<p>➀ Glass substrates are divided into two categories: replacing the core material with glass and replacing the interposer with glass.</p><p>➁ The benefits of glass interposers include higher productivity and reduced thickness, solving the challenge of via holes in semiconductor manufacturing.</p><p>➂ TSMC's SoW-X does not use FCBGA, instead using a different method for electrical and signal connections.</p><p>➃ Glass substrates are not expected to replace all current technologies due to high costs and technical challenges, but will still be needed for certain applications.</p>