➀ TSMC has developed co-packaged optics (CPO) technology; ➁ The technology integrates a chiplet and an optical device; ➂ It aims to ease overheating in GPUs, particularly Nvidia’s GPUs.
Recent #Silicon Photonics news in the semiconductor industry
➀ The Substrate Vision Summit in Santa Clara is expected to attract a large crowd, focusing on semiconductor substrates and their impact on 3D IC performance. ➁ AI's role in transforming the semiconductor value chain will be discussed, highlighting its impact on scaling, complexity, and high-performance chip demands. ➂ Keynote speakers and panel discussions will explore advancements in semiconductor materials, AI computing, and the role of universities in technology development.
➀ OpenLight is the first open silicon photonics platform with integrated lasers; ➁ Solves challenges in design, manufacturing, and deployment of silicon photonics; ➂ Strongest application areas include data centers, AI/ML, and HPC; ➃ Focuses on scalability and efficiency for photonic components; ➄ Differentiates by enabling direct integration of active components into silicon; ➅ Developing advanced PICs and expanding portfolio with 1.6Tb products.
➀ Dr. Mehdi Asghari discusses his entrepreneurial journey and SiLC Technologies' mission to enable machine vision similar to humans; ➁ SiLC's first fully integrated coherent LiDAR chip and its applications in robotics, mobility, and perimeter security; ➂ The challenges and opportunities in the AI and robotics industries, with a focus on the importance of coherent imaging for machine autonomy.
➀ CEA-Leti is developing optical interposers using silicon photonics; ➁ The new technology, called Starac, aims to reduce communication delays; ➂ Starac uses an ONoC for high-speed data transmission between chiplets without intermediate hops.
➀ ASML and imec have signed a new strategic partnership agreement, focusing on research and sustainability.
➁ The agreement aims to deliver valuable solutions in two areas: advancing the semiconductor industry and developing sustainable innovation initiatives.
➂ The collaboration includes ASML's full product portfolio, focusing on high-end nodes and advanced technologies.
1. Tower Semiconductor and Innolight expand collaboration using Tower's new SiPho platform. 2. The technology reduces the number of external optical components by half, simplifying design and enhancing efficiency. 3. The solution addresses the needs of high-speed optical connectivity in AI-driven data centers.
➀ STMicroelectronics has unveiled new silicon photonics and next-gen BiCMOS technologies aimed at enhancing optical interconnect performance in datacenters and AI clusters.
➁ These technologies, scheduled for production from H2 2025, will support 800Gb/s and 1.6Tb/s optical modules, addressing the growing demand for high-speed communication in AI-driven ecosystems.
➂ The collaboration with key partners like AWS is expected to drive innovation and market growth in silicon photonics and BiCMOS technologies for optical interconnects.
➀ STMicroelectronics has recently released new developments in its300mm silicon photonics platform, detailing its development history for reference.
➁ ST began collaborating with Luxtera in 2012 to develop a 12-inch silicon photonics platform under Luxtera's existing silicon photonics IP technology.
➂ ST showcased its silicon photonics platform progress at OFC 2015, using a 90nm process node and specific characteristics of its silicon waveguides and optical devices.
➃ Luxtera developed PSM4 and PSM8 products on ST's silicon photonics platform, but later partnered with TSMC, leading to better performance for Luxtera's devices.
➄ ST recently announced a new silicon photonics solution, PIC100, with improved device performance to meet 200G single-channel application needs.
➅ ST is also developing TSV and heterogeneous integration processes for 400G/lane applications.
➆ ST is targeting the 800G and 1.6T optical module market with its new BiCMOS platform B55X, and has announced a partnership with AWS.
➇ ST's silicon photonics platform has had a complex development, from its partnership with Luxtera to its current collaboration with AWS.
➀ In a world driven by rapid advancements in technology, the quest for speed and efficiency has never been more vital. Silicon photonics emerges as a beacon of innovation, blending the realms of light and electronics to revolutionize data processing and communication. ➁ At its core, silicon photonics harnesses optical phenomena to transmit data at unprecedented speeds.
➀ The rapid development of data centers and the demand for faster and more efficient communication networks are driving the adoption of silicon photonics.
➁ Silicon photonic integrated circuits (PICs) combine the advantages of optics with the scalability of integrated circuits, enabling high-speed data transmission.
➂ The market for PICs is expected to grow significantly, driven by high-speed modules and expanding data centers.
