➀ The 800G optical module is expected to start mass production in 2024 and see slow growth in 2027, with 1.6T modules expected to rapidly grow from 2026 with a long duration. ➁ Silicon photonics will continue to grow over the next 5 years and may surpass III-V materials, with LNOI seeing significant growth in 2027. ➂ Google promotes the use of optical switches for TPU supercomputing cluster networking at OFC2024, with optical switch shipments expected to grow continuously over the next 5 years.

➀ Updates on CUMEC's SIN on SOI platform, featuring 1.5dB/cm strip silicon waveguide and 2~3dB/cm strip SIN waveguide; ➁ Introduction of CUMEC's silicon photonics + TFLN hetero-integration technology platform with LN performance bandwidths; ➂ Advancements in wafer-level 3D integration advanced packaging processes and silicon bridge for chiplet integration; ➃ Qi Xin Optoelectronics' SINOI platform with SIN advantage and PLC benefit; ➄ SITRI's 90nm thin silicon integration process and wafer-level monolithic integration of silicon photonics chips with LN modulators; ➅ Jingsheng's LTOI wafer offering comparable electro-optical modulation efficiency to LNOI with lower cost; ➆ Luxtellence's LNOI foundry services and testing services; ➇ Ligentec's SIN platform with transmission loss <1dB/m and power handling capability >5W.

➀ Shenzhen University of Technology presented research on on-chip light sources, highlighting the trend towards smaller, lower energy, and higher bandwidth lasers; ➁ Beijing University of Posts and Telecommunications discussed silicon photonics integration chip design and application, emphasizing the use of micro-rings for refractive index monitoring and the optimization of single-mode bending waveguides; ➂ Zhejiang University introduced advancements in LNOI modulators based on hybrid integration, focusing on refractive index matching and light coupling between LN and SIN materials.

➀ Jifengshan Laboratory has achieved a breakthrough in silicon photonics integration by successfully lighting up laser sources within silicon-based chips for the first time in China; ➁ The technology is essential for overcoming the challenges of Moore's Law and meeting the growing demand for chip computing power; ➂ The lab, dedicated to compound semiconductor research has collaborated with over 30 semiconductor companies and has trained more than 30,000 professionals in the field; ➃ Key partnerships include Shanghai Bangxin Semiconductor Technology Co., Ltd., Wuhan Yitiannuo Technology Co., Ltd., and Huaqiao Technology, which have contributed to the development of advanced semiconductor equipment and technologies.

➀ JFS Laboratory, a Chinese government-backed company, has developed a silicon photonics chip, marking a first for the country; ➁ The chip is expected to have advantages over traditional chips in high-performance applications like AI and HPC; ➂ The breakthrough is significant in the context of sanctions against China and the inability to produce high-performance processors.

➀ China's JFS Laboratory has achieved a milestone in the development of silicon photonics, potentially helping the country overcome current technical barriers in chip design. ➁ The lab successfully integrated a laser light source with a silicon-based chip, a first in China. ➃ This breakthrough fills a gap in China's optoelectronics technology and addresses the limitations of current technology in signal transmission.

➀ The commercial light source integration solutions are based on bonding technology, with advantages in high-precision alignment but high cleanliness requirements. ➁ On-chip direct growth on large silicon wafers offers potential low cost and CMOS compatibility, but challenges in epitaxy. ➂ A two-step growth technique is used to address fitting issues, with GaAs-on-V-groove Si (GoVs) as the mainstream template technique. ➃ A new bufferless solution with lateral growth is proposed, with advantages in defect limitation and easier coupling with silicon-based devices. ➄ Room-temperature lasing at 1500 nm波段 is achieved under optical pumping conditions, and the laser peak is related to the cavity length. ➅ PDs with excellent performance in terms of dark current, bandwidth, and responsivity are demonstrated.

➀ Researchers demonstrate active optical interposers for chiplet connectivity with minimal latency; ➁ CEA-Leti's Starac technology uses silicon photonics for improved performance and reduced latency; ➂ The technology aims to enable direct communication between chiplets, bypassing traditional routing methods.

➀ Shiguang Semiconductor presents an interesting report on InP+Silicon Photonics solutions for AI data centers; ➁ The company focuses on SOA and Gain chip development, collaborating with AMF to develop on-chip light source solutions; ➂ The report discusses the application of silicon photonics in data centers, highlighting issues and solutions in light sources; ➃ Shiguang Semiconductor's main products include SOA and DFB, with specifications such as center wavelength, bandwidth, and power output.

➀ Yuan Cheng Semiconductor, a Taiwanese silicon photonics company, has partnered with AMD for research and development of next-generation silicon photonics technology; ➁ Chen Xianwei, the co-founder of Yuan Cheng Semiconductor, has a background in investment and finance, and sees the future in 'light'; ➂ Yuan Cheng Semiconductor aims to have its own manufacturing capabilities and has acquired Shianfa Optoelectronics, a laser epitaxy factory.

