➀ Intel received $5.7 billion from the U.S. government in exchange for a 10% stake to prevent the sale of its chip fab business;

➁ Struggling against TSMC and Samsung, Intel's foundry division faced a $13 billion loss in 2024, with potential plans to abandon 14A process development;

➂ The deal includes provisions to discourage majority stake sales, while SoftBank invests $2 billion, signaling confidence in government-backed Intel's stability.

➀ Researchers achieved record-high electronic quality in graphene using "proximity screening" with hexagonal boron nitride (hBN) layers, reducing charge fluctuations and achieving carrier mobility up to 5.7×10⁷ cm²/Vs;

➀ The ultrathin hBN-graphene heterostructure suppressed noise and enabled quantum phenomena like the quantum Hall effect, with potential applications in high-speed transistors and quantum technologies;

➂ The scalable fabrication method paves the way for disorder-free 2D material devices compatible with existing semiconductor processes.

➀ Neuromorphic computing addresses the limitations of von Neumann architectures by mimicking the brain's parallel processing for energy-efficient AI tasks like computer vision and autonomous systems;

➀ Key innovations include synaptic plasticity integration and in-memory computing using technologies like ReRAM, enabling real-time learning and reduced power consumption;

➂ Emerging quantum tunneling advancements could further enhance computational intelligence in next-gen neuromorphic hardware.

➀ Socionext licenses aiMotive's aiWare IP and tools to develop chiplet-based SoCs for automotive ADAS;

➁ The collaboration aims to accelerate AI adoption in automotive solutions, integrating energy-efficient neural network accelerators;

➂ Partnership focuses on mass production-ready Custom SoCs with SDK support, enhancing road safety and intelligence.

➀ Elon Musk's xAI is acquiring an overseas power plant to ship to the U.S. for a data center housing 1 million AI GPUs, requiring up to 2 GW of power (equivalent to 1.9 million homes).

➁ Current xAI Colossus supercomputer uses 200,000 NVIDIA H100 GPUs and 300 MW of power, relying on gas turbines and Tesla Megapacks for energy stability.

➂ The AI industry's energy demands are escalating rapidly, with companies prioritizing dedicated power infrastructure over grid reliance, despite environmental and logistical challenges.

➀ Researchers developed a self-powered temperature sensor using a flexible ionic elastomer combining thermoplastic polyurethane (TPU) and ionic liquids, eliminating the need for external power;

➁ The sensor leverages triboelectric effects from temperature-induced microstructural changes, generating voltage signals that correlate with heat levels, achieving rapid and reversible responses;

➂ Potential applications include wearable electronics for real-time thermal monitoring, with future plans to optimize performance and integrate with AI systems for advanced signal analysis.

➀ Arteris won the 'AI Engineering Innovation Award' at the 2025 AI Breakthrough Awards for its system IP technology;

➁ The company was recognized for accelerating AI chip design and SoC creation to meet growing compute demands;

➂ This award highlights Arteris' leadership in enabling AI hardware advancements through interconnect solutions.

➀ The 75th ECTC highlighted three key packaging themes: Co-Packaged Optics (CPO) integration, Hybrid Bonding (HB) advancements, and thermal management for Backside Power Delivery (BPD).;

➁ CPO discussions emphasized materials innovation (e.g., glass substrates) to address thermal and optical challenges in AI chiplets, while HB sessions focused on scaling density, reducing defects, and integrating metrology for memory/3D IC applications;

➂ BPD thermal solutions explored interlayer cooling, multi-level modeling, and novel structures like microchannels to tackle heat dissipation in 3D architectures.

➀ The BMFTR-funded SPINNING project demonstrated a diamond spin-photon quantum computer with 12 qubits, showcasing superior coherence times (over 10 ms) and lower error rates (<0.5%) compared to superconducting IBM models (Eagle, Heron);

➀ Photonic coupling over 20 meters enabled scalable, distributed quantum registers with high fidelity (over 0.9), offering flexible integration with classical computing systems;

➂ The project involved collaboration among 28 entities, advancing diamond material processing, qubit fabrication, and AI-driven quantum applications, funded with €16.1 million by the German government.

