SemiVoice

about 1 month ago

Commodity Catchup: Why Are Central Banks Buying So Much Gold?

1. TSMC's Q2 2024 revenue grew 32% YoY to $20.8 billion, with net profit surging 76%; 2. AI-related revenue accounted for 10% of total sales, projected to grow over 20% annually in the next five years; 3. Advanced packaging capacity will double by end-2024, with a new plant planned in Chiayi, Taiwan to meet AI chip demand.

about 1 month ago

2 Income Powerhouses Entering Deep Bargain Territory

1. TSMC's Q2 revenue grew 40% YoY, driven by strong demand for AI and high-performance computing (HPC) chips; 2. Advanced packaging technologies like CoWoS contributed significantly to performance, with capacity set to double by 2024; 3. The company maintains cautious optimism for 2024, citing AI-related demand as a key growth driver amid macroeconomic uncertainties.

Main Street Capital: Will This Bubble Burst? Here Is My Take On It

1. TSMC's Q2 revenue exceeded expectations, driven by strong AI-related chip demand; 2. The company highlighted advanced packaging technologies (e.g., CoWoS) as critical for meeting AI chip production needs; 3. TSMC maintained a cautious 2024 outlook due to slower market recovery and geopolitical uncertainties.

Advanced Packaging earnings report revenue growth

Commodities: Potential Trump-Putin Meeting Weighs On Oil

1. TSMC's Q2 2023 revenue exceeded market expectations, driven by strong demand for AI-related chips; 2. The company reported a 13.7% year-over-year revenue increase, with advanced packaging technologies like CoWoS playing a key role; 3. TSMC highlighted ongoing capacity expansion for AI chips and maintained its leadership in semiconductor manufacturing despite market fluctuations.

Tesla's 177x P/E - A Fundamental Warning Sign

1. TSMC's Q2 revenue growth is expected to be driven by strong AI-related demand; 2. Advanced packaging technology remains a critical focus for meeting AI chip production needs; 3. Market attention centers on TSMC's outlook for AI-driven growth and its impact on the semiconductor supply chain.

AI Demand Advanced Packaging

Apple: I Started Selling Once I Faced A Reality Check

1. TSMC plans to double its advanced packaging capacity (e.g., CoWoS technology) by 2027 to address AI-driven demand; 2. The expansion aims to support AI chip clients like NVIDIA and AMD amid global semiconductor shortages; 3. TSMC is diversifying production geographically while facing challenges in equipment supply and talent acquisition.

AI Chips Advanced Packaging

Buy, Hold, Or Avoid Realty Income? I Walk You Through All Three Cases

1. TSMC unveiled its breakthrough System on Integrated Chips (SoIC) 3D stacking packaging technology; 2. The technology enables higher performance and energy efficiency for AI and high-performance computing (HPC) applications; 3. It addresses chip integration challenges and strengthens TSMC's leadership in advanced semiconductor manufacturing.

AI Demand Advanced Packaging TSMC

Merck KGaA: The Undervaluation Is Now Close To 13-Year Lows

1. TSMC's Q2 revenue exceeded expectations driven by strong AI-related chip demand and advanced packaging technology; 2. The company highlighted AI processors as a primary growth driver, offsetting weaker smartphone and traditional server markets; 3. TSMC plans to expand advanced packaging capacity to address supply shortages, maintaining its leadership in semiconductor manufacturing.

AI Chips Advanced Packaging

AMD: The King Of Inference

1. TSMC introduced its cutting-edge SoIC (System on Integrated Chips) packaging technology to address growing AI chip demands; 2. The technology enables higher interconnect density and thermal performance for next-gen AI processors; 3. TSMC aims to strengthen its leadership in advanced semiconductor manufacturing through this innovation.

AI Chips Advanced Packaging High-Performance Computing

4 months ago

The $18 Trillion Bottleneck That Could Supercharge Your Portfolio

1. TSMC's SoIC advanced packaging technology faces surging demand, with orders extending to 2027; 2. Major clients include Apple, NVIDIA, and AMD, driving capacity expansion plans; 3. The technology supports next-gen AI/HPC chips with 3D stacking innovation.

AI Chips Advanced Packaging

4 months ago

Watsco Q2 Preview: A2L Refrigerant Transition Is A Multi-Year Catalyst, Initiating With 'Buy'

1. TSMC, Intel, and Samsung are intensifying competition in advanced packaging technologies to meet AI and high-performance computing demands; 2. Innovations like TSMC's CoWoS and Intel's 3D packaging aim to enhance chip performance and energy efficiency; 3. The industry shift toward chiplet designs and heterogeneous integration is reshaping semiconductor manufacturing strategies.

tomshardware

4 months ago

Ex-Intel CEO Pat Gelsinger gives Japan's new leading-edge chipmaker advice, says Rapidus needs unique tech to compete with TSMC

➀ Ex-Intel CEO Pat Gelsinger advises Japan's Rapidus to develop unique differentiating technologies beyond production efficiency to compete with TSMC.

➁ Rapidus plans to integrate wafer fabrication and advanced packaging at the same facility for faster cycles, though full automation will not be available immediately from 2027.

➂ The company aims to begin 2nm test production with GAA transistors and establish a chiplets R&D center, utilizing ASML EUV lithography tools for future HBM and 3D packaging.

2nm Advanced Packaging Chiplet EUV Intel Rapidus TSMC

5 months ago

SPYI: An Ideal Options Income Fund

1. TSMC's SoIC advanced packaging technology faces explosive demand driven by AI chips and HPC applications; 2. Major OSAT companies like ASE and Amkor are accelerating capacity expansion, particularly for CoWoS and chip-on-wafer packaging; 3. The supply chain faces bottlenecks as equipment delivery times extend to 18-20 months, prompting strategic collaborations across the ecosystem.

Advanced Packaging TSMC

5 months ago

Trump And Bessent Do A 180-Degree Turn And That Is A Very Bullish Factor For The Stock Market

1. TSMC introduces new SoIC and CoWoS packaging technologies to enhance chip performance and integration; 2. The innovation addresses booming AI chip demand from companies like NVIDIA and AMD; 3. Advanced packaging helps mitigate supply chain bottlenecks and strengthens TSMC's competitive edge in the semiconductor industry.

Advanced Packaging

6 months ago

Income Alert: 2 Bargain Blue Chips, Up To 8% Yield

1. TSMC has developed a groundbreaking advanced packaging technology called SoIC, enhancing chip performance and energy efficiency; 2. Competitors like Intel and Samsung face challenges in matching TSMC's innovation, impacting their market positions; 3. The advancement accelerates the semiconductor industry's shift toward advanced packaging solutions to meet AI and HPC demands.

Advanced Packaging TSMC