➀ POLYN Technology has validated its Neuromorphic Analogue Signal Processing (NASP) chip, which performs AI inference in the analog domain with microwatt-level power consumption, significantly lower than digital processors;

➁ The NASP platform processes sensor signals in their native analog form, targeting always-on edge devices for applications like wearables, automotive sensing, and robotics;

➂ The first chip features a Voice Activity Detection (VAD) core, with future plans for speaker recognition and voice extraction, and evaluation kits are now available for ultra-low-power voice control development.

➀ French company Vsora announced the production of its Jotunn8 AI inference chip, targeting data centers with claims of energy efficiency and high performance (3,200 Tflop);

➁ The company emphasizes Europe's technological competitiveness but lacks details on floating-point operation type and power consumption benchmarks;

➂ Full-scale production is scheduled for Q1 2026, backed by $46 million in recent funding.

➀ Upbeat Technology and SiFive collaborate on a dual-core RISC-V MCU family (UP201/UP301) featuring AI accelerators for ultra-low-power edge AI applications.

➀ Delivers 16.8 μW/MHz/DMIPS energy efficiency, 400 MHz clock speed, and advanced error correction for resilient near-threshold operation in wearables, drones, and IoT systems.

➂ Live demos at RISC-V Summit highlight performance, with engineering samples and SDKs available to enable next-gen battery-optimized AI designs.

➀ Broadcom and OpenAI partner to develop 6GW of custom AI accelerators, with OpenAI designing the chips and Broadcom handling development and deployment;

➀ The collaboration leverages Broadcom's Ethernet and connectivity solutions to build scalable AI infrastructure, supported by a long-term co-development agreement;

➂ Leaders from both companies emphasize the partnership's role in advancing AI capabilities, optimizing performance, and supporting OpenAI's mission to benefit humanity through artificial general intelligence (AGI).

➀ HarmonEyes collaborates with NASA-funded TRISH to deploy its H-SMART eye-tracking system in Antarctica, aiming to predict astronauts' cognitive load and fatigue in real time.

➁ The Antarctic environment, simulating deep space conditions, will test the system’s unobtrusive design for monitoring mental states during high-stakes missions.

➂ The technology aims to enhance mission safety for lunar and Mars expeditions, with adaptable hardware and software for diverse applications.

➀ A Singaporean company, Megaspeed, allegedly used U.S.-based subsidiaries and shell entities to bypass sanctions and export $2B worth of restricted NVIDIA AI GPUs (H100/H800) to China;

➁ Investigations revealed suspicious practices, including sealed GPU crates in Malaysian data centers and empty offices linked to Chinese shell firms;

➂ NVIDIA denies direct China ties, but U.S. officials challenge the legitimacy of sales involving sanctioned entities like Inspur's subsidiary Aivres.

➀ SecureFoundry introduces a hyper-beam array (HBA) lithography system with 65,000 independently controlled beams, patterning a 100mm wafer in 15 minutes for AI chip prototyping and wafer-scale integration;

➁ The tool operates at 22nm with no field size limits, targeting low-to-medium volume production to reduce R&D and IP commercialization costs;

➂ CEO Lex Keen discusses shifts in U.S. Chips Act funding priorities, emphasizing renewed focus on innovation grants for smaller firms over large-fab subsidies.

➀ The U.S. has approved NVIDIA to export billions in AI GPUs to the UAE, with initial deployments managed by U.S.-operated datacenters;

➁ The deal allows the UAE to purchase 500,000 Blackwell GPUs annually alongside a $1.4 trillion U.S. investment commitment, while G42 will receive 20% of future shipments;

➂ The agreement reflects U.S. 'AI diplomacy' to counter China's regional influence, but faces criticism over lax security safeguards.

➀ Samtec's CPX (Co-Packaged Copper and Optics) integrates copper and optical interconnects to overcome limitations in high-speed data transmission at 224 Gbps.

➁ Matt Burns will present practical strategies for copper's short-reach superiority (up to 1.5m with CPC) and optical's long-reach scalability (CPO), addressing AI/data center challenges.

➂ Samtec's Si-Fly® HD platform enables hybrid CPX deployment on ultra-dense substrates, exemplified by collaborations with system OEMs and Synopsys.

➀ Alchip and Ayar Labs collaborate to address AI data bottlenecks with co-packaged optics (CPO), replacing traditional copper I/O for 10x power efficiency gains;

➁ Ayar Labs' TeraPHY optical engines enable 100-200ns latency and over 100 Tbps bandwidth via UCIe-A protocol, while Alchip’s chiplets optimize signal integrity;

➂ The solution enhances AI scalability, reducing deployment costs by 30-50% and enabling exascale real-time inference through composable photonics-driven architectures.

