➀ STMicroelectronics launches the STDRIVEG211 and STDRIVEG210 GaN half-bridge driver chips for industrial and telecom power supplies, supporting 72V batteries and 110V AC lines with a 220V maximum rail voltage;

➁ The STDRIVEG211 features 6V gate protection, short-circuit detection via an external comparator, and automatic shutdown, while the STDRIVEG210 omits the comparator for applications like solar inverters;

➂ Designed for resonant/hard-switching power supplies, motor drives, and Class-D amplifiers, the chips offer 2.4A drive current, thermal protection, and optimized gate control with a 5x4mm QFN package.

➀ STMicroelectronics' STEVAL-IOD04KT1 reference design simplifies industrial sensor network development by integrating IO-Link, reducing MCU workload, and improving power efficiency;

➁ The design features a dual-channel transceiver, MEMS sensors (3-axis magnetic sensor, iNEMO inertial module), and robust hardware with ±2.5kV surge protection for harsh environments;

➂ Includes full software support (IO-Link stack, IODD files) and PCB design resources, enabling rapid prototyping and deployment of industrial IoT applications.

➀ The UK and US announced a $42 billion 'Tech Prosperity Deal' with Nvidia deploying 120,000 GPUs to support AI and quantum computing initiatives;

➁ STMicroelectronics reached agreements to avoid layoffs at its Agrate site in Italy and unveiled a $60 million investment in a Panel-Level-Packaging (PLP) production line in France;

➂ China launched an anti-dumping probe targeting US analog ICs using 40nm and above process technologies.

➀ AI accelerates semiconductor R&D through automated analog/digital design flows, reducing analog design time from months to days;

➁ STMicroelectronics employs AI for eco-design, optimizing energy use in chips and enabling green technologies like smart grids and solar farms;

➂ Federated learning proposed for academic prototyping, allowing collaborative AI model training while protecting sensitive chip design/IP data.

➀ EIS enhances Li-ion battery management in EVs by analyzing electrochemical parameters, enabling optimized safety and performance through sensor fusion and AI algorithms.

➁ EIS enables early prediction of thermal runaway, a critical safety requirement under China's GB 38031-2020 standard, reducing reliance on physical sensors and improving cell utilization.

➂ EIS dynamically adjusts fast-charging profiles based on real-time cell state, proposing implementation models like centralized or localized excitation to balance cost and efficiency.

➀ STMicroelectronics (ST) plans to acquire NXP’s MEMS sensor business for up to $950 million, with $900 million upfront and $50 million tied to technical milestones.

➁ The acquisition combines complementary MEMS technologies, enhancing ST’s portfolio across automotive safety, industrial, and consumer markets, leveraging ST’s IDM model for faster innovation.

➂ NXP’s MEMS division generated $300 million in 2024 revenue, with margins accretive to ST; the deal is expected to boost ST’s EPS and strengthen its position in automotive sensors and advanced MEMS applications.

➀ STMicroelectronics launched the STGWA30IH160DF2, a 1.6kV IGBT in TO-247 packaging targeting induction hobs and microwaves, featuring high thermal performance and compatibility with soft-switching topologies;

➁ The device offers a 30A nominal current rating, 175°C junction temperature capability, low Vce(sat) (1.77V typical) for reduced conduction loss, and a soft-recovery anti-parallel diode for resonant converter efficiency;

➂ Designed for easy paralleling with stable temperature coefficients, it supports single-switch quasi-resonant converters at 16-60kHz and emphasizes applications in domestic appliances.

➀ Mouser's robotics resource center provides engineers with tools for robotics engineering, covering domains like soft robotics, autonomous cleaning, and collaborative robots (cobots);

➁ The platform includes AI and machine learning-driven advancements, enabling smarter robots for industrial automation and human-robot collaboration;

➂ Featured products include Analog Devices' GMSL robotics platform, STMicroelectronics' ToF sensor, Broadcom's magnetic encoders, and Renesas' high-performance microcontrollers for AI and robotics applications.

➀ STMicroelectronics introduced Stellar with xMemory, an embedded memory technology for automotive microcontrollers, aiming to streamline EV and software-defined vehicle development;

➁ The solution offers flexible, scalable memory using Phase Change Memory (PCM), reducing costs, testing efforts, and enabling future software updates without hardware changes;

➂ It supports a single hardware platform for multiple car models, enhancing adaptability and accelerating time-to-market for next-gen automotive systems.

➀ STMicroelectronics reported Q1 revenues of $2.52 billion with a gross margin of 33.4% and an operating income of $3 million. Net income was $56 million.

➁ The company expects Q2 net revenues of $2.71 billion and a gross margin of 33.4%. A company-wide program to resize the company is expected to save in the high triple-digit million-dollar range by 2027.

➂ CEO Jean-Marc Chery highlighted the improvement in the book-to-bill ratio for Automotive and Industrial segments and the focus on innovation and cost management in the uncertain environment.

➀ STMicroelectronics has introduced a 2.1MHz bandwidth low-side current-measurement amplifier in a 6-lead SOT23 package.