➃ Major semiconductor companies, such as Intel and Broadcom, are investing heavily in silicon photonics technology.
➄ Newcomers like Lightmatter, Celestial AI, and Ayar Labs are also making significant contributions to the field.
➅ Semiconductor foundries are playing a crucial role in the production of silicon photonics products.
➀ IMEC has made progress on O-band GeSi QCSE EAMs on a 300mm silicon photonics platform.
➁ The new structure design of QCSE EAMs includes improvements to suppress p-type doping, adjust the p-region structure, and reduce metal absorption losses.
➂ The device demonstrates a 3dB bandwidth greater than 50GHz and a dynamic extinction ratio of 2.3dB at 64Gb/s.
1. Tower Semiconductor announced the release of its new 300mm Silicon Photonics (SiPho) process as a standard foundry offering. 2. The process complements Tower's existing 200mm platform and is tailored to meet the needs of high-speed data communications for next-generation datacom applications. 3. The 300mm offering features advanced silicon waveguides and low-loss silicon nitride waveguides, enhancing compatibility with industry-standard OSAT platforms.
1. Tower Semiconductor has begun volume production of 1.6Tbps silicon photonic products based on its latest platform. 2. The platform doubles data rates compared to current 800Gbps products. 3. The process supports 200Gbps per lane, achieving a total of 1.6Tbps transceiver throughput.
➀ Silicon photonics heterogeneous integration: OpenLight Photonics demonstrates its tunable and DFB lasers based on silicon photonics heterogeneous integration on the Tower Semiconductor platform. Heterogeneous IIIV on silicon has started commercial use.
➁ Silicon photonics flip-chip bonding integration: Narrow linewidth external cavity tunable lasers are achieved using mature flip-chip bonding technology, with a key bonding precision of 700nm@3σ, reaching mass production level.
➂ Silicon photonics end-to-end hybrid integration: End-to-end coupling uses SSC to make ultra-low kappa grating performance external cavity. It has fast frequency sweep characteristics using LNOI, and is important for sensing applications.
➀ Introduction of wavelength locking chips based on silicon photonics, highlighting their trend, functionality, and challenges with temperature dependence.
➁ Discussion on passive optical isolators based on silicon photonics, focusing on optical Kerr effect and micro-ring resonators.
➂ Presentation of a tunable C+L band laser, featuring a novel TOSA with over 100nm tuning range and high output power.
➀ DustPhotonics is an Israeli silicon photonics chip design company founded in 2017, having raised $96 million in funding and launched the first commercial 1.6T silicon photonics optical engine in September 2023.
➁ The L3C technology, or Low Loss Laser Coupling, is introduced as a method for reducing coupling losses in optical links.
➂ The technology involves the design of auxiliary waveguides for alignment on PIC and laser chips, and uses a feedback control mechanism to align the chips without the laser chip being powered.
➀ Surface emitting DFB lasers for short-distance applications, with features like single-mode and easy coupling;
➁ Utilizing PPR effect to increase DML bandwidth to 53GHz for short-distance LAN-WDM applications;
➂ High-power DFB sources using SCOW structure for silicon photonics applications, supporting full-temperature operation;
➃ Narrow linewidth O-band QD DFB laser with improved performance;
➄ Analysis of the performance of DFB lasers in various studies.
➀ UCSB is at the forefront of quantum dot laser research, aiming to apply the technology to silicon photonics platforms for high-quality, mass-producible chip-on-chip light sources;
➁ The research involves direct heteroepitaxy of quantum dot lasers on Si using metal-organic chemical vapor deposition, achieving room-temperature continuous-wave quantum dot lasers with high quality quantum dots and complete laser structures;
➂ Techniques such as nano V-grooves, thermal cycle annealing, and InGaAs/GaAs strain layer lattices are used to reduce surface defect density and enhance performance.
➀ The year 2024 has seen rapid commercialization of high-speed optical modules based on AI infrastructure, with many details of technical and viewpoints from various manufacturers.
➁ The theory of coherent modules is basically mature, and the industry is gradually optimizing and developing towards high bandwidth, high capacity, and low power consumption, including technologies such as C+L band amplifiers, large bandwidth InP technology, thin film lithium niobate technology, and silicon photonics.
➂ Next-generation high-capacity communication options include multi-core fibers and air-core fibers, which have theoretical advantages of low latency, high capacity, long distance, and high fidelity, but also face some research challenges.
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