➀ TSMC and SPIL are advancing their semiconductor manufacturing capabilities in Taiwan; ➁ The new 2nm fab in Kaohsiung will be a key facility for these efforts; ➂ The expansion focuses on advanced node and CoWoS packaging technologies.
Recent #CoWoS news in the semiconductor industry
1. TSMC's construction of its new CoWoS advanced packaging plant in Chiayi, Taiwan was halted this month after archaeological ruins were discovered. 2. TSMC has proposed a plan to build a second CoWoS advanced packaging facility in the Southern Science Park Administration of the National Science and Technology Council. 3. A cultural review meeting has been convened, and it was resolved that construction process will be monitored daily, regardless of whether it's a sensitive area or not.
➀ The rise of CoWoS has brought significant revenue to TSMC, threatening leading packaging factories like ASE and Amkor.
➁ TSMC's Q1 earnings forecast indicates an increase in advanced packaging, dispelling concerns about decreasing CoWoS demand.
➂ TSMC plans to increase CoWoS capacity to meet customer demand, with expected revenue contribution growing from 8% in 2024 to 10% in 2025.
➃ FOPLP, a new packaging technology, offers higher I/O density, better electrical performance, and larger packaging sizes, challenging the dominance of CoWoS.
➄ FOPLP's market is expected to grow significantly, with a projected CAGR of 32.5% over the next five years.
➅ Major players like TSMC, Samsung, and AU Optronics are actively involved in FOPLP development.
➆ Challenges for FOPLP include achieving high yields and establishing standards.
➀ Memory growth is expected to exceed 24% due to the increasing adoption of high-end products like HBM3 and HBM3e, with HBM4 introduction in H2 2025. Non-memory is projected to grow 13% driven by advanced node ICs for AI servers, high-end mobile phone ICs, and WiFi7. ➁ The Asia-Pacific IC design market is set to grow 15% as inventory levels stabilize, personal device demand rises, and AI computing expands. ➂ TSMC's market share is projected to increase in Foundry 1.0 and 2.0, with the expansion of advanced nodes like 2nm and 3nm. ➃ 2nm and 3nm production is expected to accelerate, with TSMC and Samsung leading the way. ➄ Foundry capacity utilization is expected to increase, and 2025 is critical for 2nm mass production. ➅ China's packaging and testing market share is set to rise, and FOPLP will grow rapidly post-2025.
➀ Broadcom unveils its 3.5D XDSiP platform for AI and HPC processors; ➁ The platform utilizes TSMC's CoWoS and advanced packaging technologies; ➂ It allows for SiPs with up to 6000mm² of 3D-stacked silicon and 12 HBM modules, set to arrive in 2026.
➀ TSMC is considering raising prices for its in-demand 3nm process and CoWoS advanced packaging technology to meet the huge demand.
➁ TSMC plays a crucial role in the manufacturing of high-performance computing and cloud AI chips, with a significant demand for its advanced processes and packaging technologies.
➂ Reportedly, TSMC plans to implement the price increase in 2025 with NVIDIA's approval, affecting the entire supply chain.
➀ TSMC's CoWoS capacity will double in 2024 and 2025, but demand will continue to exceed supply;
➁ The CoWoS expansion wave is expected to extend into 2026, benefiting equipment suppliers for the next two to three years;
➂ Advanced packaging currently accounts for 7-9% of TSMC's revenue, with expected growth to outpace the company's average over the next five years;
➃ TSMC's CoWoS monthly production capacity is expected to reach 35,000 to 40,000 wafers this year, and surge to 80,000 wafers per month next year;
➄ Strong demand from major AI customers is driving capacity needs, potentially reaching 140,000 to 150,000 wafers per month by 2026.
➀ Taiwan's specialty chemical sector is expected to benefit from TSMC's expansion, with local suppliers seeing increased demand for materials. ➁ Companies like Nan Pao, Sunlux, and Jie Liu Fa have already reported strong earnings, with more expected to follow. ➂ The integration into TSMC's CoWoS advanced packaging process is set to further boost these companies' profits, with estimates showing significant EPS increases for the next two years.
1. TSMC has temporarily halted the construction of its CoWoS (Chip on Wafer on Substrate) fabrication facility. 2. The suspension is due to the unexpected discovery of archaeological ruins at the construction site. 3. This delay impacts TSMC's plans for expanding its advanced packaging capabilities.