1. MIT and NUS researchers developed Super-Diamondene, a 2D material combining diamond and graphene, potentially replacing silicon in semiconductors; 2. The material demonstrates 10x higher energy efficiency and 5x faster electron mobility, with applications in AI and climate solutions; 3. Commercialization requires 10-20 years for manufacturing process optimization and industry adoption.
Recent #Chip Technology news in the semiconductor industry
21年前，在Globalpress 'Leading the Recovery'会议中，一个小组讨论了'何时会有量产的90nm SoC'的问题。
来自Cadence Design Systems的高级副总裁Ted Vucurevich表示，预计最早在2004年将出现基于90nm工艺的FPGA设计。
来自Synopsys的Anton Domic认为，到2004年，将会有非FPGA芯片在90nm工艺上实现量产。
台积电的Andrew Moore也提到，公司的发展路线图显示，90nm工艺将在2004年实现。
量产90nm设计面临的挑战包括预期良率问题、客户信心问题、验证问题和成本问题。
➀ China plans to release guidelines encouraging the national use of RISC-V-based chips, according to a Reuters report.
➁ The RISC-V architecture is attractive due to its openness, allowing anyone to freely obtain, learn, modify, and extend it.
➂ RISC-V has been embraced by global companies like Alibaba, Qualcomm, and NVIDIA, contributing to its rapid development.
➀ IBM and GloFo have settled their lawsuit over intellectual property and are exploring future cooperation; ➁ The lawsuit stemmed from IBM's transfer of its semiconductor unit to GloFo and subsequent technology transfers; ➂ GloFo accused IBM of transferring IP and trade secrets to Rapidus and Intel, and of attempting to attract technical staff.
➀ A new study shows that using 'chaotic edges' can greatly simplify electronic chips, as chaotic edges can amplify signals and act as superconductors, reducing the need for separate amplifiers and lowering power consumption.
➁ Researchers have discovered how 'chaotic edges' help electronic chips overcome signal loss, making them simpler and more efficient.
➂ By using metal lines on semi-stable materials, this method allows long metal lines to act like superconductors and amplify signals, potentially changing chip design by eliminating the need for transistor amplifiers and reducing power consumption.
➀ Momenta's 'two legs walking' strategy, focusing on both high-end and mid-range markets, and its recent impact on the industry; ➁ The competition between Momenta and DJI Zuyu in the mid-range autonomous driving market, with Momenta's adoption of the new Qualcomm 8620P chip; ➂ The challenges Momenta faces in the mid-range market, including limited experience and the competition with established players like DJI Zuyu; ➃ The evaluation of the new Qualcomm 8620P chip by industry experts, highlighting its potential and limitations.
➀ The top three wafer fabs, Intel, Samsung, and TSMC, are making key moves to attract more orders for future generations of chip technology and improve performance and reduce delivery times for custom designs; ➁ The three giants are heading in the same direction, adopting 3D transistors and packaging, a series of enabling and scalable technologies, and larger, more diverse ecosystems, but there are significant differences in methodology, architecture, and third-party support; ➂ The expansion of transistors is expected to last at least until the 18/16/14nm range, possibly starting with nanosheet and forksheet FETs and eventually leading to complementary FETs (CFETs).
1. Applied Materials introduces new materials and processes to scale copper wiring to 2nm and beyond, reducing resistance by 25%. 2. The company's innovations include a binary metal liner of ruthenium and cobalt (RuCo) and an enhanced low-k dielectric material, Black Diamond, for improved chip performance and 3D stacking. 3. These advancements are crucial for energy-efficient computing systems, especially in the AI era, and will continue to be developed and explored for future semiconductor technology.