➀ AMD's Ryzen 7 9800X3D gaming CPU drops to $449 at Amazon, offering the best 8-core gaming performance;

➁ The processor utilizes 3D V-Cache technology and improved thermal design, delivering 8% performance gains over its predecessor;

➂ Dominates Intel in 1080p gaming benchmarks, especially in esports titles like CS2 and Valorant.

➀ AMD's Ryzen 7 9800X3D, dubbed the 'best gaming CPU,' hits a historic low price of £399 at Amazon UK;

➁ The processor leverages 3D V-Cache technology for superior gaming performance, excelling in esports and 1080p resolution with 8% gains over the previous generation;

➂ Thermal design improvements and unlocked overclocking capabilities make it a top choice for high-performance gaming builds.

➀ Codasip, a RISC-V architecture developer, is actively seeking buyers for either the entire company or specific divisions, aiming to finalize the sale within three months starting from July 1st;

➁ The company highlights €119 million in pending EU and national grants/equity funding, with potential follow-on phases totaling €210 million and additional consortium-backed financing up to €51 million;

➂ With annual revenues around $89 million and a workforce dominated by hardware (57%) and software (30%) engineers, Codasip faces challenges in disrupting entrenched CPU architectures like x86 and ARM in competitive markets.

➀ AMD Ryzen 9 9950X3D, a 16-core/32-thread gaming CPU, is now available at $669 with a $50 discount on Amazon or bundled with a free MSI AIO cooler (valued at $109) at Newegg;

➁ Featuring Zen 5 X3D architecture, 5.7GHz boost clock, and integrated Radeon graphics, it earned Tom's Hardware's 'Editor's Choice' award for exceptional performance;

➂ Limited-time deals make this high-end processor more accessible for gamers and power users.

➀ Intel initiates massive layoffs in California, cutting chip design engineers and automotive division;

➁ 107 employees at Santa Clara HQ affected with up to 9 weeks compensation;

➂ Restructuring aims to save $1.5 billion, refocusing on core CPU/GPU and data center businesses

➀ Jiushark launches JF15K Diamond, a budget-friendly CPU air cooler with dual-tower heatsinks and four 100mm PWM fans, supporting up to 280W TDP;

➁ The 153mm-height cooler offers wide compatibility for motherboards and memory modules, featuring ARGB lighting in black/white variants;

➂ Priced at 260–280 Yuan ($36–39), it targets the mid-range cooling market with a focus on cost-effective thermal performance.

➀ AMD continues to expand its lineup of gaming processors with 3D V-Cache;

➁ Ryzen 5 9600X3D is referenced in Radeon driver notes;

➂ Possible specifications based on Ryzen 5 9600X;

➃ Comparison with Ryzen 9 9900X3D and Ryzen 7 9800X3D;

➄ Pricing and release details awaited.

① AMD confirms the upcoming Ryzen 5 9600X3D, a budget-friendly gaming CPU with 3D V-Cache, expanding its X3D lineup.

② Expected specs: 6 cores, 12 threads, 5.2 GHz boost, and 96MB L3 cache via stacked 3D V-Cache technology.

③ Planned release between late Q3 and early Q4 2025, prioritizing system integrators before DIY market availability.

➀ Chinese Academy of Sciences unveils QiMeng, an AI-driven open-source platform for automated chip design, producing CPUs comparable to Intel 486 and Arm Cortex A53.

➁ The system reportedly accelerates chip design from weeks to days, integrating LLM-based architecture optimization and software/hardware co-design tools.

➂ Developed amid U.S. tech sanctions, QiMeng reflects China's strategic push for semiconductor independence, though current prototypes lag behind modern standards.

① AMD launched the EPYC 4005 Series processors to address the server needs of SMBs and IT service providers, offering enterprise-level performance with cost efficiency;

② Built on the AM5 socket, these processors support PCIe 5.0, DDR5, and outperform Intel’s 6th Gen Xeon 6300P by up to 1.83x in benchmarks;

③ Partners like Lenovo and Supermicro highlight their energy efficiency and scalability for modern IT infrastructure and AI readiness.

➀ Intel launches new Arc graphics driver 32.0.101.6874 for Core Ultra 200V devices, promising up to 10% higher average FPS and 25% 99th percentile improvements in gaming performance.

➀ The driver increases iGPU memory allocation to 57% (up from 50%), enabling 9.12GB VRAM on 16GB systems, while addressing bugs across games and applications.

➂ This follows Intel's trend of software-driven optimizations, with future updates expected for next-gen Celestial (Xe3) GPUs in Panther Lake CPUs.

➀ The Minisforum MS-A2 is an AMD Ryzen-based upgrade to the popular Intel MS-01, featuring dual 10GbE SFP+ and 2.5GbE ports for homelab use;

➁ It supports up to 128GB non-ECC RAM and partially works with 96GB ECC RAM, addressing prior hardware limitations like problematic SSD configurations;

➂ The compact 1.7L chassis includes mixed NIC vendors (Intel and Realtek) and lacks clear port labeling, but offers PCIe expansion and improved thermal design for multi-node setups.

➀ Aaeon introduces the EPIC-RPS7, a compact 115x165mm industrial PC board supporting 14th gen Intel Core CPUs (up to 65W) and DDR5 memory for space-constrained smart manufacturing applications;

➁ The board features dual Ethernet ports (2.5Gbps and 1Gbps), USB 3.2/2.0, RS-232/422/485 interfaces, and supports up to three displays via DP, VGA, and LVDS;

➂ Designed for 0-60°C operation, it includes M.2 slots for NVMe storage and Wi-Fi modules, with power input options of 12V/22A or 19-24V.

➀ AMD unveils Zen 5-based Threadripper Pro 9000 WX and non-Pro CPUs, featuring up to 96 cores and 192 threads in flagship models;

➁ Zen 5 architecture delivers 22% performance gains, DDR5-6400 memory support, with up to 2.2X rendering speed over Intel Xeon-W;

➂ sTR5 socket compatibility maintained, estimated July 2025 availability starting at $1,400 for HEDT models.

➀ Qualcomm announced at Computex 2025 its plans to enter the server market with new data center CPUs and AI inference accelerators, focusing on energy efficiency as a key differentiator;

➁ The upcoming hardware includes a server-grade CPU compatible with NVIDIA's NVLink Fusion, indicating collaboration in heterogeneous computing architectures;

➂ This move expands Qualcomm's reach beyond client devices, leveraging its Nuvia-acquired expertise to challenge Intel and AMD in the lucrative data center sector.

➀ Intel showcased fully functional Panther Lake Core Ultra 300 laptop chips at Computex 2025, powered by the groundbreaking 18A process, slated for early 2026 release;

➁ Demonstrated AI workloads including live Python game coding with Clippy AI model and Da Vinci video editing with real-time AI effects, though specific metrics remain under wraps;

➂ Revealed advanced packaging with CPU/GPU/SoC tiles and hinted at Xe3 iGPU architecture positioning between Lunar/Arrow Lake, signaling Intel's multi-die integration maturity.