➀ AWS's custom Trainium and Graviton chips gain momentum in AI infrastructure, challenging Nvidia's dominance;

➁ Increased adoption driven by cost efficiency and performance optimization tailored for cloud workloads;

➂ AWS reinforces its silicon strategy with enhanced software stacks and developer ecosystems to attract enterprise clients

➀ PCI-SIG released PCIe 7.0 specifications, delivering 128 GT/s raw bit rate and up to 512GB/s bidirectional bandwidth in x16 slots using PAM4 signaling and flit-based encoding;

➁ A new optical PCIe interconnect solution (PCIe 6.4/7.0) was introduced, enabling extended reach and multiplexing for applications like NVMe storage pools and CXL memory shelves in hyperscale AI data centers;

➂ PCIe Gen8 development is already underway, with adoption expected to accelerate in high-performance computing and AI-driven infrastructure.

➀ SiMa.ai and Enclustra co-developed a System-on-Module (SoM) using MLSoC Modalix 50 TOPS chip for edge AI applications;

➁ The solution reduces development costs and time, supports Gen AI and multi-modal AI in robotics/drones with Python/PyTorch compatibility;

➂ Features 50 TOPS performance, multiple I/O options, compact form factor, and industrial-grade thermal management.

➀ Tesla developed a groundbreaking 'Stress' tool to detect defective cores in its wafer-scale Dojo processors, critical for preventing silent data corruption that could invalidate weeks of AI training;

➁ Each Dojo 'Training Tile' contains 8,850 RISC-V cores and leverages TSMC's InFO_SoW packaging, with Stress enabling real-time monitoring across millions of cores without downtime;

➂ The method not only identifies faulty cores but also exposed rare design flaws, positioning Tesla alongside Google and Meta in hardware reliability while shaping future wafer-scale chip adoption.

➀ AMD acquires Untether AI's entire engineering team in a non-traditional talent acquisition, leading to the discontinuation of Untether's AI inference products;

➁ The move enhances AMD's capabilities in AI compilers, SoC design, and energy-efficient inference solutions to challenge Nvidia;

➂ Industry analysts suggest this signals a strategic shift toward AI inference optimization as GPU-driven training demand plateaus.

➀ ROHM launches first standalone AI MCUs with on-device learning and inference capabilities, eliminating cloud dependency;

➀ Utilizes proprietary Solist-AI for real-time anomaly detection in industrial devices, reducing downtime and maintenance costs;

➂ Features 1,000x faster AI processing and low power consumption, supported by developer tools for seamless integration.

➀ NVIDIA is developing a Blackwell-based B30 AI chip for China with multi-GPU scaling, potentially using NVLink or PCIe 6.0 ConnectX-8 SuperNICs;

➁ The U.S. export ban on H20 chips impacted NVIDIA and AMD, with AMD facing $800 million losses from MI308 ban;

➂ Jensen Huang warned that U.S. export controls risk driving Chinese rivals like Huawei to innovate and set future global standards.

➀ AMD launches affordable Strix Halo variants including 8-core Ryzen AI Max 385, targeting mainstream laptops;

➁ Geekbench scores show lower performance than flagship Max+ 395, though variables like power settings may affect results;

➂ HP ZBook Ultra G1a and Framework Desktop adopt the new APU, priced from $2,599 with shipments starting June 2025.

➀ NVIDIA develops 800V HVDC architecture to support 1 MW server racks by 2027, addressing existing 54V DC system limitations;

➀ Current 54V DC systems struggle beyond 200kW, requiring impractical copper quantities for gigawatt data centers;

➂ New 800V HVDC integrates with 13.8kV AC sources, reduces copper use by 45%, and eliminates inefficient AC-DC conversions.

➀ U.S. semiconductor sanctions aimed at curbing China's growth may inadvertently boost its domestic industry, fostering a resilient ecosystem;

➀ Taiwanese IC substrate firms face divergent outcomes: Unimicron struggles with sanctions, while Zhen Ding thrives via a 'China for China' strategy;

➂ Nvidia CEO Jensen Huang criticizes U.S. export bans as ineffective, noting Chinese competitors gain ground due to restricted access to advanced chips.

➀ Ed proposes a £20 million UK government prize for developing reconfigurable AI chip prototypes to address AI progress bottlenecks;

➁ The UK leverages Arm’s low-power design expertise, university photonics, packaging technologies, and phase-change materials research;

➂ HMG plans funding for a collaborative research hub, imec access, and manufacturing partnerships, with Ed positioning himself in profit-generating oversight roles.