1. CEA-Leti plans to construct an €830 million FD-SOI pilot line, focusing on 7nm and 10nm process nodes. 2. The project is part of four semiconductor pilot line initiatives by the European chip consortium Chip JU. 3. The pilot line will develop various technologies including eNVM memories, RF components, and 3D integration processes, aiming to enhance applications in low-power MCUs, AI/ML devices, and automotive chips.