➀ Hynix is set to sample HBM3e 16hi memory in the first half of 2025; ➁ Lightsynq Technologies emerges with $18 million in Series A funding for diamond optical interconnects in quantum computing; ➂ DigiKey is optimistic about the future of the electronics market; ➃ Texas Instruments aims to increase in-house manufacturing to 95% by 2030.
Recent #Packaging Technology news in the semiconductor industry
➀ The semiconductor industry is facing a paradigm shift due to the slowing down of traditional scaling.
➁ Chiplet-based architectures offer advantages such as modularity, customization, and improved yield.
➂ Innovations in packaging technology and pre-designed frameworks are streamlining chiplet design.
➀ Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025; ➁ Apple will use TSMC's 3nm process and SoIC technology for the M5 chips; ➂ The new M5 chips are expected to enhance AI capabilities in consumer devices and cloud services.
➀ Optical chips used in optical modules are made of various crystal materials and are very delicate.
➁ The packaging technology for different types of chips varies.
➂ The continuous advancement of AI's computing power drives the industry towards high-speed optical modules and raises market expectations.
➃ High-speed optical modules have characteristics such as high speed, large bandwidth, high power consumption, and increased attention to reliability due to internal temperature rise.
➄ Some processes affect both bandwidth and reliability.
➅ Packaging technology is a crucial part of the entire industry chain.
➀ Intel's Clearwater Forest is set to be released in 2025, featuring new packaging technology and the Intel 18A process. The chip has been shown at an event in Oregon, where photos of the new Intel Xeon 6 parts and the high-core count next-generation E-core Xeon were taken. The CPU package is constructed differently from previous models, with a new layout for PCIe I/O and UPI links. ➁ The new chip is expected to kickstart the E-core CPU revolution on the x86 side, offering a significant improvement over the previous generation. ➂ The Clearwater Forest is still in development, with no launch date set yet, despite the fact that it is already booting.
➀ FOPLP, which started in 2016 with TSMC's InFO technology, uses rectangular glass substrates, offering three times the usable area of a 12-inch wafer, potentially reducing packaging costs. ➁ Despite its advantages, FOPLP has faced challenges such as low yield and the need for new materials and equipment. ➂ The resurgence of interest in FOPLP is driven by AI GPU manufacturers like NVIDIA and AMD seeking larger, cost-effective packaging solutions.