<p>➀ CEA-Leti's FAMES Pilot Line aims to enhance performance and reduce power consumption for mixed-signal circuits.</p><p>➁ The line focuses on five technology sets enabling new chip architectures, including FD-SOI at 10nm and 7nm, eNVM, RF components, 3D integration technologies, and small inductors.</p><p>➂ The technologies are expected to create market opportunities for various applications and will be accessible to researchers, SMEs, and industrial companies across Europe and partner countries.</p>