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August 5
- Global Semiconductor Sales Increase 7.8% from Q1 to Q2; Month-to-Month Sales Tick Up 1.5% in June
➀ Global semiconductor sales reached $179.7 billion in Q2 2025, marking a 7.8% increase compared to Q1;
➁ June 2025 sales rose to $59.9 billion, up 19.6% year-over-year and 1.5% month-over-month;
➂ The growth reflects strong market recovery and demand across sectors like automotive and high-performance computing (HPC).
July 31
- Creonic Releases DVB-S2X Demodulator Version 6.0 with Increased Bitwidth and Annex M Support
➀ Creonic GmbH launches Version 6.0 of its DVB-S2X Demodulator IP core, enhancing configurability and technical performance;
➁ Key updates include expanded bitwidth and Annex M support for satellite communication applications;
➂ Strengthens Creonic's position as a leader in advanced communications IP solutions.
June 27
- VeriSilicon Expands DSP Portfolio with Silicon-Proven ZSP5000 Vision Core Series for Edge Intelligence
➀ VeriSilicon launched ZSP5000 DSP series IPs based on fifth-generation architecture for computer vision and embedded AI;
➁ The series features scalable, energy-efficient design targeting edge intelligence devices;
➂ Combined with AI software ecosystem partnerships, it enhances efficiency in automotive/industrial edge computing.
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
➀ Arteris won the 'AI Engineering Innovation Award' at the 2025 AI Breakthrough Awards for its system IP technology;
➁ The company was recognized for accelerating AI chip design and SoC creation to meet growing compute demands;
➂ This award highlights Arteris' leadership in enabling AI hardware advancements through interconnect solutions.
June 26
- Sofics Delivers Remarkable PPA & R Performance Near Physical Limits on TSMC 2nm Technology
➀ Sofics announces silicon validation of its IP on TSMC's 2nm technology, achieving exceptional power, performance, and area (PPA) metrics near physical limits;
➁ The IP focuses on built-in robustness for advanced integrated circuits, addressing demanding requirements in next-generation semiconductor designs;
➂ Implementation leverages TSMC's nanosheet transistor architecture, positioning the technology for cutting-edge applications.
June 20
- AWS Chips Away at Nvidia’s Lead with Rising Demand for Custom AI Processors
➀ AWS's custom Trainium and Graviton chips gain momentum in AI infrastructure, challenging Nvidia's dominance;
➁ Increased adoption driven by cost efficiency and performance optimization tailored for cloud workloads;
➂ AWS reinforces its silicon strategy with enhanced software stacks and developer ecosystems to attract enterprise clients
- CAST Launches Multi-Channel DMA IP Core Ideal for Streaming Applications
➀ CAST introduces the MC-SDMA Multi-Channel Streaming DMA IP core to reduce the CPU's workload by managing data transfers between system memory and peripherals;
➁ The IP core supports multiple channels and streaming interfaces, improving efficiency and system performance for resource-intensive applications;
➂ Designed for real-time systems and complex SoC designs, it offloads data transfer tasks to enhance overall processing capabilities.
June 17
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
➀ Cadence expands collaboration with Samsung Foundry, signing multi-year IP agreement to develop memory/interface IP for SF4X, SF5A and SF2P nodes;
➁ Utilizes AI-driven design tools to optimize performance, power and area for complex 3D-IC and chiplet systems;
➂ Targets next-gen applications in AI data centers, automotive electronics and connectivity solutions.
June 10
- VeriSilicon’s Ultra-Low Energy NPU Provides Over 40 TOPS for On-Device LLM Inference in Mobile Applications
➀ VeriSilicon's NPU IP achieves >40 TOPS for on-device LLM inference;
➁ Targets mobile applications with optimized energy efficiency;
➂ Addresses growing demand for generative AI in edge devices
June 2
- LEADING ASIC SUPPLIER ICSENSE ACHIEVES RECORD REVENUE
➀ ICsense, Europe's leading IC design company, reported record revenue exceeding €20 million for the fiscal year ending March 31, driven by strong ASIC sales and operational efficiency;
➁ The company achieved double-digit operational profit growth, attributed to successful project execution and recurring revenue from ASIC products;
➂ ICsense emphasized its focus on expanding ASIC solutions in automotive, medical, and industrial markets while increasing R&D investments for future growth.
