➀ Memory growth is expected to exceed 24% due to the increasing adoption of high-end products like HBM3 and HBM3e, with HBM4 introduction in H2 2025. Non-memory is projected to grow 13% driven by advanced node ICs for AI servers, high-end mobile phone ICs, and WiFi7. ➁ The Asia-Pacific IC design market is set to grow 15% as inventory levels stabilize, personal device demand rises, and AI computing expands. ➂ TSMC's market share is projected to increase in Foundry 1.0 and 2.0, with the expansion of advanced nodes like 2nm and 3nm. ➃ 2nm and 3nm production is expected to accelerate, with TSMC and Samsung leading the way. ➄ Foundry capacity utilization is expected to increase, and 2025 is critical for 2nm mass production. ➅ China's packaging and testing market share is set to rise, and FOPLP will grow rapidly post-2025.

➀ FOPLP, which started in 2016 with TSMC's InFO technology, uses rectangular glass substrates, offering three times the usable area of a 12-inch wafer, potentially reducing packaging costs. ➁ Despite its advantages, FOPLP has faced challenges such as low yield and the need for new materials and equipment. ➂ The resurgence of interest in FOPLP is driven by AI GPU manufacturers like NVIDIA and AMD seeking larger, cost-effective packaging solutions.