➀ Synopsys suspends financial guidance and halts China sales after U.S. tightens semiconductor software export controls;

➀ Internal memo reveals immediate suspension of new orders and services in China;

➂ Move impacts partnerships with TSMC, Intel, and global chip supply chain dynamics.

➀ Heterogeneous chip design faces multidimensional challenges requiring holistic solutions balancing architecture, verification, and testing;

➁ High-speed testing becomes critical for chiplet-based AI/HPC designs, demanding innovative approaches to overcome GPIO bandwidth limitations;

➂ Synopsys introduces HSGPIO technology enabling 10x faster test throughput without additional hardware, supporting multi-mode configurability for manufacturability and debug.

➀ DTCO has transformed into a predictive strategy enabling co-development of process and design, exemplified by Synopsys' collaboration with Intel on 18A technology;

➁ Key advancements include RibbonFET alignment and PowerVia optimization, boosting design productivity and power efficiency in Intel’s 18A process;

➂ Synopsys’ PICO framework expands DTCO’s scope, ensuring full-stack optimization and enabling faster market readiness through pre-silicon validation.

➀ PCIe 7.0 achieves 128 GT/s bandwidth with PAM4 signaling and enhanced error correction, extending the innovations of PCIe 6.0;

➁ Key challenges involve managing multiple data movers and link layers, favoring bifurcation and dual-port interfaces over ultra-high clock speeds;

➂ PCIe 7.0 provides SoC designers flexibility for AI/HPC systems due to its cost-efficiency and low pin count compared to parallel buses.

➀ Synopsys has expanded its Hardware-Assisted Verification (HAV) portfolio to address the growing complexity of chip design.

➁ The new solutions aim to accelerate semiconductor design and system validation.

➂ Key products include the next-generation hardware engines ZeBu-200 and HAPS-200, offering significant performance improvements.

➀ Generative AI has evolved with the rise of transformer models, improving accuracy and enabling automated creation.

➁ Running Gen AI on the edge addresses challenges like latency, privacy, and limited connectivity.

➂ Synopsys offers specialized NPUs for efficient edge-based Gen AI processing.

➀ Multi-die design and heterogeneous integration are crucial for semiconductor technology scaling.

➁ Synopsys offers a comprehensive suite of solutions for multi-die design challenges.

➂ Detailed insights into multi-die system architecture, verification, implementation, and testing are provided by Synopsys white papers.

➀ Synopsys extends its Virtualizer IP suite to Arm hardware, enabling direct execution of virtual prototypes on Arm-based machines.

➁ The Native Element feature reduces boot times for Android from 20 minutes to tens of seconds.

➂ The tool supports hybrid emulation, combining virtual prototyping with hardware-assisted verification (HAV) for improved performance.