➀ FOPLP, which started in 2016 with TSMC's InFO technology, uses rectangular glass substrates, offering three times the usable area of a 12-inch wafer, potentially reducing packaging costs. ➁ Despite its advantages, FOPLP has faced challenges such as low yield and the need for new materials and equipment. ➂ The resurgence of interest in FOPLP is driven by AI GPU manufacturers like NVIDIA and AMD seeking larger, cost-effective packaging solutions.