<p>➀ The rise of CoWoS has brought significant revenue to TSMC, threatening leading packaging factories like ASE and Amkor.</p><p>➁ TSMC's Q1 earnings forecast indicates an increase in advanced packaging, dispelling concerns about decreasing CoWoS demand.</p><p>➂ TSMC plans to increase CoWoS capacity to meet customer demand, with expected revenue contribution growing from 8% in 2024 to 10% in 2025.</p><p>➃ FOPLP, a new packaging technology, offers higher I/O density, better electrical performance, and larger packaging sizes, challenging the dominance of CoWoS.</p><p>➄ FOPLP's market is expected to grow significantly, with a projected CAGR of 32.5% over the next five years.</p><p>➅ Major players like TSMC, Samsung, and AU Optronics are actively involved in FOPLP development.</p><p>➆ Challenges for FOPLP include achieving high yields and establishing standards.</p>