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- TSMC to Launch First European Design Center in Munich by Q3 2025
➀ TSMC's first European Design Center in Munich is set to launch in Q3 2025;
➁ Focuses on developing high-density, high-performance, and energy-efficient chips for automotive and industrial applications;
➂ The center will offer design support and collaborate with ecosystem partners to strengthen TSMC's presence in Europe's semiconductor market.
- Brite Semiconductor Releases TCAM IP based on 28HKC+ Process
➀ Brite Semiconductor launched Ternary Content-Addressable Memory (TCAM) IP based on 28HKC+ 0.9V/1.8V process, targeting high-performance applications;
➁ The IP features high-frequency operation and low power consumption, addressing growing demands for efficient data lookup in networking and computing;
➂ Designed for applications in networking, data centers, 5G infrastructure, and AI acceleration, enhancing energy efficiency in memory-intensive systems.
March 27
- Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design
➀ Faraday Technology Corporation, a leading provider of ASIC design services, has selected Silvaco's FlexCAN IP for advanced automotive ASIC design.
➁ The collaboration aims to enhance the capabilities of automotive systems through the use of advanced semiconductor technology.
➂ Silvaco's FlexCAN IP is designed to meet the stringent requirements of automotive applications.
- Power Semiconductor Giants amid Struggles: 8,800+ Layoffs as Market Slows and China Emerges
➀ Power semiconductors, once a rising star with AI chips, are now facing challenges due to a slow EV market;
➁ Major players are reducing staff and delaying investments, with over 8,800 layoffs reported;
➂ The struggle is further compounded by the emerging competition from China.
March 25
- FuriosaAI Rejects $800 Million Acquisition Offer from Meta, Opts for Independent Growth
➀ South Korean AI chip startup FuriosaAI has rejected an $800 million acquisition offer from Meta;
➁ The company has chosen to grow independently instead;
➂ Discussions between FuriosaAI and Meta have been ongoing since early this year.
- Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications
➀ Sarcina Technology has launched an innovative AI platform;
➁ The platform aims to provide cost-effective and customizable packaging solutions for AI applications;
➂ It utilizes ASE's FOCoS-CL assembly technology and includes an interposer for advanced packaging.
March 24
- TSMC on Track for 2nm Production, Expected to Power Apple’s iPhone 18 in 2026
➀ TSMC is making significant strides in its 2nm process technology;
➁ The technology is expected to be adopted in Apple's iPhone 18 family;
➂ The new iPhone is expected to be released in the second half of 2026.
- Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process
➀ Cadence successfully demonstrates first-pass silicon success of its UCIe™ standard package IP on Samsung Foundry's 5nm automotive process;
➁ This milestone highlights Cadence's commitment to high-performance, automotive-grade IP solutions;
➂ The solution meets the stringent requirements of next-generation automotive and high-performance computing applications.
March 21
- Zero ASIC launches world’s first open standard eFPGA product
➀ Zero ASIC has launched PlatypusTM, the world's first open-standard eFPGA IP product;
➁ Platypus features 100% open and standardized FPGA architectures;
➂ It also includes 100% open source FPGA bitstream formats.
March 20
- SoftBank to Acquire Ampere Computing for $6.5 Billion, Doubling Down on AI and Arm Technology
➀ SoftBank Group has announced the acquisition of Ampere Computing, a Silicon Valley-based startup specializing in Arm-based server chips, for $6.5 billion.
➁ The deal is expected to close in the second half of 2025 and represents SoftBank's growing investment in artificial intelligence infrastructure.
➂ The acquisition reflects SoftBank's belief in the increasing importance of Arm-based technology in data centers.
- Sofics and Dolphin Semiconductor Announce Strategic Partnership
➀ Sofics, a leading provider of specialized I/O and on-chip electrostatic discharge (ESD) solutions, and Dolphin Semiconductor, a leader in semiconductor IP solutions with a focus on mixed signal IP design, have announced a strategic partnership.
➁ The partnership aims to enhance IC designs for customers in key sectors.
➂ The collaboration is set to strengthen the capabilities of both companies in the semiconductor industry.
March 19
- KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core
➀ KiviCore and CAST have released a new post-quantum cryptographic IP core, the KiviPQC™-KEM ML-KEM Key Encapsulation IP Core;
➁ This enables quantum-safe key exchange between two communicating parties;
➂ The technology is aimed at enhancing the security of cryptographic solutions in the face of quantum computing threats.
- Silicon Catalyst announces the 3rd Annual “Arm Silicon Startups Contest”
➀ Silicon Catalyst, the world's only incubator dedicated to accelerating semiconductor solutions, has announced the 3rd Annual ‘Arm Silicon Startups Contest’;
➁ The contest is in partnership with Arm, known for its high-performance and energy-efficient computing platforms;
➂ Silicon Catalyst will organize and administer the contest, which is set to launch today.
March 17
- February 2025 Review – Semiconductor Foundries and OSATs
➀ TSMC's revenue in February reached US$7.9 billion, marking an 11% decrease from January but a 43% increase year-over-year.
➁ UMC's February revenue was US$552 million, reflecting an unknown change from the previous month.
➂ The first two months of 2025 saw a 39% increase in revenue for TSMC compared to the same period in 2024.
- Cadence Joins Intel Foundry Accelerator Design Services Alliance
➀ Cadence has officially joined the Intel Foundry Accelerator Design Services Alliance;
➁ This collaboration aims to drive innovation and support advanced chip design;
➂ The alliance aims to solidify Intel Foundry's leadership in cutting-edge semiconductor solutions.
