➀ ASML and imec have signed a new strategic partnership agreement, focusing on research and sustainability.

➁ The agreement aims to deliver valuable solutions in two areas: advancing the semiconductor industry and developing sustainable innovation initiatives.

➂ The collaboration includes ASML's full product portfolio, focusing on high-end nodes and advanced technologies.

➀ STMicroelectronics has unveiled new silicon photonics and next-gen BiCMOS technologies aimed at enhancing optical interconnect performance in datacenters and AI clusters.

➁ These technologies, scheduled for production from H2 2025, will support 800Gb/s and 1.6Tb/s optical modules, addressing the growing demand for high-speed communication in AI-driven ecosystems.

➂ The collaboration with key partners like AWS is expected to drive innovation and market growth in silicon photonics and BiCMOS technologies for optical interconnects.

➀ STMicroelectronics has recently released new developments in its300mm silicon photonics platform, detailing its development history for reference.

➁ ST began collaborating with Luxtera in 2012 to develop a 12-inch silicon photonics platform under Luxtera's existing silicon photonics IP technology.

➂ ST showcased its silicon photonics platform progress at OFC 2015, using a 90nm process node and specific characteristics of its silicon waveguides and optical devices.

➃ Luxtera developed PSM4 and PSM8 products on ST's silicon photonics platform, but later partnered with TSMC, leading to better performance for Luxtera's devices.

➄ ST recently announced a new silicon photonics solution, PIC100, with improved device performance to meet 200G single-channel application needs.

➅ ST is also developing TSV and heterogeneous integration processes for 400G/lane applications.

➆ ST is targeting the 800G and 1.6T optical module market with its new BiCMOS platform B55X, and has announced a partnership with AWS.

➇ ST's silicon photonics platform has had a complex development, from its partnership with Luxtera to its current collaboration with AWS.

➀ The rapid development of data centers and the demand for faster and more efficient communication networks are driving the adoption of silicon photonics.

➁ Silicon photonic integrated circuits (PICs) combine the advantages of optics with the scalability of integrated circuits, enabling high-speed data transmission.

➂ The market for PICs is expected to grow significantly, driven by high-speed modules and expanding data centers.

➃ Major semiconductor companies, such as Intel and Broadcom, are investing heavily in silicon photonics technology.

➄ Newcomers like Lightmatter, Celestial AI, and Ayar Labs are also making significant contributions to the field.

➅ Semiconductor foundries are playing a crucial role in the production of silicon photonics products.

➀ IMEC has made progress on O-band GeSi QCSE EAMs on a 300mm silicon photonics platform.

➁ The new structure design of QCSE EAMs includes improvements to suppress p-type doping, adjust the p-region structure, and reduce metal absorption losses.

➂ The device demonstrates a 3dB bandwidth greater than 50GHz and a dynamic extinction ratio of 2.3dB at 64Gb/s.

➀ Silicon photonics heterogeneous integration: OpenLight Photonics demonstrates its tunable and DFB lasers based on silicon photonics heterogeneous integration on the Tower Semiconductor platform. Heterogeneous IIIV on silicon has started commercial use.

➁ Silicon photonics flip-chip bonding integration: Narrow linewidth external cavity tunable lasers are achieved using mature flip-chip bonding technology, with a key bonding precision of 700nm@3σ, reaching mass production level.

➂ Silicon photonics end-to-end hybrid integration: End-to-end coupling uses SSC to make ultra-low kappa grating performance external cavity. It has fast frequency sweep characteristics using LNOI, and is important for sensing applications.

➀ Introduction of wavelength locking chips based on silicon photonics, highlighting their trend, functionality, and challenges with temperature dependence.

➁ Discussion on passive optical isolators based on silicon photonics, focusing on optical Kerr effect and micro-ring resonators.

➂ Presentation of a tunable C+L band laser, featuring a novel TOSA with over 100nm tuning range and high output power.

➀ DustPhotonics is an Israeli silicon photonics chip design company founded in 2017, having raised $96 million in funding and launched the first commercial 1.6T silicon photonics optical engine in September 2023.

➁ The L3C technology, or Low Loss Laser Coupling, is introduced as a method for reducing coupling losses in optical links.

➂ The technology involves the design of auxiliary waveguides for alignment on PIC and laser chips, and uses a feedback control mechanism to align the chips without the laser chip being powered.

➀ Surface emitting DFB lasers for short-distance applications, with features like single-mode and easy coupling;

➁ Utilizing PPR effect to increase DML bandwidth to 53GHz for short-distance LAN-WDM applications;

➂ High-power DFB sources using SCOW structure for silicon photonics applications, supporting full-temperature operation;

➃ Narrow linewidth O-band QD DFB laser with improved performance;

➄ Analysis of the performance of DFB lasers in various studies.

➀ UCSB is at the forefront of quantum dot laser research, aiming to apply the technology to silicon photonics platforms for high-quality, mass-producible chip-on-chip light sources;

➁ The research involves direct heteroepitaxy of quantum dot lasers on Si using metal-organic chemical vapor deposition, achieving room-temperature continuous-wave quantum dot lasers with high quality quantum dots and complete laser structures;

➂ Techniques such as nano V-grooves, thermal cycle annealing, and InGaAs/GaAs strain layer lattices are used to reduce surface defect density and enhance performance.

➀ The year 2024 has seen rapid commercialization of high-speed optical modules based on AI infrastructure, with many details of technical and viewpoints from various manufacturers.

➁ The theory of coherent modules is basically mature, and the industry is gradually optimizing and developing towards high bandwidth, high capacity, and low power consumption, including technologies such as C+L band amplifiers, large bandwidth InP technology, thin film lithium niobate technology, and silicon photonics.

➂ Next-generation high-capacity communication options include multi-core fibers and air-core fibers, which have theoretical advantages of low latency, high capacity, long distance, and high fidelity, but also face some research challenges.