➀ Meta Platforms identifies a widening gap between computing power and interconnect bandwidth at the 2022 OCP Global Summit. ➁ Broadcom proposes SCIP (Silicon Photonics in Package) as a solution to bridge this gap, focusing on low-cost, high-performance, and low-power interconnects. ➂ SCIP utilizes TSV technology and detachable optical connectors to achieve shorter interconnect distances and higher energy efficiency, targeting AI and machine learning applications.