sale of its chip fab business;

➁ Struggling against TSMC and Samsung, Intel's foundry division faced a $13 billion loss in 2024, with potential plans to abandon 14A process development;

➂ The deal includes provisions to discourage majority stake sales, while SoftBank invests $2 billion, signaling confidence in government-backed Intel's stability.

➀ Researchers achieved record-high electronic quality in graphene using "proximity screening" with hexagonal boron nitride (hBN) layers, reducing charge fluctuations and achieving carrier mobility up to 5.7×10⁷ cm²/Vs;

➀ The ultrathin hBN-graphene heterostructure suppressed noise and enabled quantum phenomena like the quantum Hall effect, with potential applications in high-speed transistors and quantum technologies;

➂ The scalable fabrication method paves the way for disorder-free 2D material devices compatible with existing semiconductor processes.

➀ The U.S. Chips Act faces backlash as companies like TSMC threaten to reject subsidies if required to offer equity to the government;

➁ Chris Allexandre appointed as Navitas Semiconductor’s new CEO, succeeding founder Gene Sheridan;

➂ Qualcomm launches the Dragonwing Q-6690, the first mobile processor with integrated UHF RFID, and Prophesee introduces its GenX320 Starter Kit for Raspberry Pi 5, enabling neuromorphic vision applications.

➀ Infineon Technologies launched PSoC Control C3 Performance Line MCUs with Post-Quantum Cryptography compliance and PSA Level 3 certification, addressing quantum-era security threats;

➁ The MCUs integrate LMS for quantum-resistant firmware verification and hardware-accelerated SHA-2, while delivering enhanced real-time control for industrial applications like motor control and EV charging;

➂ Engineering samples will be available in late 2025, with mass production planned for 2026, offering hybrid ECC+PQC signing and scalability for power conversion and motor control systems.

➀ Researchers from Skoltech have published a monograph on "Unsourced Random Access," targeting efficient communication for millions of IoT devices in 5G Advanced/6G networks;

➁ The proposed method allows devices to connect without pre-coordination or identification, reducing delays and improving energy efficiency;

➂ The monograph integrates theoretical frameworks with practical implementations, supported by collaborations with MIT and other institutions under the Russian Science Foundation.

➀ Predicting the semiconductor industry's future remains highly uncertain, as seen in NVIDIA outpacing Intel in revenue and market cap despite past expectations;

➁ Industry dynamics hinge on technological shifts (e.g., CMOS adoption) and strategic bets (e.g., IBM's 8088 choice), with misaligned trends leading to failures;

➂ Success requires balancing investments, management, and engineering while navigating unpredictable market demands—making 'good guessing' a crucial skill.

➀ Global semiconductor sales reached $179.7 billion in Q2 2025, marking a 7.8% increase compared to Q1;

➁ June 2025 sales rose to $59.9 billion, up 19.6% year-over-year and 1.5% month-over-month;

➂ The growth reflects strong market recovery and demand across sectors like automotive and high-performance computing (HPC).

➀ Horizon Microtechnologies' 3D-printed components passed critical outgassing tests under the ECSS-Q-ST-70-02C standard, enabling their use in spacecraft manufacturing;

➀ The International Space Station (ISS) has successfully tested 3D printing in microgravity using low-temperature plastics;

➂ Specialized coating technology addresses material volatility, opening new possibilities for on-demand part fabrication in space.

➀ The HiQ-CARB project developed sustainable conductive additives (carbon nanotubes and bio-based acetylene black) to reduce CO₂ emissions in lithium-ion batteries, replacing fossil-based materials;

➁ The additives improved battery performance, reduced material usage, and were validated in production by partners like Fraunhofer ISC and CustomCells, enabling lighter and more cost-effective batteries;

➂ Life cycle analysis confirmed a 50% lower CO₂ footprint compared to conventional methods, supporting Europe's transition to eco-friendly battery manufacturing and electric mobility.

➀ The article introduces a compact FM radio designed to fit inside an earbud, using the RDA5807M IC for preset frequency tuning and volume control;

➀ The device can function as a basic single-channel FM radio or a long-range spy receiver when paired with a transmitter;

➂ The project involves programming the IC, assembling components (battery, speaker, and module) into an AirPods-style case, with future plans to integrate a microcontroller for advanced control.

➀ Indium Corporation introduced WS-910, a water-soluble flip-chip flux designed for next-gen semiconductor packaging to address complex assembly challenges;

➁ The flux enables residue-free cleaning with room-temperature deionized water and maintains stability for large dies during reflow processes;

➂ It supports Pb-free applications, high-Sn solders, and high-I/O designs, offering compatibility with various ultrafiltration systems.

➀ Fraunhofer IIS and IWES developed an acoustic sensor system with a specialized chip to remotely detect rotor blade damage in wind turbines, reducing costly inspections.

➁ The chip captures structural sound anomalies, transmits minimal data via mobile networks, and enables real-time monitoring, optimizing maintenance for offshore wind farms.

➂ Future upgrades aim to detect lightning strikes, enhancing reliability and supporting the energy transition through improved turbine durability.

➀ Fraunhofer IIS and IWES developed a chip-based acoustic sensor system to remotely monitor internal damages (e.g., cracks) in wind turbine blades, reducing costly offshore maintenance;

➁ The solution captures structural sound waves via body sensors, identifies damage-specific acoustic patterns, and transmits only critical data via mobile networks for low-bandwidth efficiency;

➂ The ongoing project expands the system to detect lightning strikes, building on prior prototypes to enhance offshore wind farm reliability and optimize maintenance.

➀ Small Modular Reactors (SMRs) provide compact, scalable nuclear energy solutions with over 90% capacity factor, ideal for replacing fossil fuels and supporting renewables;

➁ SMRs feature modular designs, passive safety mechanisms, and applications in desalination and hydrogen production, with significantly reduced emergency planning zones;

➂ Digital systems and AI-driven tools enhance monitoring and safety, while a projected $300 billion market by 2040 highlights their role in the clean energy transition.