➀ 3D design with HBM is critical for advanced semiconductor systems; ➁ Large system designs require multi-chiplet integration; ➂ Multiphysics and ML are essential for optimizing performance and reliability.
Recent #Ansys news in the semiconductor industry
➀ The rise of 2.5D and 3D multi-die design in mainstream applications; ➁ Comprehensive design flows provided by Synopsys and Ansys for multi-die projects; ➂ Expert insights from Marc Swinnen and Keith Lanier on technical knowledge and engaging presentation.
➀ The rise of 2.5D and 3D multi-die designs driven by high-performance computing and AI; ➁ Challenges in architecture and early prototyping, including thermal management and mechanical reliability; ➂ The importance of early verification to prevent costly delays and suboptimal performance; ➃ The role of AI in optimizing design processes and outcomes; ➄ The significance of sign-off tools for ensuring reliability and longevity of multi-die designs.
1. The article compares careers in chip design and EDA, highlighting the author's transition from chip design to leading an Application Engineering team at Ansys. 2. It outlines the advantages of an EDA career, including technical exposure, cross-team collaboration, business acumen, work culture, and industry stability. 3. The future of EDA is seen as bright due to the increasing reliance on EDA tools in areas like AI and Machine Learning.
➀ Ansys and Synopsys announce the sale of Ansys PowerArtist business to Keysight Technologies; ➁ The transaction involves the sale of semiconductor design and simulation software; ➂ The deal is subject to regulatory approvals.
➀ Package reliability analysis is often overlooked during initial product development;
➁ Package reliability issues uncovered during product qualification cost significantly;
➂ The rapid adoption of 2.5D and 3D packaging exacerbates these issues due to new materials and extended thermal environments;
➃ Low-K dielectric materials are more prone to catastrophic cracking due to higher modulus of rigidity and thermal stress;
➄ Solder fatigue is another reliability issue affecting solder joint connections between package and PCB;
➅ ANSYS Multiphysics can be used for thorough thermal-mechanical simulation of material stackup to mitigate these issues.
1. Ansys integrates NVIDIA’s Omniverse into its 3D chip design process; 2. The integration aims to enhance the development of 2.5D and 3D multi-die systems; 3. This collaboration is expected to unlock new possibilities in advanced chip designs.