21年前，在Globalpress 'Leading the Recovery'会议中，一个小组讨论了'何时会有量产的90nm SoC'的问题。

来自Cadence Design Systems的高级副总裁Ted Vucurevich表示，预计最早在2004年将出现基于90nm工艺的FPGA设计。

来自Synopsys的Anton Domic认为，到2004年，将会有非FPGA芯片在90nm工艺上实现量产。

台积电的Andrew Moore也提到，公司的发展路线图显示，90nm工艺将在2004年实现。

量产90nm设计面临的挑战包括预期良率问题、客户信心问题、验证问题和成本问题。

➀ Intel has announced that its Intel 18A process, the final and most important in its 'four years, five nodes' plan, is ready for tape-out in the first half of this year;

➁ The 18A process represents a significant breakthrough for Intel's IDM 2.0 strategy and is seen as a key signal for the revitalization of Intel Foundry Services (IFS);

➂ The 18A process will introduce several advanced semiconductor technologies, with a 30% increase in chip density and a 15% improvement in performance per watt compared to Intel's 3nm process;

➃ Intel plans to apply the 18A process to the upcoming Panther Lake laptop processors and Clearwater Forest server CPUs;

➄ The ribbonFET full-gate transistor and PowerVia backside power supply technology are the two major breakthroughs of the 18A process;

➅ The ribbonFET transistor achieves a full-gate (GAA) architecture, providing finer control of current flow and reducing power consumption and leakage;

➆ PowerVia backside power supply technology changes the logic of chip wiring, making the power supply path for transistors more direct and improving power supply efficiency;

➇ Intel's next-generation mobile processor Panther Lake and desktop processor Nova Lake will be based on the Intel 18A process, with the server CPU Clearwater Forest also planned for release in the first half of 2026;

➈ Intel will also cooperate with external chip design companies to customize chips, such as Amazon and Microsoft.

➀ Intel has officially launched the introduction of its most advanced 18A process technology and claims it is 'ready';

➁ The 18A process is expected to enter mass production in mid-2025, with the Panther Lake processor from the Core Ultra 300 series as the first to use it, which is expected to be launched in the second half of this year;

➂ Compared to the Intel 3 process node, the 18A process improves performance per watt by 15% and chip density by 30%;

➃ Intel 18A uses RibbonFET GAA transistor technology for precise current control and improved performance per watt, minimum voltage operation, and electrostatic performance;

➄ The PowerVia背面供电 technology of Intel 18A can improve density and utilization rate by 5% to 10% and reduce resistance power drop, thereby improving ISO power performance by up to 4%;

➅ Intel 18A is expected to enter mass production in the second half of 2025, potentially leading the industry by nearly a year over TSMC's N2 process.

➀ Intel principal engineer expresses concern over TSMC's potential takeover of Intel Foundry.

➁ He highlights Intel's 18A technology advantage and advancements in semiconductor manufacturing.

➂ Bonetti argues against the notion that TSMC engineers are necessary for Intel's latest process technologies.

➀ TechInsights and SemiWiki revealed key details about Intel's 18A (1.8nm) and TSMC's N2 (2nm) process technologies at the International Electron Devices Meeting (IEDM).

➁ Intel 18A offers higher performance, while TSMC N2 may provide higher transistor density.

➂ TSMC N2 can reduce power consumption by 24% to 35% compared to the previous generation, while Intel 18A has the highest performance among 2nm process technologies.

➃ TSMC's N2 has a higher density of high-density logic unit transistors, with a density of 313 MTx/mm2, followed by Intel with 238 MTx/mm2 and Samsung with 231 Mtx/mm2.

➄ TSMC's N2 is expected to have an average yield rate of >80% for 256Mb SRAM arrays, with a peak yield rate of >90%.

➅ Intel 18A is scheduled to enter mass production in mid-2025, while TSMC's N2 is planned for late 2025.

➀ Intel's hopes of surpassing TSMC in process technology this year or next year have been challenged after TSMC announced that their A16 process will enter mass production in the second half of 2026.

➁ Intel plans to start ramping up its 18A process in H2 2025, but it suggests that volume production won't occur until 2026, while TSMC is expected to achieve high-volume production on its equivalent N2 process in H2 2025.

➂ With the potential acquisition rumors and investor frustration over Intel's struggle to catch up in process technology, the situation looks bleak for Intel.