1. TSMC is exploring a 'radically new' semiconductor packaging technique called panel-level packaging. 2. Panel-level packaging uses rectangular substrates instead of conventional round wafers, which can accommodate more chips. 3. The research is still in early stages and would require significant development of production tools and materials, as well as a potential overhaul of facilities for a long-term plan.
Recent #Semiconductor Packaging news in the semiconductor industry
➀ The rise of CoWoS has brought significant revenue to TSMC, threatening leading packaging factories like ASE and Amkor.
➁ TSMC's Q1 earnings forecast indicates an increase in advanced packaging, dispelling concerns about decreasing CoWoS demand.
➂ TSMC plans to increase CoWoS capacity to meet customer demand, with expected revenue contribution growing from 8% in 2024 to 10% in 2025.
➃ FOPLP, a new packaging technology, offers higher I/O density, better electrical performance, and larger packaging sizes, challenging the dominance of CoWoS.
➄ FOPLP's market is expected to grow significantly, with a projected CAGR of 32.5% over the next five years.
➅ Major players like TSMC, Samsung, and AU Optronics are actively involved in FOPLP development.
➆ Challenges for FOPLP include achieving high yields and establishing standards.
➀ Samsung's ambition to enter the semiconductor foundry market in early 2022 was thwarted by its weaknesses in advanced packaging compared to TSMC.
➁ Samsung has been actively hiring key personnel and investing in advanced packaging technology to catch up with TSMC.
➂ Despite its early advancements in packaging technology, Samsung has struggled to maintain its competitive edge due to lack of investment and market focus.
➀ Henkel Adhesive Technologies is focusing on supporting innovation in semiconductor packaging; ➁ Global market and strategy director Ram Trichur discusses the latest trends in chip packaging; ➂ The company is investing in India to establish an applications engineering center for electronics development.
➀ Resonac Corporation introduces a photosensitive film for advanced semiconductor packaging; ➁ The film enables 1.5μm line width and spacing on organic interposers; ➂ The innovation supports miniaturization and efficiency in semiconductor packaging.
➀ Professor Ma Shenglin of Xiamen University will participate in and lecture at the '66th 'Microscopy and Microfabrication' Training Course: MEMS Manufacturing Process' from October 18 to 20, 2024;
➁ Ma Shenglin is a professor, doctoral supervisor, and conducts research in advanced semiconductor packaging (TSV, 3D SIP, MEMS), 3D radio frequency micro-system integration, and implantable electronic micro-system packaging;
➂ The course will cover the development history and latest progress of TSV 3D integration technology, key process issues, and potential solutions, along with typical application cases such as microfluidic cooling, radio frequency, and photonic micro-systems.
➀ Amkor Technology has made significant progress in its operations at its new facility in Bac Ninh, Vietnam; ➁ The company commenced operations in August 2023; ➂ Amkor is experiencing strong growth and contributing to the development of Vietnam's semiconductor industry.