➀ CEA-Leti is developing optical interposers using silicon photonics; ➁ The new technology, called Starac, aims to reduce communication delays; ➂ Starac uses an ONoC for high-speed data transmission between chiplets without intermediate hops.
Recent #CEA-Leti news in the semiconductor industry
➀ CEA-Leti and Quobly have developed a novel solution using FD-SOI CMOS technology for simultaneous microsecond readouts of tens of quantum devices.
➁ The solution reduces readout power consumption by 10x and footprint by 2x.
➂ The proposed readout circuit based on a capacitive-feedback transimpedance amplifier (CTIA) achieves an 18.5μW/qubit power consumption.
➀ CEA-Leti's FAMES Pilot Line aims to enhance performance and reduce power consumption for mixed-signal circuits.
➁ The line focuses on five technology sets enabling new chip architectures, including FD-SOI at 10nm and 7nm, eNVM, RF components, 3D integration technologies, and small inductors.
➂ The technologies are expected to create market opportunities for various applications and will be accessible to researchers, SMEs, and industrial companies across Europe and partner countries.
➀ Researchers demonstrate active optical interposers for chiplet connectivity with minimal latency; ➁ CEA-Leti's Starac technology uses silicon photonics for improved performance and reduced latency; ➂ The technology aims to enable direct communication between chiplets, bypassing traditional routing methods.
1. CEA-Leti has developed an X-ray diffraction module for faster airport baggage scanning. 2. The module uses small-angle X-ray diffraction signals to identify substances in luggage. 3. Smiths Detection has implemented this technology in its new SDX 10060 XDi scanner.
1. CEA-Leti plans to construct an €830 million FD-SOI pilot line, focusing on 7nm and 10nm process nodes. 2. The project is part of four semiconductor pilot line initiatives by the European chip consortium Chip JU. 3. The pilot line will develop various technologies including eNVM memories, RF components, and 3D integration processes, aiming to enhance applications in low-power MCUs, AI/ML devices, and automotive chips.