➁ The TSC1801 is aimed at motor control, solar power and automotive power conditioning.

➂ It provides 20V/V gain and 0.15% accuracy over the entire temperature range, with a maximum offset voltage of ±200μV.

➀ TSMC正在与Nvidia、Broadcom、Qualcomm和AMD讨论收购英特尔晶圆厂的合资企业；

➁ Sanan Optoelectronics和STMicroelectronics在重庆合资建立了32亿美元的碳化硅晶圆厂；

➂ 本周嵌入式世界2025展会的最新电子新闻综述；

➃ 德州仪器宣布其最新的微控制器是“世界上最小”的，尺寸为1.6 x 0.86mm；

➄ 美国总统特朗普对格罗夫之后英特尔CEO的表现持批评态度。

ST has introduced hardware cryptographic accelerators and associated software libraries for general-purpose and secure MCUs. The need for standardizing Post-Quantum Cryptography (PQC) involves using new techniques based on mathematical problems that are hard for quantum computers to solve. ST's offerings include the Keccak algorithm, a hash algorithm invented by ST, and are available through the X-CUBE-PQC software library for STM32 developers and the SHA-3 hardware accelerator in Stellar automotive microcontrollers. New software libraries and hardware IPs are also provided for secure microcontrollers, targeting Common Criteria and FIPS 140-3, and PQC algorithms like ML-KEM, ML-DSA, and XMSS/LMS.

➀ An inauguration ceremony has been held for a $3.2 billion SiC fab in Chongqing, China, a joint venture between Sanan Optoelectronics and STMicroelectronics.

➁ Sanan holds a 51% stake, with ST holding 49%. The fab is expected to start volume production of 8” SiC ICs in Q4 2025 using ST's SiC process technology.

➂ When fully operational in 2028, the fab will have a capacity of 40k wpm. Sanan will also build an 8-inch SiC substrate facility to supply wafers to the JV under a long-term agreement.

➀ The launch of the Electronics Weekly CHIIPS podcast featuring an interview with Harriet Green.

➁ TSMC's $100bn investment in Arizona to avoid Trump Tariffs.

➂ ST pairing near-threshold logic with a Cortex-M33 core for energy-efficient microcontrollers.

➃ UK's Westcott Drone Test and Development Centre receives £1.4m funding for facility upgrades.

➀ STMicroelectronics has unveiled new silicon photonics and next-gen BiCMOS technologies aimed at enhancing optical interconnect performance in datacenters and AI clusters.

➁ These technologies, scheduled for production from H2 2025, will support 800Gb/s and 1.6Tb/s optical modules, addressing the growing demand for high-speed communication in AI-driven ecosystems.

➂ The collaboration with key partners like AWS is expected to drive innovation and market growth in silicon photonics and BiCMOS technologies for optical interconnects.

➀ STMicroelectronics has recently released new developments in its300mm silicon photonics platform, detailing its development history for reference.

➁ ST began collaborating with Luxtera in 2012 to develop a 12-inch silicon photonics platform under Luxtera's existing silicon photonics IP technology.

➂ ST showcased its silicon photonics platform progress at OFC 2015, using a 90nm process node and specific characteristics of its silicon waveguides and optical devices.

➃ Luxtera developed PSM4 and PSM8 products on ST's silicon photonics platform, but later partnered with TSMC, leading to better performance for Luxtera's devices.

➄ ST recently announced a new silicon photonics solution, PIC100, with improved device performance to meet 200G single-channel application needs.

➅ ST is also developing TSV and heterogeneous integration processes for 400G/lane applications.

➆ ST is targeting the 800G and 1.6T optical module market with its new BiCMOS platform B55X, and has announced a partnership with AWS.

➇ ST's silicon photonics platform has had a complex development, from its partnership with Luxtera to its current collaboration with AWS.

➀ STMicroelectronics has introduced a 1A buck converter, the DCP3601, for low-voltage loads in smart meters, home appliances, and industrial converters;

➁ The converter boasts over 90% efficiency and requires only six components to complete the circuit;

➂ It offers a 3.3V-to-36V input voltage range and 1A output capability, suitable for various applications including smart meters and domestic appliances.

➀ The Italian government is reportedly using the current downturn in the chip market to replace ST's French CEO, Jean-Marc Chéry, according to Les Echos.

➁ Despite both governments holding a 27.5% stake in ST, the Italian government believes the CEO should be Italian.

➂ This follows a history of Italian CEOs at ST, with the current French CEO, Chéry, being appointed after a months-long stalemate.

STMicroelectronics and HighTec EDV-Systeme have combined HighTec’s Rust compiler with ST’s Stellar 28nm MCUs to provide safety-critical systems in software-defined vehicles. Rust ensures the resilience of critical automotive systems with its memory safety, thread safety, and data type safety provisions, while maintaining runtime efficiency comparable to C/C++. HighTec’s compiler suite allows for the integration of Rust’s safety features with legacy C/C++ code for automotive applications. The Stellar MCUs are built on Arm Cortex R52+ cores and comply with ISO 21434 cybersecurity standards and UN155 requirements.