➀ The Innexis Product Suite from Siemens EDA is designed to enable shift-left methodologies in IC and systems development; ➁ It offers tools for early hardware and software validation, enhancing the overall development and verification process; ➂ The suite includes components like Developer Pro, ANA, and VSI that facilitate continuous development and faster time-to-market.

➀ The increasing complexity of SoC designs and the challenge of shorted nets in LVS verification; ➁ The challenges of traditional LVS verification and short debugging approaches; ➂ The benefits of the Calibre RVE Interactive Short Isolation (ISI) flow for efficient short isolation and debugging; ➃ The boost in designer productivity through integrated short isolation.

1. Siemens EDA has introduced three new circuit simulators under the Solido Simulation Suite to address the increasing demands for higher performance and capacity in 7nm and smaller nodes. 2. The new simulators include Solido SPICE, Solido LibSPICE, and Solido FastSPICE, each designed for different requirements and integration with other Siemens EDA tools. 3. Early customer results indicate significant speed improvements ranging from 2X to 68X, while maintaining accuracy, with endorsements from major semiconductor companies.

1. Siemens EDA introduces Calibre 3DThermal, a new tool for early thermal analysis in chiplet and 3D IC designs. 2. The tool enables efficient shift-left analysis and verification, allowing teams to start thermal analysis early in the design process. 3. Calibre 3DThermal integrates with existing Siemens EDA tools and supports multi-physics analysis, aiding in meeting thermal, power, and timing goals.

➀ Siemens Digital Industries Software announced that its Solido SPICE simulation tool is now certified for Samsung Foundry's FinFET and GAA fabrication processes, including various process technologies. ➁ Solido SPICE is also qualified for Samsung Foundry's FD-SOI 18FDS process technology. ➃ Samsung Foundry's vice president Hyung-Ock Kim emphasized the importance of this certification for IC developers.

➀ Stephanie Dournelle discusses the digital transformations challenging the automotive industry; ➁ The need to shorten development times as vehicles become more intelligent; ➂ The importance of having a platform enabling standardized exchanges between OEM, Tier-2, and Tier-1 parties.

➀ Siraj Shaikh discusses the role of academia in pushing the frontiers of knowledge and serving as a neutral playground for new ideas. ➁ He emphasizes the importance of working with industry partners to integrate modern industrial technologies into road vehicles. ➃ The increasing complexity and connectivity of vehicles highlight the substantial challenge of automotive security.

➀ Heiko Dudek from Siemens EDA discusses the importance of reliability in automotive design and planning it upfront. ➁ The formation of ecosystems in the European automotive industry is crucial, driven by RTOs like Imec, Fraunhofer, and Leti. ➂ Design-for-test is essential when combining silicon from various sources to ensure functionality and longevity.

➀ Lee Harrison discusses Siemens' role in ensuring Europe remains the top supplier of automotive components; ➁ He covers the challenges of developing more advanced silicon, the role of chiplets, and advancements in safety requirements; ➂ The interview touches on the end-to-end development flow for automotive semiconductor ICs.

➀ The development of the semiconductor industry is a history of miniaturization, integration, and intelligence, with EDA tools playing a crucial role in each technological leap;➁ Siemens EDA, as the first EDA company to enter China, has grown steadily for 35 years, supporting the rapid development of China's semiconductor industry; ➂ Siemens EDA offers a comprehensive solution for chip design, verification, manufacturing, and packaging, with key features such as AI-driven tools and hardware-assisted verification platforms; ➃ Siemens EDA is committed to building an open and secure AI ecosystem, focusing on developing highly customizable and scalable AI tools; ➄ Siemens EDA is driving the development of intelligent vehicles by providing EDA tools and digital twin technology, addressing challenges in system expansion, functional safety, and reliability.

➀ Lee Harrison discusses trends in the testing market, software defined vehicles, V2X, and security. ➁ He highlights the use of multi-die chips for scaling complexity cost-effectively. ➂ The discussion also covers AI and the application of SSN (streaming scanned networks) as a significant testing technology.

1. Siemens Digital Industries Software and Intel Foundry have certified Solido EDA software for Intel's 16 and 18A nodes. 2. The collaboration enables an embedded multi-die interconnect bridge (EMIB) for faster 3D-IC design implementation. 3. Intel 18A features RibbonFET GAA transistor architecture and PowerVia backside power delivery technologies, supported by Siemens' Solido Simulation Suite.