➀ Updates on CUMEC's SIN on SOI platform, featuring 1.5dB/cm strip silicon waveguide and 2~3dB/cm strip SIN waveguide; ➁ Introduction of CUMEC's silicon photonics + TFLN hetero-integration technology platform with LN performance bandwidths; ➂ Advancements in wafer-level 3D integration advanced packaging processes and silicon bridge for chiplet integration; ➃ Qi Xin Optoelectronics' SINOI platform with SIN advantage and PLC benefit; ➄ SITRI's 90nm thin silicon integration process and wafer-level monolithic integration of silicon photonics chips with LN modulators; ➅ Jingsheng's LTOI wafer offering comparable electro-optical modulation efficiency to LNOI with lower cost; ➆ Luxtellence's LNOI foundry services and testing services; ➇ Ligentec's SIN platform with transmission loss <1dB/m and power handling capability >5W.