➀ TSMC's first European Design Center in Munich is set to launch in Q3 2025;

➁ Focuses on developing high-density, high-performance, and energy-efficient chips for automotive and industrial applications;

➂ The center will offer design support and collaborate with ecosystem partners to strengthen TSMC's presence in Europe's semiconductor market.

➀ TSMC showcased its advanced semiconductor technologies at the 2025 Europe Symposium, highlighting N3 nodes' high-volume production with variants for CPUs, cost-effective products, and automotive applications;

➁ Unveiled next-gen N2 and A16/A14 processes with performance/efficiency improvements, and introduced CFET transistor designs achieving double density;

➂ Demonstrated 3D Fabric innovations (SoIC/CoWoS), wafer-scale AI systems (SoW-X), and specialized automotive/IoT solutions including RRAM/MRAM and N4C RF for emerging wireless standards.

➀ TSMC will establish its European Design Centre (EUDC) in Munich in Q3 2025 to support European customers in designing high-performance, energy-efficient chips for automotive, AI, IoT, and industrial applications;

➁ The center aims to drive process technology development, foster expertise in automotive and non-volatile memory (e.g., RRAM/MRAM), and collaborate with global design teams;

➂ The EUDC will join TSMC's global network, enhancing chip design innovation and strengthening industry partnerships across key sectors.

➀ An international research team led by Prof. Qing-Tai Zhao proposes that operating computer chips at cryogenic temperatures could reduce energy consumption by up to 80%, addressing the high energy demands of data centers and AI infrastructure;

➁ Cryogenic computing leverages the improved efficiency of transistors at low temperatures but faces challenges like material defects and quantum tunneling, requiring novel materials and architectures (e.g., gate-all-around nanowires, high-k dielectrics) to optimize CMOS technology;

➂ Applications span quantum computing, space exploration, and high-performance data centers, with TSMC actively developing chips tailored for cryogenic environments to enhance energy efficiency and integrate with quantum processors.

➀ Alchip achieved record revenue of $1.62B in 2024 through leadership in 2nm/3nm ASIC design and chiplet-based packaging solutions;

➁ Strategic global talent redistribution focuses on Taiwan, Japan, and SEA, with Vietnam and Malaysia engineering teams doubling by 2025;

➂ Completed 18 TSMC CoWoS designs—the most among ASIC partners—enabling heterogeneous integration for AI/HPC systems.

➀ TSMC held a capacity expansion ceremony at its 2nm fab in Kaohsiung to celebrate an early move to mass production.

➁ Mass production at the Kaohsiung fab and another in Hsinchu is expected to start in Q3, with a combined output forecast to generate $60 billion in revenue in Q3 and Q4.

➂ The two fabs have a maximum output of 80k wpm, with yields said to be 'well above' 60-70%. Initial clients include Apple, Nvidia, and Qualcomm.

➀ Semiconductor capital expenditures (CapEx) are expected to decrease to $155 billion in 2024, before increasing to $160 billion in 2025.

➁ TSMC plans a significant increase in CapEx for 2025, estimating between $38 billion and $42 billion, while Micron Technology is projecting $14 billion.

➂ The CHIPS Act has allocated $32 billion in grants and $6 billion in loans to support semiconductor manufacturing in the U.S.

➀ TSMC has proposed a joint venture with US chip designers like NVIDIA and AMD to operate Intel's semiconductor fabs, with TSMC holding no more than a 50% stake.

➁ The talks are in early stages, following President Trump's push to revitalize the US semiconductor industry.

➂ TSMC would run the operations of Intel Foundry, but wouldn't own more than 50%.

➀ TSMC plans to start mass production of its A16 process node in Taiwan by 2026 and expand to Arizona by 2028.

➁ TSMC's new Arizona wafer fab has begun mass production, with the first one in the US achieving mass production.

➂ TSMC's new 2nm and A16 process nodes may be produced in the US earlier than previously planned.

