1. proteanTecs introduces a Real Time Safety Monitoring (RTSM) solution for automotive electronics at DAC 2024; 2. The solution monitors chip performance in real-time under actual workloads to predict and prevent failures; 3. RTSM uses embedded sensors, sophisticated software, and AI to ensure system reliability and performance.
Recent #semiconductors news in the semiconductor industry
1. SK hynix plans to invest $74.6 billion over the next 3 years to strengthen its memory business. 2. An additional $58 billion will be invested in AI and semiconductors by SK Group. 3. The investments aim to enhance competitiveness in the AI market, including HBM chips and AI data centers.
1、TSMC将在2024年下半年开始大量生产N3P工艺，提高性能效率和transistor密度。2、N3E工艺已经实现大量生产，yield性能优良。3、N3P工艺是N3E的光学缩小版，具有更高的性能效率和transistor密度。
➀ President Trump and CC Wei announced a $100 billion investment by TSMC in Arizona, bringing the total investment to $165 billion;
➁ The investment is expected to create thousands of high-paying jobs and support the progress of AI and smartphones;
➂ TSMC plans to build three more fabs and two more packaging plants in Arizona.
➀ Samsung and SK Hynix are competing to supply HBM4 to Broadcom, a rising competitor against NVIDIA.
➁ SK Hynix has received a request from Broadcom for a large supply of custom HBM4.
➂ Samsung is also in discussions with Broadcom about supplying HBM4.
➀ Researchers from IISc and UCL have developed a machine learning method using transfer learning to predict material properties; ➁ The method is particularly useful for applications like semiconductors and energy storage; ➂ The study employs Graph Neural Networks (GNNs) and the Multi-property Pre-Training (MPT) framework to enhance predictive power.
➀ Researchers from Florida State University have developed a novel method to create a class of 2D materials and enhance their magnetic characteristics; ➁ The team achieved this by chemical treatment of FGT and a new method for collecting the material; ➂ The breakthrough includes creating a permanent magnet with enhanced coercivity, opening up possibilities for 2D magnets in data storage, spin filtering, and electromagnetic shielding.
➀ The US-China tension is fostering a tech hub in Southeast Asia with over $100 billion in foreign direct investment in Malaysia and Vietnam.
➁ The rise is driven by multinational corporations, governments, and startups developing AI and establishing chip manufacturing centers.
➂ Malaysia is expanding its chip manufacturing capacity and attracting foreign investment, aiming to become a high-income country.
➃ Vietnam's Bac Ninh province is becoming a high-tech industrial center with over 37,000 new jobs created.
➄ China's tech firms are setting up operations in Vietnam to avoid trade restrictions and access advanced chips.
➅ Singapore's Jurong district is becoming a hub for AI and data centers, with significant investments from Nvidia and Microsoft.
➀ Resilience will be a key focus for electronics supply chains in 2025, as companies seek to identify lower-risk components and localize their supply bases. ➁ AI integration in supply chains will intensify, with a focus on new applications for parsing supply chain intelligence and automating tasks. ➂ A new emphasis on sustainability will see organizations tackle scope-3 emissions in their supply chains, contributing to a deeper understanding of individual component emissions. ➃ Despite improvements, global chip shortages and long manufacturing lead times will continue to challenge the industry.
➀ Mouser has launched its RISC-V resource center to educate design engineers on the latest technology and applications. The center provides articles, blogs, eBooks, and products from Mouser’s technical team and manufacturing partners. It discusses how RISC-V is advancing machine learning closer to the edge in various devices.➁ Mouser offers a range of semiconductors and electronic components for RISC-V applications, including Renesas Electronics’ RISC-V MCU Fast Prototyping Board and Raspberry Pi Pico 2.➃ The resource center explores the benefits of RISC-V technology in areas such as consumer electronics, industrial sensors, and healthcare devices.
➀ Infineon and Stellantis are collaborating on the power architecture for Stellantis' electric vehicles, signing major supply and capacity agreements. These agreements cover Infineon's smart power switches, SiC semiconductors, and AURIX microcontrollers. ➁ The partnership will establish a Joint Power Lab to define the next-generation scalable and intelligent power architecture. ➂ Infineon's facilities and partnerships, including its SiC fab in Malaysia and joint ventures with TSMC and ESMC, will support the increased demand for auto ICs.