March 14
- InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications
➀ InPsytech, a provider of high-performance semiconductor IP solutions, joins the Intel Foundry Accelerator IP Alliance;
➁ The collaboration aims to enhance HPC, AI, and automotive applications;
➂ InPsytech's advanced IP offerings will be integrated into the Intel Foundry ecosystem.
March 13
- CAST and Shikino High-Tech Partner to Expand Silicon IP Offerings and Market Reach
➀ CAST, a leading provider of silicon IP solutions, and Shikino High-Tech Co., Ltd., a Japanese company specializing in semiconductor design, imaging, sensing, and testing technologies, have announced a strategic partnership.
➁ The partnership aims to expand both companies’ reach and offerings in the global semiconductor market.
➂ The collaboration is focused on enhancing the availability of silicon IP offerings.
March 11
- Logic Fruit Technologies Releases High-Speed Interface IPs Stack for Advanced Computing
➀ Logic Fruit Technologies has released a new High-Speed Interface IP stack;
➁ The stack includes PCIe Gen6 Controller IP, PCIe Gen6 PHY IP, and CXL 3 Controller IP;
➂ The solutions ensure seamless data transfer and reliability for advanced computing applications.
March 10
- PCIM Expo & Conference 2025
➀ The PCIM Europe Expo & Conference in Nuremberg, Germany, is the premier international event for power electronics, intelligent motion, renewable energy, and energy management.
➁ As the leading forum for industry and academia, PCIM Europe drives innovation across the entire value chain.
➂ It has been the established home of power electronics for decades.
- 4Q24 Global Top 10 Foundries Set New Revenue Record, TSMC Leads in Advanced Process Nodes, Says TrendForce
➀ TrendForce's research indicates a polarized trend in the global foundry industry in 4Q24;
➁ Advanced process nodes are benefiting from strong demand in AI servers, flagship smartphone application processors, and new PC platforms;
➂ This demand has helped to counterbalance the slowdown in mature process demand, leading to a new revenue record for the top 10 foundries;
➃ TSMC leads in advanced process nodes.
March 7
- Onsemi Proposes $6.9 Billion Acquisition of Allegro MicroSystems
Onsemi has proposed an acquisition of Allegro MicroSystems for $6.9 billion, offering $35.10 per share in cash.
- EnSilica Secures €2.13 Million European Space Agency Development Contract
EnSilica plc, a leading mixed signal ASICs chip maker, has secured a €2.13 million development contract from the European Space Agency's NAVISP Element 2. The project is part of the European Space Agency's Navigation Innovation and Support Programme.
March 6
- Elevating CT technology: photon counting and cost-efficient sensor modules from ams OSRAM
➀ With two new sensor modules, ams OSRAM showcases its dedication to Computed Tomography (CT);
➁ The sensor modules are at the core of cutting-edge diagnostic imaging technology, supporting a variety of clinical applications from oncology to cardiovascular treatments;
➂ These modules aim to ensure precise patient outcomes and improve diagnostic accuracy.
- EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM
➀ Weebit Nano and Nanoveu Limited collaborate with EMASS on an ultra-low-power edge AI demonstration;
➁ The demonstration uses ReRAM technology;
➂ Weebit is a developer and licensor of advanced memory technologies;
➃ EMASS is a pioneer in ultra-low-power AI computing.
- Pragmatic Semiconductor launches next-generation platform for mixed-signal flexible ASIC design with early-access programme
➀ Pragmatic Semiconductor introduces the Pragmatic FlexIC Platform Gen 3, a next-generation mixed-signal flexible ASIC design platform;
➁ The platform offers a 10x digital power and 3x digital area improvement compared to the previous generation;
➂ The platform includes a process design kit (PDK) compatible with standard electronic design tools.
- AONDevices Partners with Faraday to Enhance Production Capabilities
➀ AONDevices, a leader in super-low-power, high-accuracy edge AI solutions, has announced a strategic partnership with Faraday Technology Corporation.
➁ The collaboration aims to enhance AONDevices' production capabilities for its advanced AI processors.
➂ Faraday Technology brings its comprehensive manufacturing expertise to the partnership.
March 3
- CAST Releases First Commercial SNOW-V Stream Cipher IP Core
➀ CAST today announced a new IP core that implements the SNOW-V stream cipher algorithm;
➁ The core is designed to meet the security and performance demands of modern communication systems;
➂ It is available for ASICs or FPGAs and is believed to be the first commercial offering of its kind.
February 27
- VeriSilicon unveils low-power AI Noise Reduction and AI Super Resolution IPs
➀ VeriSilicon has launched its new AI-based AI-NR and AI-SR series of image processing IPs;
➁ The series includes AINR1000 and AINR2000 for intelligent noise reduction, and AISR1000 and AISR2000 for advanced super resolution;
➂ These IPs offer cost-effective, highly efficient, and PPA-optimized implementations.
- Dolphin Semiconductor Provides High-Performance LDO Regulators in TSMC 22nm to Ingenic for IPC Applications
➀ Dolphin Semiconductor has announced a collaboration with Ingenic, a key player in high-performance SoC design in China.
➁ The company will provide Low Dropout (LDO) regulators in TSMC 22nm technology for camera applications.
➂ This collaboration reinforces Dolphin Semiconductor's position as a trusted partner in power management IP solutions.
- SkyWater to Acquire Infineon’s Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
➀ SkyWater Technology has entered into an agreement with Infineon Technologies AG to purchase Infineon's 200 mm fab in Austin, Texas, known as Fab 25.
➁ The acquisition includes a corresponding long-term supply agreement.
➂ SkyWater plans to operate the fab as a foundry to expand U.S. foundry capacity for foundational chips.