➀ TSMC is advancing its 2nm process node, aiming for a monthly production capacity of 50,000 to 80,000 wafers by the end of 2025.

➁ TSMC's 2nm process node is in an intensive trial production phase, with the Hsinchu Baoshan plant expected to produce 5,000 to 10,000 wafers monthly.

➂ If the second phase progresses smoothly, the monthly production capacity could reach up to 80,000 wafers before the end of the year.

➀ Apple has announced the iPhone 16e with its first in-house 5G modem, the Apple C1, made on TSMC's 4nm and 7nm nodes.

➁ The iPhone 16e is priced at $599 and features the A18 processor, offering excellent battery life.

➂ The new C1 modem is the most power-efficient baseband chip in an iPhone, with a combination of TSMC's 4nm and 7nm processes.

➀ Intel principal engineer Joseph Bonetti argues against a rumored TSMC deal, stating that Intel's 18A process node is more advanced and nearing completion.

➁ Bonetti mentions that early adopters of Intel 18A include Microsoft and Amazon.

➂ He discusses the challenges facing Intel and the unprofitability of Intel Foundry Services (IFS) due to large investments and the lack of major external contracts.

➀ Alchip预计2024年营收将超过10亿美元，实现重大里程碑；

➁ 公司专注于先进技术，包括2nm测试车间的发布和3DIC设计流程的准备工作；

➂ Alchip通过灵活且强大的3DIC设计流程应对先进封装的挑战，优化功率传输、互连和热特性。

➀ Applied Materials reported lower-than-expected QTR guidance due to China market share loss.

➁ AMAT attributed the weakness to China export restrictions but analysts believe share loss is also a factor.

➂ Domestic Chinese semiconductor equipment makers are gaining market share, potentially reducing AMAT's sales.

➀ TSMC CEO Dr. C.C. Wei confirmed no plans to acquire Intel's US semiconductor facilities despite rumors.

➁ Wei emphasized that Intel is a good customer and sends significant business to TSMC.

➂ The Trump administration's stance on foreign ownership of US chip factories and potential support for a foreign company operating Intel's facilities remain unclear.

➀ TSMC plans to start construction of its third factory in Arizona by mid-2025, a year ahead of schedule.

➁ The new CoWoS advanced packaging plant in the US is also under consideration.

➂ This expansion is part of TSMC's strategy to increase its presence in the US amidst concerns over foreign control of the semiconductor industry.

➀ NVIDIA的GeForce RTX 5090显卡需求旺盛，但库存有限；

➁ 为了应对需求，NVIDIA利用多余的TSMC产能生产更多的RTX 50系列GPU；

➂ 预计RTX 5090的供应量将显著增加，影响黄牛；

➃ 即将推出的产品包括RTX 5070 Ti、RTX 5070和RTX 5060。

➀ Arm计划推出其首款自研芯片，可能是一款服务器CPU芯片，将由台积电生产；

➁ 报道称，Arm已将Meta作为其首个客户之一，计划最早于今年夏天推出这款芯片；

➂ Arm原本设计半导体结构并将其设计许可给苹果、英伟达等公司，现在将带着自己的服务器CPU进入市场。

➀ Intel's upcoming Nova Lake CPUs have been spotted in shipping manifests, indicating progress on their next-gen consumer platform.

➁ The next CPU architecture from Intel will be Panther Lake, showcased at CES 2025, and will be the company's first consumer platform on its new Intel 18A process node.

➂ Intel's next-gen Nova Lake CPUs are expected to be fabricated on Intel 14A or TSMC 2nm, and will not feature on-package memory.

➀ NVIDIA CEO Jensen Huang is collaborating with TSMC on robotics and autonomous vehicle development.

➁ NVIDIA's upcoming Jetson Thor SoC and Project GROOT robot are part of this collaboration.

➂ The collaboration includes a joint silicon photonics research project between NVIDIA and TSMC.