Recent #IC Design news in the semiconductor industry

3 months ago

➀ This article discusses the challenges of physical design verification for custom and analog/mixed-signal IC designs.

➁ It introduces Siemens' Calibre Pattern Matching tool for early-stage physical verification.

➂ The tool allows for interactive symmetry checking and early IP placement verification, reducing design time and improving quality.

Calibre Pattern MatchingEDAEarly VerificationIC DesignIP ReuseLayout VerificationPhysical DesignSiemensSymmetry Checkingverification
5 months ago
➀ The complexities of modern IC designs with multiple clocks and asynchronous resets make reset logic more challenging than in early single-clock designs; ➁ Reset Domain Crossing (RDC) tools, like Questa RDC, perform static verification on reset logic to identify issues like glitches and metastability; ➂ Siemens' Questa RDC is effective in identifying structural and advanced reset tree issues, ensuring integrity before tapeout.
EDAIC DesignQuesta RDCReset LogicSiliconStatic Analysisverification
6 months ago
➀ The Innexis Product Suite from Siemens EDA is designed to enable shift-left methodologies in IC and systems development; ➁ It offers tools for early hardware and software validation, enhancing the overall development and verification process; ➂ The suite includes components like Developer Pro, ANA, and VSI that facilitate continuous development and faster time-to-market.
EDAHardware-Software Co-DesignIC DesignInnexis Product SuiteInnovationShift LeftSiemens EDASystem Development
2 months ago

➀ Sofics, a leading provider of specialized I/O and on-chip electrostatic discharge (ESD) solutions, and Dolphin Semiconductor, a leader in semiconductor IP solutions with a focus on mixed signal IP design, have announced a strategic partnership.

➁ The partnership aims to enhance IC designs for customers in key sectors.

➂ The collaboration is set to strengthen the capabilities of both companies in the semiconductor industry.

IC DesignIP Solutionssemiconductor
4 months ago

➀ This week's electronics news covers topics including low-cost IC design, AI infrastructure investment, and advancements in CubeSat technology.

➁ A research project focused on developing reliable moving parts for weight-conscious CubeSats resulted in an innovative lightweight, space-proof circuit.

➂ There is also a discussion about two rocket manufacturers in Bavaria, Rocket Factory Augsburg and Isar Aerospace, and their prospects in the space launch industry.

AIIC Design
5 months ago
➀ Memory growth is expected to exceed 24% due to the increasing adoption of high-end products like HBM3 and HBM3e, with HBM4 introduction in H2 2025. Non-memory is projected to grow 13% driven by advanced node ICs for AI servers, high-end mobile phone ICs, and WiFi7. ➁ The Asia-Pacific IC design market is set to grow 15% as inventory levels stabilize, personal device demand rises, and AI computing expands. ➂ TSMC's market share is projected to increase in Foundry 1.0 and 2.0, with the expansion of advanced nodes like 2nm and 3nm. ➃ 2nm and 3nm production is expected to accelerate, with TSMC and Samsung leading the way. ➄ Foundry capacity utilization is expected to increase, and 2025 is critical for 2nm mass production. ➅ China's packaging and testing market share is set to rise, and FOPLP will grow rapidly post-2025.
CoWoSFOPLPIC DesignIDCIntelSamsungTSMCfoundrymemorysemiconductor