May 30
- Samsung’s 3nm Setback: Tech Giants Shift to TSMC Amid Yield Struggles
➀ Samsung's 3nm chip yields remain at ~50% after three years of mass production, per South Korean reports;
➁ Major tech clients like NVIDIA and Qualcomm are shifting orders to TSMC due to Samsung's yield challenges;
➂ Samsung continues investing to improve 3nm technology amid intense competition in advanced semiconductor nodes.
- Nvidia and AMD to Launch Downgraded AI GPUs in China Amid Tightened U.S. Restrictions
➀ NVIDIA and AMD plan to launch scaled-back AI GPUs for China in Q3 2025, complying with U.S. export restrictions;
➁ These GPUs are tailored to support Chinese AI frameworks like DeepSeek while adhering to new regulations;
➂ The move reflects efforts to maintain market presence amid geopolitical trade constraints.
May 28
- TSMC to Launch First European Design Center in Munich by Q3 2025
➀ TSMC's first European Design Center in Munich is set to launch in Q3 2025;
➁ Focuses on developing high-density, high-performance, and energy-efficient chips for automotive and industrial applications;
➂ The center will offer design support and collaborate with ecosystem partners to strengthen TSMC's presence in Europe's semiconductor market.
- Brite Semiconductor Releases TCAM IP based on 28HKC+ Process
➀ Brite Semiconductor launched Ternary Content-Addressable Memory (TCAM) IP based on 28HKC+ 0.9V/1.8V process, targeting high-performance applications;
➁ The IP features high-frequency operation and low power consumption, addressing growing demands for efficient data lookup in networking and computing;
➂ Designed for applications in networking, data centers, 5G infrastructure, and AI acceleration, enhancing energy efficiency in memory-intensive systems.
May 23
- Analogue Insight and Tetrivis Announce Joint Development of “Eurytion RFK1,” a UCIe based 12 nm Ka/Ku-Band RF Chiplet Transceiver
➀ Analogue Insight and Tetrivis collaborate on developing Eurytion RFK1, a 12 nm RF chiplet transceiver supporting Ka/Ku-band with 2 GHz programmable bandwidth;
➁ The chiplet integrates Tetrivis' KuKa® IP and a local oscillator, leveraging UCIe standards for scalable connectivity;
➂ Targets applications in satellite communications, 5G, and aerospace due to its wideband performance and compact design.
May 22
- Creonic Adds oFEC Codec IP Core to Portfolio, Expanding High-Speed Networking Solutions for ASIC and FPGA
➀ Creonic launches a new oFEC codec IP core for next-gen optical and high-speed communication systems;
➁ The IP core supports both ASIC and FPGA configurations, offering flexibility and scalability;
➂ Enhances Creonic's portfolio for advanced networking solutions in telecommunications and HPC applications.
May 20
- MediaTek Races to 2nm: A New Era in Mobile and AI Chip Technology
➀ MediaTek plans to tape out its 2nm chip in September 2025, a major leap in semiconductor technology;
➁ The development highlights its collaboration with TSMC, leveraging advanced process nodes to compete in mobile and AI markets;
➂ The 2nm chip aims to enhance performance and efficiency for next-gen smartphones and AI-driven applications.
May 1
- Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025, SEMI Reports
➀ Worldwide silicon wafer shipments grew 2.2% YoY to 2,896 million square inches (MSI) in Q1 2025;
➁ Shipments declined 9.0% quarter-over-quarter compared to Q4 2024;
➂ SEMI Silicon Manufacturers Group (SMG) released the quarterly analysis of silicon wafer industry trends.
