➀ The rise of 2.5D and 3D multi-die design in mainstream applications; ➁ Comprehensive design flows provided by Synopsys and Ansys for multi-die projects; ➂ Expert insights from Marc Swinnen and Keith Lanier on technical knowledge and engaging presentation.

➀ The rise of 2.5D and 3D multi-die designs driven by high-performance computing and AI; ➁ Challenges in architecture and early prototyping, including thermal management and mechanical reliability; ➂ The importance of early verification to prevent costly delays and suboptimal performance; ➃ The role of AI in optimizing design processes and outcomes; ➄ The significance of sign-off tools for ensuring reliability and longevity of multi-die designs.

1. TSMC's Technology Symposium highlights the company's advanced technology and its ecosystem, focusing on advanced packaging solutions. 2. Advanced packaging has evolved from a simple finishing step to a critical part of the design process, driven by the need for heterogeneous integration of multiple dies. 3. TSMC's 3DFabric™ Technology Portfolio includes CoWoS®, InFO, and TSMC-SoIC®, which support multi-chip packaging and 3D IC stacking, enhancing system performance and functionality.