➀ Foxconn is reportedly bidding for Singapore-based UTAC to expand chip packaging capabilities, with a potential $3 billion deal;
➁ UK startup SCI Semiconductor raised £2.5M to develop CHERI-based secure microcontrollers, planning to expand its team in Sheffield;
➂ Nvidia partnered with Texas Instruments for 800Vdc data centers to enhance AI processor power efficiency, while Renesas abandoned SiC market plans due to Wolfspeed’s instability, and Dyson launched a slim vacuum cleaner with improved hair-cleaning features.