➀ HZDR secures €3.75M funding for MagKI and Magnon4KI projects to develop energy-efficient AI hardware using magnetic components and magnons, reducing energy consumption compared to transistor-based systems;

➁ The research focuses on integrating quantum technology and ultrafast magnetic wave analysis, with new infrastructure enabling nanoscale fabrication and terahertz-scale magnon behavior studies;

➂ Collaborations with industry partners like Infineon, GlobalFoundries, and Bosch aim to strengthen Saxony’s leadership in sustainable AI and quantum-enhanced computing.

➀ The Fraunhofer IEE-led HyLeiT project developed next-generation power converters using silicon carbide (SiC) semiconductors for electrolysis plants, enhancing DC power quality and grid stability.

➁ Modular converter solutions with improved efficiency and cost-effectiveness were created, alongside real-time simulation models to optimize grid integration and system reliability.

➂ Partners like Infineon and SMA Solar contributed to advancing electrolyser technology, supporting decarbonization in industries and mobility, with plans for commercial deployment in renewable energy grids.

➀ Infineon releases 1400V CoolSiC MOSFETs with TO-247PLUS-4 Reflow package, enhancing thermal performance and supporting DC-link voltages up to 200°C junction temperature;

➁ The devices enable compact designs for electric vehicle charging, battery storage, and photovoltaics, with RDS(on) ranging from 6-29mΩ;

➂ .XT interconnection technology improves robustness, while 1400V rating simplifies overvoltage protection and eliminates power derating needs.

➀ Infineon is sampling 60GHz CMOS radar sensors (BGT60CUTR13AIP) for ultra-low power IoT applications, targeting Physical AI enhancement in smart home devices;

➁ The sensor integrates on-chip processing, 7GHz bandwidth, and 20m detection range, supporting presence/gesture sensing while reducing host processor load;

➂ Applications include security cameras and HVAC systems, with features like autonomous wake-up and privacy-focused activity monitoring enabled by dedicated software stacks.

➀ Infineon and Rohm signed an MoU to collaborate on SiC power device packages, enabling each other as second sources to enhance customer design and procurement flexibility;

➁ Rohm adopts Infineon's top-side cooling platform (e.g., TOLT, Q-DPAK) for improved power density, while Infineon integrates Rohm's DOT-247 package to expand its SiC half-bridge solutions;

➂ The partnership aims to extend to silicon and wide-bandgap technologies (SiC, GaN) for broader customer solutions and industry innovation.

➀ The automotive semiconductor market is projected to grow from $68 billion in 2024 to $132 billion by 2030 (10% CAGR), five times faster than the auto market's 2% growth rate;

➁ Infineon, NXP, and ST lead the market, while Chinese firms, backed by national policies, advance in ADAS and power SiC. OEMs like Tesla, BYD, and Nio are vertically integrating, disrupting traditional supply chains;

➂ TSMC and Samsung control sub-16nm node production, with capacity fully booked through 2027. Challenges include geopolitical risks, AI compute demands, and centralized vehicle architecture shifts.

➀ Infineon Technologies launched PSoC Control C3 Performance Line MCUs with Post-Quantum Cryptography compliance and PSA Level 3 certification, addressing quantum-era security threats;

➁ The MCUs integrate LMS for quantum-resistant firmware verification and hardware-accelerated SHA-2, while delivering enhanced real-time control for industrial applications like motor control and EV charging;

➂ Engineering samples will be available in late 2025, with mass production planned for 2026, offering hybrid ECC+PQC signing and scalability for power conversion and motor control systems.

➀ Infineon and Nvidia collaborate to accelerate humanoid robot development by combining Infineon's MCUs, sensors, GaN transistors, and Marvell's Automotive Ethernet technology with Nvidia's Jetson Thor AI modules;

➁ The partnership focuses on precise motor control, real-time AI processing, and secure connectivity for industrial, logistics, and healthcare applications;

➂ Key components include Infineon's PSOC Control C3 MCUs for field-oriented-control algorithms and NVIDIA Holoscan Sensor Bridge integration.

➀ Infineon finalized its $2.5 billion acquisition of Marvell's Automotive Ethernet business, enhancing its leadership in automotive semiconductors and system expertise for software-defined vehicles;

➁ Marvell's Brightlane portfolio (PHY transceivers, switches, bridges) supports 100 Mbps–10 Gbps networks, with a $4 billion design-win pipeline by 2030;

➂ The acquired unit will form a new "Ethernet Solutions" business line, projected to generate $225–250 million revenue in 2025 at ~60% gross margins.

➀ Infineon reported Q2 (fiscal Q3) revenue of €3.704 billion and a profit of €668 million with an 18% margin;

➁ The company forecasts FY2025 revenue at ~€14.6 billion (slight YoY decline), with adjusted gross margin ≥40% and high-teens profit margin;

➂ Strategic focus includes acquiring Marvell’s Automotive Ethernet business, targeting AI data centers, energy infrastructure, and humanoid robots amid ongoing macroeconomic uncertainties.

