➀ Infineon launched the CoolSiC MOSFET 1200 V G2 in a top-side-cooled Q-DPAK package, targeting industrial applications like EV chargers and solar inverters;

➁ The new generation reduces switching losses by 25%, improves thermal resistance by over 15%, and supports operation up to 200°C junction temperature;

➂ Enhanced package design enables compact heat dissipation, minimized parasitic inductance, and compatibility with automated manufacturing for scalable solutions.

➀ Yole predicts the SiC market will grow at a 20% CAGR through 2030 to reach $10.3 billion, driven by automotive electrification and industrial diversification despite a short-term EV slowdown;

➁ Automotive remains the dominant sector (70% demand), while SiC adoption in 800V EV platforms and datacenters ($200M opportunity) accelerates;

➂ Transition to 8″ wafers progresses with Infineon and Wolfspeed leading, while global SiC investments exceed $30B, focusing on supply chain resilience and China's domestic production.

➀ Infineon Technologies collaborates with CIS Corporation to launch high-speed USB cameras powered by EZ-USB FX10/FX5 controllers, achieving up to 275% faster data transfer via USB 3.2 (5/10 Gbit/s);

➁ Integrated USB-C orientation detection and compact design reduce component needs, lowering costs and enabling deployment in medical, logistics, and robotics applications;

➂ Models with resolutions up to 20M pixels and 4K support will enter production in July, featuring CIS's Clairivu image processor and ultra-compact form factors.

➀ Infineon launched the automotive PSOC 4 HVMS MCU family with capacitive touch sensing, featuring Arm Cortex-M0+ processors (24/48MHz), up to 128KB flash memory, and 4.5-28V direct battery connectivity via integrated LDO.

➁ The MCUs support touch interfaces for steering wheels, door handles, and in-cabin controls, with ISO 26262 ASIL B functional safety, transient voltage protection, and autonomous capacitive scanning via a 5th-gen multi-sense converter.

➂ Available in wettable-flank QFN packages (6x6mm to 9x9mm) and equipped with LIN/CXPI communication, ADC, and safety-focused software libraries for automotive HMI applications.

➀ Most commodity components (standard logic, MCUs, etc.) have stabilized in lead times and pricing due to inventory adjustments and conservative procurement, while AI/ML/HPC-related components (DDR5, HBM, SSDs) face tightening supply and rising prices;

➁ Lead times vary across categories: volatile memory (2-22 weeks), storage (6-12 weeks), advanced analog (7-48 weeks), with interconnect prices expected to rise;

➂ External risks like tariffs could disrupt the stabilized supply chain, and procurement remains cautious about long-term orders amid fluctuating demand.

➀ Infineon's REF_600W_FBFB_XDPP1100 is a 600 W isolated DC-DC reference design targeting telecom, server, and industrial applications, utilizing a digital-controlled full-bridge topology with 96% peak efficiency and 22 W/cm³ power density;

➁ The design integrates XDPP1100 digital controller, OptiMOS MOSFETs, and EiceDRIVER gate drivers, supporting 36-72 V input range, PMBus/I2C communication, and ±1% output voltage accuracy across -40°C to 125°C;

➂ Features include fast transient response, active current sharing, GUI-based customization, and reduced BOM, with full design documentation available for accelerated development.

➀ Nvidia announced the Grace Blackwell Ultra AI chip (GB300) shipping in Q3 and a 4x performance boost in its RTX Pro Server for AI models;

➁ Nvidia and Infineon collaborated on centralized 800V HVDC power architecture for AI data centers to optimize space and efficiency;

➂ Wolfspeed faces bankruptcy due to $6.5B debt and loss of key clients like Tesla and Volkswagen, reducing its SiC market share from 32% to 19%.

➀ Nvidia and Infineon collaborate to develop a centralized 800V HVDC power architecture for AI data centers, aiming to replace decentralized AC/DC systems and reduce energy losses;

➀ The new approach minimizes power conversion stages, improves efficiency, and supports higher power densities (projected over 1MW per rack by 2030), critical for large-scale AI workloads involving 100,000+ GPUs;

➂ Centralized HVDC enhances scalability, reliability, and sustainability while meeting the performance demands of next-gen AI infrastructure.

➀ Infineon introduces the CoolGaN Bidirectional Switch 650 V G5, a GaN-based device enabling bidirectional voltage and current blocking through monolithic integration;

➀ The switch simplifies power converters by replacing traditional back-to-back setups, enhancing efficiency, reliability, and compactness for solar microinverters, EV charging, and data centers;

➀ Supports grid features like reactive power compensation and bidirectional power flow while reducing component count and manufacturing costs.

