➀ NXP Semiconductors推出的模块化区域控制器参考设计简化了下一代电动汽车(E/E架构)的开发,支持组件评估、优化物料清单(BOM)并加快上市时间。
➁ 该设计提供系统级性能指标,包括功耗、唤醒时间、延迟和整体性能,有助于快速评估和加速市场进入。
➂ 设计基于最新的半导体创新,集成了成本效益优化的芯片组,并且硬件可根据独特需求定制,符合汽车级设计和生产质量标准。
➀ NXP Semiconductors推出的模块化区域控制器参考设计简化了下一代电动汽车(E/E架构)的开发,支持组件评估、优化物料清单(BOM)并加快上市时间。
➁ 该设计提供系统级性能指标,包括功耗、唤醒时间、延迟和整体性能,有助于快速评估和加速市场进入。
➂ 设计基于最新的半导体创新,集成了成本效益优化的芯片组,并且硬件可根据独特需求定制,符合汽车级设计和生产质量标准。
➀ A roundup of the latest electronics news from Embedded World 2024, covering automotive, military, telecoms, industrial, and consumer electronics sectors.
➁ Infineon is launching a RISC-V starter kit for automotive microcontrollers.
➂ NXP reveals MCX MCUs with Matter, Thread, Zigbee, and Bluetooth LE.
➀ The MR2001_RD reference design is a powerful tool for developing high-performance 2D radar transceivers, featuring six receive channels and a low phase noise transmitter.
➁ It supports accurate modulation and high-resolution target detection with an update rate of ten measurements per second, thanks to its high-frequency bandwidth.
➂ The design is flexible and adaptable, allowing users to customize the system with their own signal-processing hardware and includes a graphical user interface for visualizing target information.
➀ NXP is acquiring Kinara, a specialist in programmable discrete neural processing units (NPUs).
➁ The acquisition is valued at $307 million and is expected to close in the first half of 2025.
➂ Kinara's NPUs and software enable energy-efficient AI performance across various neural networks.
➀ NXP announced plans to lay off approximately 1,800 employees globally due to increased tariffs in the US and market pressures.
➁ The decision is not directly related to concerns about potential trade wars but is related to broader market conditions.
➂ NXP expects its workforce to 'slightly decrease', with the number of employees reduced no more than 5% globally.
➃ NXP's President and CEO Kurt Sievers commented on the company's performance in 2024, noting a 5% decline in revenue and a focus on managing growth strategies.
➄ NXP obtained a €1 billion loan from the European Investment Bank to accelerate semiconductor innovation.