➀ TSMC stopped shipping chips to a specific customer in mid-October after discovering the chips were used in Huawei products;
➁ It is unclear whether the customer represents Huawei and where its headquarters are located;
➂ The incident provides new clues to recent reports, including those from The Information, which claimed the US recently contacted TSMC about producing chips for a blacklisted Chinese company;
➃ Huawei has relied on Semiconductor Manufacturing International Corporation (SMIC) for its chip production, including the 7-nanometer chips used in its smartphones last August;
➄ TSMC stopped shipping chips to Huawei after September 15, 2020, and reiterated this point when asked about TechInsights' report;
➅ TSMC and Huawei representatives refused to comment on the reports;
➆ The US Department of Commerce acknowledged that there may have been violations of US export control regulations;
➇ TSMC stated that it is a law-abiding company committed to complying with all applicable regulations, including export control regulations;
➈ Huawei stated that it has not produced any chips through TSMC since the implementation of the Foreign Direct Product Rule (FDPR) in 2020;
➉ Taiwan's Minister of Economic Affairs stated that Taiwan respects the US' export control measures and will communicate fully with TSMC;
➊ The US Bureau of Industry and Security (BIS) had a meeting with TSMC executives in October to discuss supply chain issues, including whether third-party distributors can provide restricted technology to China.
➀ TSMC's CoWoS capacity will double in 2024 and 2025, but demand will continue to exceed supply;
➁ The CoWoS expansion wave is expected to extend into 2026, benefiting equipment suppliers for the next two to three years;
➂ Advanced packaging currently accounts for 7-9% of TSMC's revenue, with expected growth to outpace the company's average over the next five years;
➃ TSMC's CoWoS monthly production capacity is expected to reach 35,000 to 40,000 wafers this year, and surge to 80,000 wafers per month next year;
➄ Strong demand from major AI customers is driving capacity needs, potentially reaching 140,000 to 150,000 wafers per month by 2026.
➀ SiC and GaN, as third-generation semiconductors, have gained popularity due to their wide bandgap; ➁ The U.S. is investing heavily in ultra-wide bandgap (UWBG) semiconductor technology; ➂ DARPA has announced a contract with Raytheon to develop ultra-wide bandgap semiconductors using diamond and aluminum nitride; ➃ Element Six, a synthetic diamond material company, is leading a project under DARPA's UWBGS program to advance semiconductor technology; ➄ The U.S. government is investing in the development of UWBG semiconductors, including projects at North Carolina State University.
➀ NPUs are hardware accelerators for artificial intelligence, complementing CPUs and GPUs. ➁ NPUs are designed for repetitive tasks with high-throughput and parallelism, such as neural networks and machine learning. ➂ NPUs are integrated into consumer devices like laptops and PCs, and are also used in cloud-based systems for edge intelligence and reduced latency.
➀ India is poised to become a major player in the semiconductor production market, with the first microchips expected to be produced by 2027; ➁ The US has been involved in this plan, with major companies like AMD, Nvidia, and Micron showing interest in producing chips in India; ➂ India's Commerce Minister Piyush Goyal highlighted the country's technological independence from China, emphasizing its expertise in the IT sector; ➃ Taiwan's TSMC, the world's largest contract semiconductor manufacturer, could play a role in India's efforts, despite potential competition; ➄ The Taiwanese company PSMC plans to build a factory in India to produce chips, marking a significant step in India's semiconductor industry.
➀ Raytheon has been awarded a contract from DARPA to develop diamond and aluminum nitride semiconductors with ultra-wide bandgap; ➁ These materials are known for their high thermal conductivity, especially diamond; ➂ The project aims to revolutionize semiconductor electronics with improved power delivery and thermal management.
➀ Powerchip Semiconductor, the Taiwanese foundry, has abandoned its plan to build a fab in Japan in favor of constructing one in India. The company had previously entered into a partnership with SBI Holdings to build a 40k wpm fab in Sendai, Japan, starting with 40nm technology and moving to 28nm with volume production scheduled for 2027. The partnership has now been dissolved as Powerchip seeks to provide technology for a fab to be built in India by Tata. ➁ Last week, Indian Prime Minister Narendra Modi met with Natarajan Chandrasekaran, chairman of Tata, and Powerchip chairman Frank Huang, where PSMC expressed interest in expanding its presence in India. ➂ Powerchip and Tata have agreed to collaborate on a fab in Gujarat, India, with Tata providing the funding and Powerchip providing the process technology for PMICs and display drivers.
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