➀ South Korean fab equipment maker Justem is developing hybrid bonding equipment for future high-bandwidth memory (HBM) applications;

➁ The company secured a 14 billion won (approx. $10.2 million) government-supported project, with 7.5 billion won in direct funding from South Korea's Ministry of Trade, Industry and Energy;

➂ This initiative aims to advance hybrid bonding technology critical for next-generation memory manufacturing, with prototype development expected by 2026.

➀ ATLANT 3D developed DALP® technology to enable atomic-scale manufacturing, reducing material waste by 90% and accelerating materials discovery;

➁ The company targets semiconductor manufacturing, space exploration, and quantum computing, collaborating with ESA for zero-gravity fabrication systems;

➂ Its platform supports U.S. domestic semiconductor resilience by decentralizing production and integrating academic/industrial R&D.

➀ KD specializes in automotive optical networking solutions, addressing challenges like electromagnetic interference and extreme temperatures in harsh environments.

➁ The company develops integrated optoelectronic components compliant with IEEE 802.3cz, focusing on CMOS-based single-chip solutions and hybrid packaging for automated high-volume production by 2026.

➂ KD's technology supports applications in ADAS, industrial automation, and consumer connectivity, offering advantages over copper in reliability, cost, and performance.