➀ Infineon reported fiscal Q2 2025 revenue of €3.591 billion with a 16.7% margin, projecting Q3 revenue of €3.7 billion and mid-teens margins;

➁ The company revised its FY 2025 outlook to a slight revenue decline due to a 10% cut in Q4 expectations, driven by tariff disputes, despite stable order intake;

➂ Capex reduced to €2.3 billion, with adjusted free cash flow at €1.6 billion and reported free cash flow unchanged at €900 million.

➀ Infineon's OptiMOS™ 6 80V MOSFETs enhance DC-DC power conversion efficiency in AI servers, achieving 0.4% higher efficiency and saving 4.3W per kW load;

➁ The solution reduces energy consumption by over 1.2 MWh/hour in large data centers and supports dual-side cooling for improved thermal management;

➂ Its compact 5×6 mm² design enables higher power density, addressing space constraints in AI infrastructure.

➀ Infineon launched its CoolSiC MOSFET 750 V G2 technology, enhancing system efficiency and power density for automotive and industrial power conversion applications;

➁ The MOSFETs feature R_DS(on) values up to 60 mΩ, support top-side cooling for thermal performance, and reduce switching losses through optimized gate charge and design;

➂ Compliant with AEC Q101 and JEDEC standards, the technology targets applications like EV chargers, solar inverters, and solid-state relays, emphasizing reliability and design flexibility.

➀ Researchers have developed a novel hybrid material that doubles thermoelectric efficiency by separating heat and electrical charge transport.

➁ The hybrid material combines an alloy of iron, vanadium, tantalum, and aluminum with a bismuth-antimony mixture, forming a compact structure that enhances energy conversion.

➂ This breakthrough could lead to more efficient energy harvesting in miniaturized electronics, especially for IoT devices, offering both performance and cost-effectiveness.

➀ A prototype for an E-Bike terminal has been developed at the Hochschule Karlsruhe (HKA) as part of a project aiming for sustainable mobility;

➁ The terminal is constructed primarily from renewable resources (wood) and is designed to be replicable in other locations;

➂ The project includes a solar power system to charge the E-bikes and features social components such as a meeting point for students and staff.

➀ This study explores the development of chitosan-silanized hexagonal boron nitride (hBN) nanocomposite films;

➁ It focuses on their structural, mechanical, and barrier properties;

➂ The research aims to enhance the performance of biodegradable polymer films, overcoming limitations of chitosan.

➀ Infineon Technologies AG has unveiled the world's first industrial-grade GaN transistor family with an integrated Schottky diode.

➁ This innovation, called CoolGaN Transistor G5 series, enhances efficiency and simplifies design for various industrial applications.

➂ It targets telecom, servers, DC-DC converters, USB-C chargers, PSUs, and motor drives, addressing challenges faced by engineers using GaN technology.

➀ Infineon is planning a 100V GaN transistor with an integrated Schottky diode for hard-switched power topologies;

➁ The lack of body diode in GaN-based topologies can lead to higher power losses due to the larger effective body diode voltage;

➂ The new device is designed to reduce dead-time and maintain efficiency by connecting a Schottky diode in anti-parallel with the GaN transistor.

➀ MinebeaMitsumi has announced a tender offer to acquire thermistor specialist Shibaura Electronics to save it from a hostile takeover bid from Taiwan's Yageo Corp.;

➁ Shibaura Electronics, with a 13.5% world market share in thermistors, is a key player in vehicles, wind turbines, and industrial robots;

➂ Yageo Corp. plans to make a takeover bid on May 7th, offering $29 per share, but MinebeaMitsumi is offering $31 per share, totaling $485 million for the company.

➀ Ed在日记中透露，关税问题让他感到自豪，他预见到这将是Liz Truss故事的翻版，并相应地应对。

➁ 到周二晚上，关税已使全球股市价值蒸发10万亿美元，而到周四早上，股市又上涨了6万亿美元。

➂ 所有金融人士都说，当政府债券开始抛售时，总统将改变方向，就像Liz在她预算后大量出售金边债券时那样。

➀ Hamamatsu Photonics Europe has launched NZConnectMD Scan, an image acquisition platform for digital pathology workflows.

➁ The software allows for centralized control of multiple NanoZoomer MD Series scanners.

➂ Key features include barcode-based slide tracking, workflow balancing, and space optimization.