thelec.net 主要提供关于SK Hynix、Samsung等韩国半导体行业的最新新闻，包括HBM、DRAM和NAND等信息。
May 28
- China spent the most in fab equipment in 2024
➀ China emerged as the top spender on semiconductor fab equipment in 2024;
➁ The country invested $49.55 billion in this sector, marking a 35% year-on-year increase;
➂ This expenditure solidified China's position as the world's largest semiconductor equipment market.
April 1
- SFA supplies inspection kit for HBM and glass substrates to major chipmaker
SFA has developed three different kinds of metrology and inspection (MI) machines and has supplied one of them to a major South Korean chipmaker.
The company has supplied a white light interferometry (WLI)-based height measurement machine to the conglomerate and plans to supply four additional units.
- Zeus sees revenue jump last year thanks to HBM
Zeus, a South Korean semiconductor equipment manufacturer, reported revenue of 315.7 billion won last year, a 69% increase from 2023, according to its filings on Monday. It also returned to profitability with an operating income of 39.1 billion won. This growth is attributed to Zeus's timely development of cleaners for high-bandwidth memory.
March 28
- SK Hynix CEO says HBM capacity already sold out this year
SK Hynix's CEO announced that the company's high-bandwidth memory (HBM) production capacity for this year has already been sold out. Following discussions with a customer, it is also expected that next year's volume or production capacity will be sold out within the first half of this year.
March 27
- Hanwha to take full part in subsidiary Aerospace's rights issue
Hanwha Corporation announced on Wednesday that it will fully participate in the rights issue of its subsidiary Hanwha Aerospace, which plans to raise 3.6 trillion won, making it South Korea's largest rights issue to date. Hanwha Corporation holds a 33.95% stake in Aerospace.
- DI subsidiary supplies inspection kit samples for HBM4 to SK Hynix
DI Corporation’s subsidiary, Digital Frontier, has supplied samples of its wafer inspection kit to SK Hynix for use in the production of HBM4. The equipment is currently undergoing quality testing by the chipmaker, and official orders are expected within three to six months.
March 20
- SK Hynix to install equipment 2 months faster in new M15X fab
SK Hynix is planning to install equipment in its new M15X factory two months ahead of schedule, due to a surge in orders for its high-bandwidth memory (HBM) from customers, particularly Broadcom. The company is also expanding its production capabilities.
March 15
- Hanwha Semitech to supply 14 TC bonders to SK Hynix for HBM
Hanwha Semitech announced on Friday that it has entered into a 21 billion won agreement to supply high-bandwidth memory (HBM) production equipment to SK Hynix. The company, previously known as Hanwha Precision Machinery, did not specify the equipment, but it is almost certain to be thermal compression (TC) bonders.
- Seojin System posts record earnings in 2024
Seojin System, an equipment parts manufacturer, reported its highest earnings ever last year. The company announced on Thursday that it recorded KRW 1.21 trillion in revenue and KRW 108.7 billion in operating profit last year, representing a 56% and 122% increase, respectively, from 2023. Seojin System attributed its growth to its strong sales and operational efficiency.
February 24
- Lam Research molybdenum deposition machine ALTUS Halo
Lam Research has introduced an atomic layer deposition (ALD) machine named ALTUS Halo, which utilizes molybdenum. The use of molybdenum in this machine reduces resistance by 50% compared to tungsten, ultimately accelerating application speed, according to Tae-Soon Park, Director of Lam Research, during a press conference at Semicon Korea.
February 21
- Applied Materials showcases new eBeam System for chip defect detection
Applied Materials demonstrated its new inspection kit SEMVision H20 on Thursday, equipped with the company's second-generation cold fusion emission (CFE) technology, which is three times faster than thermal fusion emission (TFE) equipment for analysis.
February 20
- YEST in talks with Japan’s Kioxia to supply HPA kits
YEST has been in discussions with Japanese NAND giant Kioxia to supply high pressure annealing (HPA) equipment. According to a company spokesperson, the talks are aimed at providing HPA equipment for Kioxia's line expansion. YEST's equipment is capable of processing 125 wafers per action, compared to the rival's 75.
February 19
- Genesem supplies sorter for use in HBM testing to Korean chip giant
Genesem, a fab equipment manufacturer, has supplied a package sorter for the final testing of high-bandwidth memory (HBM) to a South Korean chip-maker. This is Genesem's first deal of this kind with the chip-maker. The sorter is also compatible with HBM inspection equipment that Nvidia requested.
February 18
- Samsung chip boss personally visited Nvidia with improved DRAM sample for HBM: Sources
➀ Samsung's top chip executive visited Nvidia's headquarters in the US;
➁ He brought a sample of the company's latest 1b DRAM;
➂ The purpose of the visit was to discuss the potential use of the improved DRAM for HBM.
February 10
- SK Hynix kit supplier Nextin see earnings surge in 2024
Nextin, a supplier of equipment for SK Hynix, reported on Friday that it achieved a revenue increase of over 30% and an operating income increase of 32.24% in 2024. Revenue reached 114.82 billion won, and operating income was 47.82 billion won. Nextin attributed the growth to new orders from both domestic and international markets.
