Recent #Collaboration news in the semiconductor industry
Fraunhofer HHI and NICT launch the Optical Testbed Dataspace (OTDS) to accelerate the development and testing of AI and ML models for optical networks. The platform fosters global collaboration by securely sharing testbed data, addressing challenges in dataset availability and enhancing network optimization and automation.
OTDS uses the Eclipse Dataspace Components Connector (EDCC) and aligns with the International Data Spaces Association (IDSA) principles, ensuring data sovereignty and export control compliance.
The technology has been successfully demonstrated through a prototype for international data exchange between Berlin and Sendai, and is set to be showcased at the OFC conference.
➀ RANsemi, a British wireless semiconductor innovator, announced a strategic partnership with ACES, a leading Saudi Arabian neutral host operator, specializing in 5G Open RAN baseband technologies.
➁ The partnership is supported by the Saudi Arabian National Technology Development Programme (NTDP) and aims to advance 5G Open RAN and small cell technologies.
➂ The project aims to develop a class-leading 5G Open RAN neutral host small cell system, combining RANsemi's 5G baseband expertise with ACES' RF design capabilities.
➀ Cadence has officially joined the Intel Foundry Accelerator Design Services Alliance;
➁ This collaboration aims to drive innovation and support advanced chip design;
➂ The alliance aims to solidify Intel Foundry's leadership in cutting-edge semiconductor solutions.
➀ The Hochschule Heilbronn (HHN) and OPTIMA pharma GmbH have entered into a comprehensive cooperation agreement.
➁ The partnership aims to advance the connection between science and medium-sized industry in the region and address the skilled labor shortage.
➂ A new degree program in 'Artificial Intelligence and Industrial Digitalization' is to meet the specific needs of the industry.