<p>➀ Professor Ma Shenglin of Xiamen University will participate in and lecture at the '66th 'Microscopy and Microfabrication' Training Course: MEMS Manufacturing Process' from October 18 to 20, 2024;</p><p>➁ Ma Shenglin is a professor, doctoral supervisor, and conducts research in advanced semiconductor packaging (TSV, 3D SIP, MEMS), 3D radio frequency micro-system integration, and implantable electronic micro-system packaging;</p><p>➂ The course will cover the development history and latest progress of TSV 3D integration technology, key process issues, and potential solutions, along with typical application cases such as microfluidic cooling, radio frequency, and photonic micro-systems.</p>