➀ The design of high-performance electric vehicle power modules presents challenges in managing high voltage and current systems, particularly in thermal management and safety compliance; ➁ An integrated approach combining electrical, mechanical, and thermal designs is essential for reliability; ➂ Cadence's advanced design tool solutions enhance the safety and efficiency of power modules.

➀ Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025; ➁ Apple will use TSMC's 3nm process and SoIC technology for the M5 chips; ➂ The new M5 chips are expected to enhance AI capabilities in consumer devices and cloud services.

➀ Enhancing the efficiency and safety of electric vehicle power modules; ➁ Addressing challenges such as thermal management and electromigration in early design stages; ➂ Implementing a 'shift left' design methodology to minimize risks and reduce development costs.

1. Intel introduces 'Fast Throttle' thermal management with Core Ultra 200 series 'Arrow Lake' CPUs. 2. The technology dynamically adjusts clock speeds on individual cores to manage overheating. 3. This approach allows non-overheating cores to maintain performance, enhancing overall CPU efficiency.