➀ Infineon launched the CoolSiC MOSFET 1200 V G2 in a top-side-cooled Q-DPAK package, targeting industrial applications like EV chargers and solar inverters;

➁ The new generation reduces switching losses by 25%, improves thermal resistance by over 15%, and supports operation up to 200°C junction temperature;

➂ Enhanced package design enables compact heat dissipation, minimized parasitic inductance, and compatibility with automated manufacturing for scalable solutions.

➀ SkyWater licenses Infineon's mixed-signal ASIC design IP to enable secure U.S.-based manufacturing of high-reliability chips for automotive and defense systems;

➁ The IP, originally developed by Cypress Semiconductor, is validated in automotive-grade applications and will be deployed via SkyWater's S130 platform;

➂ The partnership aims to reduce offshore dependency and accelerate development of complex ASICs through proven IP integration and Technology as a Service (TaaS℠) support.

➀ HighTec EDV-Systeme, Elektrobit, and Infineon collaborated to enable Rust as an Autosar software component on TC4x automotive MCUs, allowing mixed Rust/C/C++ development;

➁ The integration includes Elektrobit's Autosar software, HighTec's Rust/C++ compiler, and Infineon's MCU abstraction layer, supporting cybersecurity and functional safety compliance (ASIL-D, UN R155, EU Cyber Resilience Act);

➂ The solution enhances memory safety, enables static analysis via Rust's Clippy, and targets Infineon's TriCore-based TC4x processors and STMicroelectronics' Arm-based Stellar MCUs.

➀ Dr. Marvin Schuleit and Dr. Marcel van Delden from Ruhr-Universität Bochum were awarded the Gebrüder-Eickhoff-Preis for their doctoral research on advanced engineering applications;

➁ Schuleit developed laser-based techniques to integrate shape-memory NiTi alloys with circuit boards, enabling reliable actuator systems for high-performance applications;

➂ van Delden improved microwave measurement systems by monolithically integrating components on a single chip using Infineon’s BiCMOS SiGe:C technology, enhancing bandwidth and stability for automotive radar and industrial use.

➀ Yole predicts the SiC market will grow at a 20% CAGR through 2030 to reach $10.3 billion, driven by automotive electrification and industrial diversification despite a short-term EV slowdown;

➁ Automotive remains the dominant sector (70% demand), while SiC adoption in 800V EV platforms and datacenters ($200M opportunity) accelerates;

➂ Transition to 8″ wafers progresses with Infineon and Wolfspeed leading, while global SiC investments exceed $30B, focusing on supply chain resilience and China's domestic production.

➀ Infineon Technologies collaborates with CIS Corporation to launch high-speed USB cameras powered by EZ-USB FX10/FX5 controllers, achieving up to 275% faster data transfer via USB 3.2 (5/10 Gbit/s);

➁ Integrated USB-C orientation detection and compact design reduce component needs, lowering costs and enabling deployment in medical, logistics, and robotics applications;

➂ Models with resolutions up to 20M pixels and 4K support will enter production in July, featuring CIS's Clairivu image processor and ultra-compact form factors.

➀ Infineon launched the automotive PSOC 4 HVMS MCU family with capacitive touch sensing, featuring Arm Cortex-M0+ processors (24/48MHz), up to 128KB flash memory, and 4.5-28V direct battery connectivity via integrated LDO.

➁ The MCUs support touch interfaces for steering wheels, door handles, and in-cabin controls, with ISO 26262 ASIL B functional safety, transient voltage protection, and autonomous capacitive scanning via a 5th-gen multi-sense converter.

➂ Available in wettable-flank QFN packages (6x6mm to 9x9mm) and equipped with LIN/CXPI communication, ADC, and safety-focused software libraries for automotive HMI applications.

➀ Most commodity components (standard logic, MCUs, etc.) have stabilized in lead times and pricing due to inventory adjustments and conservative procurement, while AI/ML/HPC-related components (DDR5, HBM, SSDs) face tightening supply and rising prices;

➁ Lead times vary across categories: volatile memory (2-22 weeks), storage (6-12 weeks), advanced analog (7-48 weeks), with interconnect prices expected to rise;

➂ External risks like tariffs could disrupt the stabilized supply chain, and procurement remains cautious about long-term orders amid fluctuating demand.

➀ Infineon's REF_600W_FBFB_XDPP1100 is a 600 W isolated DC-DC reference design targeting telecom, server, and industrial applications, utilizing a digital-controlled full-bridge topology with 96% peak efficiency and 22 W/cm³ power density;

➁ The design integrates XDPP1100 digital controller, OptiMOS MOSFETs, and EiceDRIVER gate drivers, supporting 36-72 V input range, PMBus/I2C communication, and ±1% output voltage accuracy across -40°C to 125°C;

➂ Features include fast transient response, active current sharing, GUI-based customization, and reduced BOM, with full design documentation available for accelerated development.

➀ Nvidia announced the Grace Blackwell Ultra AI chip (GB300) shipping in Q3 and a 4x performance boost in its RTX Pro Server for AI models;

➁ Nvidia and Infineon collaborated on centralized 800V HVDC power architecture for AI data centers to optimize space and efficiency;

➂ Wolfspeed faces bankruptcy due to $6.5B debt and loss of key clients like Tesla and Volkswagen, reducing its SiC market share from 32% to 19%.