➀ TSMC and SPIL are advancing their semiconductor manufacturing capabilities in Taiwan; ➁ The new 2nm fab in Kaohsiung will be a key facility for these efforts; ➂ The expansion focuses on advanced node and CoWoS packaging technologies.
Recent #Wafer Fabrication news in the semiconductor industry
➀ Wafer fabrication, or wafer fab, is the process of transforming raw materials into intricate microchips; ➁ It involves sophisticated techniques and technologies for precision and efficiency; ➂ It is crucial for various applications such as smartphones and electric vehicles.
➀ China's Big Fund III has begun spending its $47 billion allocation; ➁ The fund aims to support chip production equipment developers and makers; ➂ The investment is part of China's effort to become self-sufficient in semiconductor production.
➀ Lam Research unveils Dextro, a collaborative robot for fab maintenance; ➁ Dextro improves accuracy and efficiency in equipment maintenance; ➂ The cobot is designed to reduce errors and enhance productivity in semiconductor manufacturing.
➀ World Advanced announced its entry into the 12-inch wafer fabrication market and the construction of a new factory this year, with the company and the outside world showing confidence in the plan, hoping that the new factory will be fully operational in five years, doubling the annual revenue from 50 billion to 100 billion.
➁ The company plans to lead the 12-inch project, investing $7.8 billion, in a joint venture with NXP, and receiving all the necessary technology and resources from TSMC. The company's board of directors, management, and the outside world are all confident in the plan, and the company also remembers its social responsibility for corporate governance and environmental changes.
➂ World Advanced will focus on the development of power management chips next year, expecting the performance in the ultra-high-voltage process to grow by double-digit percentages. However, there are still uncertainties such as geopolitical issues and the US election, which need to be observed and paid attention to.
➀ Unigroup Corelink has achieved a leading position in the automotive wafer fabrication market through its advanced technologies in IGBT, SiC MOSFET, BCD process, MEMS wafer fabrication, and power module packaging.
➁ Corelink was founded in 2018 and has expanded from MEMS and power device wafer fabrication and packaging to wide-bandgap semiconductor process development.
➂ Corelink's product line covers power semiconductors, sensor signal chains, analog mixed-signal high-voltage ICs, and is widely used in new energy vehicles, industrial control, and high-end consumer markets.
➀ Vanguard International Semiconductor Corp (VIS) and Episil Technologies Inc. announce a strategic partnership to build an 8-inch SiC wafer fab in Taiwan; ➁ VIS acquires a 13% stake in Episil for NT$2.48 billion; ➂ The joint venture is a significant step in the SiC wafer manufacturing industry.