<p>➀ Toray Engineering Co., Ltd. has developed the UC5000, a high-precision semiconductor packaging system for panel-level packaging (PLP), which is gaining popularity, especially for AI server applications.</p><p>➁ The UC5000 achieves chip packaging accuracy of ±0.8μm using thermal compression bonding (TCB) on large panels, supporting both silicon wafers and glass substrates.</p><p>➂ Key features include advanced TCB technology, high-accuracy packaging, and warp-correction transfer technology, addressing challenges such as warping and material expansion in glass panel processing.</p>