- Hanwha Precision to win order for HBM TC bonders from SK Hynix this month
Hanwha Precision Machinery is on the verge of officially securing orders from SK Hynix for thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM). Sources indicate that the equipment manufacturer is in the final stages of verification with the chip-maker.
January 24
- SK Hynix records highest earnings ever in 2024
➀ SK Hynix reported record-breaking financial results for the year 2024 with 66.19 trillion won in revenue and 23.46 trillion won in operating income.
➁ The revenue saw a significant year-over-year increase of 102%.
➂ This marked a return to profitability after a tough year for memory chip companies in 2023.
January 23
- Okins to supply chip test sockets to Samsung
➀ Okins Electronics announced on Wednesday that it will supply Samsung with over 400,000 units of semiconductor test sockets, valued at 6.65 billion won (approximately 11.7% of the company's revenue in 2023).
➁ A spokesperson for Okins Electronics stated that the majority of these sockets will be used for Samsung's production processes.
➂ This contract highlights the strong partnership between Okins Electronics and Samsung in the semiconductor industry.
- Philoptics names ex-Samsung exec as head of its fab equipment business
➀ Philoptics has appointed a former Samsung executive as the head of its fab equipment business.
➁ Im Baek-gyun, who was previously the executive vice president and head of the manufacturing innovation center at Samsung DI, will take on the role of president next month.
➂ This move strengthens Philoptics' position in the semiconductor equipment market.
January 15
- DIT supplies additional laser annealing kits to SK Hynix➀ DIT announced a deal worth 20.52 billion won to supply SK Hynix with laser annealing kits; ➁ The agreement has been in place since 2023; ➂ The exact number of units supplied was not disclosed.
- SK Hynix to reduce NAND production by 10% within 1st half of year➀ SK Hynix plans to reduce its NAND production output by 10% in the first half of the year; ➁ The company has a total monthly NAND production capacity of 300,000 wafers; ➂ NAND prices have been falling for four consecutive months due to oversupply.
- Hanmi to tune bonders supplied to SK Hynix for HBM➀ Hanmi Semiconductor has signed a 10.8 billion won deal with SK Hynix for HBM production equipment; ➁ The deal involves tuning bonders supplied by Hanmi to SK Hynix; ➂ Details of the deal were not disclosed.
January 10
- SK Hynix developing HBM 'faster' than Nvidia’s demand➀ SK Hynix is developing high bandwidth memory (HBM) faster than customer Nvidia's demand; ➁ SK Group Chairman Chey Tae-won met with Nvidia CEO Jensen Huang at CES 2025; ➂ SK Hynix, as the most valuable subsidiary of SK Group, is manufacturing memory.
January 8
- Nextin’s Wuxi operation to start production in October➀ Nextin is establishing a subsidiary in Wuxi, China; ➁ The subsidiary will begin producing fab equipment in October; ➂ The operation was initially planned as a joint venture with another South Korean company, but Nextin decided to proceed independently; ➃ There were concerns about the US-China trade dispute.
December 31
- TSMC develops silicon photonics tech to ease overheating in GPU➀ TSMC has developed co-packaged optics (CPO) technology; ➁ The technology integrates a chiplet and an optical device; ➂ It aims to ease overheating in GPUs, particularly Nvidia’s GPUs.
December 29
- Fabless LB Semicon aims to increase revenues from overseas➀ LB Semicon, a South Korean outsourced semiconductor assembly and test (OSAT) firm, plans to significantly increase its revenue from overseas within the next three years; ➁ The company aims to achieve this by reducing its reliance on display driver ICs (DDIs); ➂ LB Semicon CEO Namseong Kim announced this during a press conference in Seoul.
December 20
- SK Hynix wins large order for HBM from Broadcom➀ SK Hynix has secured a significant order for HBM from Broadcom; ➁ The chips will be used in an AI computing chip for a major technology company; ➂ The deal is expected to enhance SK Hynix's market position in high-performance memory.
December 16
- Park Systems’ AFM in high demand thanks to rise of hybrid bonding➀ Park Systems' atomic force microscope (AFM) is in high demand among global chipmakers; ➁ The demand is driven by the necessity of the AFM for hybrid bonding processes; ➂ The company has already supplied test equipment to some chipmakers and is in discussions with others.
December 12
- LB Semicon and LB Lusem to package power chips aimed at AI data centers➀ LB Semicon and its subsidiary LB Lusem are set to provide turn-key packaging services for power management chips used in AI data centers. ➁ They will handle both the front and back sides of wafers. ➂ The announcement was made on Wednesday.
- LB Semicon and LB Lusem to package power chips aimed at AI data centers➀ LB Semicon and its subsidiary LB Lusem will provide turn-key packaging services for power management chips used in AI data centers. ➁ The services will include processing for both the front and back sides of wafers. ➂ They will also offer testing for the chips.