➀ Jiu Feng Mountain Laboratory achieves a breakthrough in the field of silicon photonics integration by successfully lighting up a laser source integrated into a silicon-based chip, the first of its kind in China. This achievement uses a self-developed heterogeneous integration technology and completes the process of phosphorus indium laser diode integration within an 8-inch SOI wafer. This technology, known as 'chip light output,' replaces electrical signals with better-performing optical signals for transmission, which is a crucial means to revolutionize inter-chip signal data transmission. It aims to solve the issue of electrical signals approaching their physical limits. This breakthrough will have a revolutionary impact on data centers, computing centers, CPU/GPU chips, AI chips, and other fields. ➁ The technology is considered an ideal solution for breaking through the bottlenecks of power consumption, bandwidth, and delay in the post-Moore era. The key challenge lies in the development and integration of silicon-based chip-on-chip light sources. This technology is one of the few blank spots in China's optoelectronics field. ➂ The technology can effectively solve the problems of insufficient coupling efficiency, long alignment adjustment time, and insufficient alignment accuracy in traditional silicon photonics chips, breaking through the production bottleneck of high cost, large size, and difficulty in large-scale integration.

➀ The article discusses the evolving role of optical chips in data communication, highlighting the shift from long-distance fiber optics to short-distance interconnects within data centers. ➁ It analyzes the changing demands of data centers, such as reducing power consumption and cost, and the introduction of new technologies like CPO (Co-Package Optics) to meet these demands. ➂ The article explores Intel's approach to optical interconnects, including the use of chiplets and the challenges of integrating electronics and optics on a single silicon wafer. ➃ It also touches on the history of Intel's Knights Hill project and its cancellation, and the current state of optical computing, including the development of optical processors and quantum computers.

➀ LIGHTWAVELOGIC focuses on 1.6T PIC chips based on EO polymer modulators, addressing issues of LNOI incompatibility with traditional CMOS processes and bandwidth density limitations in silicon photonics. The EO polymer technology is expected to be compatible with silicon photonics factories while maintaining excellent bandwidth performance. ➁ Polymer modulators based on hetero-integration technology feature low drive voltage (Vpi<1V), low power consumption, and high density, along with very high bandwidth (70-100GHz) and ease of manufacturing on silicon wafers. ➂ The EO bandwidth of 86GHz allows for a single wave 200GHz eye diagram with drive voltage less than 1V, suitable for 4*200G 800G optical modules. This bandwidth is also suitable for single wave 400G applications and can be used for 4*400G 1.6T optical modules. ➃ Device long-term reliability is demonstrated with Vpi stability after 6000 hours, with less than 1.2% change. Device long-term light stability is not an issue when protected by O2.

➀ Many manufacturers demonstrate single-wavelength 200GHz silicon photonics with impressive performance; ➁ Companies like Xihe, Sicoya, SiFotonics, POET, and HuaGong ZhengYuan showcase advanced silicon photonics technologies; ➂ The industry is pushing for higher bandwidths and lower power consumption with the potential for single-wavelength 400GHz silicon photonics.

➀ Over 30 leading companies from Taiwan, including TSMC, have formed the Silicon Photonics Industry Alliance (SiPhIA); ➁ The alliance aims to promote specifications for related technologies; ➂ The announcement was made at SEMICON Taiwan.

➀ TSMC, Vanguard, and Wim Semiconductor join the alliance for wafer processing; ➁ Synopsys as the only EDA company in the alliance; ➂ C SUN, GPTC, and Scientech provide semiconductor manufacturing equipment; ➃ AUTHENX, MediaTek, and Motech focus on chip design; ➄ MPI, WinWay, and FitTech offer probe cards and wafer testing equipment; ➅ BizLink, LUXNET, Artilux, and eLaser produce optoelectronic devices; ➆ APAC Opto, Centera, FOXCONN, and PCL manufacture optical modules; ➇ Quanta Computer is the only system manufacturer.

➀ Meta Platforms identifies a widening gap between computing power and interconnect bandwidth at the 2022 OCP Global Summit. ➁ Broadcom proposes SCIP (Silicon Photonics in Package) as a solution to bridge this gap, focusing on low-cost, high-performance, and low-power interconnects. ➂ SCIP utilizes TSV technology and detachable optical connectors to achieve shorter interconnect distances and higher energy efficiency, targeting AI and machine learning applications.

➀ Hisense Technology reported a 10.48% increase in revenue for H1 2024, reaching 3.11 billion yuan, but a 12.64% decrease in net profit to 209 million yuan. ➁ The company anticipates a significant increase in capacity in H2 2024, with new equipment arriving and new facilities becoming operational. ➂ AI-driven demand from internet companies is high, but delivery remains a bottleneck, with tight supply of optical modules. ➃ Silicon photonics technology is expected to alleviate some pressure from EML solutions, with Hisense having a strong track record in this area.

➀ Researchers at Sandia National Laboratories have utilized silicon photonics for atom interferometry, a quantum sensing technique that measures acceleration with high precision, potentially enabling a quantum compass for navigation without GPS. ➁ The team has made significant strides in miniaturizing the atom interferometer, reducing its size, weight, and power requirements, and improving the performance of the modulators used in the laser system. ➂ The advancements in silicon photonics could lead to cost-effective mass production of quantum inertial measurement units, opening up new applications in navigation, underground resource detection, and other fields.

1. Silicon photonics merges optics with silicon to enable data transfer at the speed of light. 2. This technology originated in the 1980s and is crucial in microelectronics. 3. It provides faster data transfer rates and lower power consumption than electronic-only systems.