➀ Alchip预计2024年营收将超过10亿美元，实现重大里程碑；
➁ 公司专注于先进技术，包括2nm测试车间的发布和3DIC设计流程的准备工作；
➂ Alchip通过灵活且强大的3DIC设计流程应对先进封装的挑战，优化功率传输、互连和热特性。
Recent #advanced packaging news in the semiconductor industry
➀ TSMC plans to start construction of its third factory in Arizona by mid-2025, a year ahead of schedule.
➁ The new CoWoS advanced packaging plant in the US is also under consideration.
➂ This expansion is part of TSMC's strategy to increase its presence in the US amidst concerns over foreign control of the semiconductor industry.
➀ Innolux denies plans to sell its plant in southern Taiwan amidst rumors of TSMC's potential purchase. ➁ The AI boom has increased demand for advanced packaging production capacity, driving industry growth. ➂ The situation highlights the strategic importance of semiconductor manufacturing facilities in Taiwan.
➀ The IEDM 2024 conference will be held in San Francisco from December 7th to 11th; ➁ Focus on AI, TSMC's 2nm Logic Platform, and Intel's extreme scaled transistors; ➂ Reflect on 70 years of IEDM history and explore advanced packaging, power transistors, and brain/electronics interfaces.
1. Sarcina Technology introduces innovative advanced packaging solutions at #61DAC, focusing on cost-effective and reliable chiplet-based designs. 2. The company collaborates with Keysight Technologies to enhance design and test environments, enabling faster deployment in AI, autonomous driving, and quantum computing. 3. Sarcina's Bump Pitch Transformer package design, using silicon bridge technology, aims to increase interconnect density and democratize 2.5D era technologies.
1. TSMC's construction of its new CoWoS advanced packaging plant in Chiayi, Taiwan was halted this month after archaeological ruins were discovered. 2. TSMC has proposed a plan to build a second CoWoS advanced packaging facility in the Southern Science Park Administration of the National Science and Technology Council. 3. A cultural review meeting has been convened, and it was resolved that construction process will be monitored daily, regardless of whether it's a sensitive area or not.
1. The use of glass substrates is expected to challenge the current advanced packaging technologies like TSMC's CoWoS. 2. Glass substrates are targeted for use in AI and server semiconductor applications. 3. A university professor predicts the commercialization of glass substrates will disrupt the market dominance of existing technologies.
1. TSMC's Technology Symposium highlights the company's advanced technology and its ecosystem, focusing on advanced packaging solutions. 2. Advanced packaging has evolved from a simple finishing step to a critical part of the design process, driven by the need for heterogeneous integration of multiple dies. 3. TSMC's 3DFabric™ Technology Portfolio includes CoWoS®, InFO, and TSMC-SoIC®, which support multi-chip packaging and 3D IC stacking, enhancing system performance and functionality.