April 29
- The Future of Semiconductors: A Deep Dive with Scott Bulbrook
➀ The article presents an interview with Scott Bulbrook, President of DA-Integrated, discussing the company's role in the semiconductor industry;
➁ DA-Integrated was founded to address gaps in test development services for advanced Application-Specific Integrated Circuits (ASICs);
➂ The company's vision has evolved to adapt to changing demands, focusing on cutting-edge semiconductor testing solutions.
- UCIe™ — Universal Chiplet Interconnect Express
➀ UCIe drives modern chip design with high-bandwidth data transfer, thermal efficiency, and reduced leakage;
➁ Integrates bioinspired advancements, system co-optimization, and 3D packaging to transform AI, HPC, and consumer electronics;
➂ Advances optical I/O to push technological boundaries in semiconductor innovation.
April 28
- Premier ASIC and SoC Design Partner Rebrands as Aion Silicon
➀ Aion Silicon (formerly Sondrel) rebrands to focus on advanced SoC and ASIC solutions;
➁ Leverages decades of expertise to address complex semiconductor development challenges;
➂ Introduces new leadership team and vision to enhance customer-centric chip design services.
April 25
- Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
➀ Certus Semiconductor has announced an official partnership with TSMC to join the TSMC Intellectual Property (IP) Alliance program;
➁ The program is a key element of the TSMC Open Innovation Platform® (OIP);
➂ The partnership aims to enhance custom I/O and ESD solutions for the semiconductor industry.
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
➀ QuickLogic's eFPGA IP is now integrated into Faraday's FlashKit™-22RRAM SoC development platform;
➁ The collaboration provides designers with unmatched flexibility and adaptability;
➂ The integration aims to enhance IoT edge solutions.
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
➀ TSMC unveiled its next-generation logic process technology, A14, at the North America Technology Symposium;
➁ A14 represents a significant advancement over TSMC's N2 process;
➂ It is designed to enhance AI transformation with faster computing and improved power efficiency.
April 23
- KeyASIC Partners with AnySilicon to Expand Global Reach and Drive Lead Generation
➀ KeyASIC, a leading ASIC design services company, has partnered with AnySilicon;
➁ The collaboration aims to expand KeyASIC's marketing reach;
➂ Access to AnySilicon's extensive network of potential customers seeking ASIC design solutions is provided.
April 22
- The Ultimate Guide to GaN HEMT
➀ The transition from silicon-based components to GaN technology is reshaping the electronics industry;
➁ GaN HEMTs provide superior efficiency and improved thermal management over traditional semiconductors;
➂ This guide is tailored for engineers and enthusiasts in modern electronics.
- AMS verification: Ultimate Guide
➀ In the fast-evolving field of electronic design, ensuring the correct operation of complex mixed-signal designs is more critical than ever.
➁ Mixed-signal verification, or AMS verification, is at the core of this challenge, bridging the gap between analog and digital designs in a more digital world.
➂ As these technologies become more complex, understanding AMS verification becomes increasingly important.
April 17
- The Ultimate Guide to DFN Package
➀ The DFN (Dual Flat No-leads) and QFN (Quad Flat No-leads) packages are gaining popularity in high-performance applications due to their compact size and advanced circuitry support.
➁ These packages are used in a wide range of applications, from consumer electronics to automotive systems.
➂ Understanding their specifications can significantly enhance design strategies and product development.
April 15
- Vertex Growth announces commitment of €10M investment in Dolphin Semiconductor to accelerate growth strategy
➀ Vertex Growth, a Singapore-based growth-stage venture capital fund, has announced a €10M investment in Dolphin Semiconductor;
➁ The investment aims to support and accelerate the growth strategy of Dolphin Semiconductor;
➂ Dolphin Semiconductor is a leading provider of semiconductor IP solutions specializing in mixed-signal IP design.
April 14
- GSME Secures $18 Million Growth Investment
➀ GS Microelectronics (GSME) has secured $18 million in growth investment;
➁ The investment is from a consortium of strategic partners and technology funds;
➂ The funds will be used to fuel GSME's growth plans including portfolio diversification and global service expansion.