➀ Synopsys demonstrated AI-driven end-to-end solutions for chip development at the AI Infra Summit 2025, addressing energy efficiency, design acceleration, and verification demands.

➁ AI-guided EDA tools reduce chip design time by up to 40% and optimize power consumption via techniques like ML-based synthesis and 3D chiplet integration.

➂ Hardware-assisted verification platforms (ZeBu, HAPS) enable quadrillion-cycle testing for complex datacenter chips, supported by collaborations with NVIDIA, AMD, and cloud providers.

➀ Yuning Liang, founder of DeepComputing, pioneered a modular RISC-V laptop design enabling component upgrades, driven by his software-to-hardware career shift and partnerships with companies like Framework.

➁ The project faced technical and geopolitical motivations, leveraging RISC-V to bypass chip trade restrictions and fostering open-source hardware collaboration, though early prototypes like the $5,000 Roma laptop faced financial challenges.

➂ Key hurdles include software ecosystem gaps (e.g., Chromium’s lack of native RISC-V support) and scaling efforts through community-driven initiatives like RISE to integrate RISC-V into mainstream infrastructure.

➀ AI is revolutionizing chip design by reducing development time by up to 40% through cloud-based EDA tools and automated verification processes, enabling startups to compete with industry giants;

➁ The semiconductor industry faces a critical talent shortage (projected 1M skilled workers deficit by 2030) that threatens innovation, while cloud infrastructure emerges as a democratizing force providing equitable access to cutting-edge design resources;

➂ Despite AI's transformative impact, human expertise remains irreplaceable in architectural innovation, with the future vision pointing towards "Chip as a Service" models that could compress development cycles from years to months.

➀ Semiconductor manufacturing faces escalating challenges due to 3D IC complexity and global supply chain demands, with PDF Solutions addressing these through advanced data platforms;

➁ PDF introduces Exensio® Analytics Platform and DEX to enable real-time data collection & AI-driven test optimization, reducing costs while improving yield and reliability;

➂ The Data Feed Forward (DFF) framework utilizes upstream test data to dynamically adjust downstream testing strategies, marking a shift toward AI-driven manufacturing ecosystems.

➀ NVIDIA and Cadence collaborate to address critical pre-silicon power estimation challenges for AI chips through advanced emulation and DPA technology;

➁ Traditional power estimation methods face scalability and accuracy limitations with AI's billion-gate designs and complex workloads, necessitating gate-level analysis with full benchmark coverage;

➂ Cadence's new DPA App on Palladium Z3 achieves 97% post-silicon power correlation by executing billion-cycle emulations in hours, enabling precise optimization for energy-efficient AI hardware design.

➀ Neil Druckmann discussed the evolving role of storytelling in video games with screenwriter Alex Garland, reflecting on the challenges and inspirations around narratives in games.

➁ Games like BioShock and The Last of Us demonstrated the full capability of narrative in gaming, challenging the industry's skepticism.

➂ Druckmann shared his early inspirations for narrative-driven games, including Monkey Island 2 and Half-Life 2.

➀ Reputable leaker Billbil-Kun reports that Death Stranding 2 pre-orders are expected to start in March, with a release date likely announced at SXSW 2025.

➁ The game will have a Standard Edition at $69.99 and a Collector's Edition at $229.

➂ The leak also confirms that Death Stranding 2 will launch with a physical Standard Edition, priced at $69.99 USD / 69.99 EUR, along with a Collector's Edition planned for North America and Europe, retailing at $229 USD.

➀ Dr. Prady Gupta is the Founder and Chief Scientist at Infinita Lab and Infinita Materials, focusing on materials testing and specialized chemicals for high-tech industries.

➁ Infinita Lab offers a network of over 2,000 accredited labs for comprehensive materials testing services.

➂ Infinita Materials specializes in custom inorganic chemicals for sectors like semiconductors and batteries.

➀ This paper discusses the post-silicon validation of the IBM POWER9 processor, highlighting its significance in the context of increasing multi-core processor adoption by hyperscalers.

➁ IBM's Threadmill, a tool for processor verification, has been enhanced since the POWER7, including optimized template allocation and debugging strategies for multi-core write drops.

➂ The validation methodology for POWER9 has significantly improved bug detection rates compared to POWER8, with new techniques like AI prioritization and hardware irritators to induce bugs.

➀ Traditional RF board design strategies are insufficient for high frequencies and dense layouts;

➁ Keysight and Modelithics collaborate on an advanced RF board simulation workflow;

➂ The use of 3D passive component models enhances simulation accuracy and reduces the risk of board re-spins.