Recent #Reliability news in the semiconductor industry
➀ Many technical applications integrate new and autonomous functions, making them 'smart'. These products operate based on information from the environment and knowledge bases, evaluated through artificial intelligence methods.
➁ The success of such products depends on mastering today's innovation dynamics and increased product complexity from the idea phase through the entire lifecycle.
➂ The Fraunhofer Smart Systems Community supports companies and explores new dimensions for reliable, trustworthy, and secure applications.
➀ The reliability of AI-based image recognition is ensured through a smart validation environment, even under adverse conditions such as strong vibrations.
➁ Components and sub-systems can be efficiently characterized under various mechanical boundary conditions, for example, to easily generate AI training data.
➂ The transfer of developed technologies into the economy is demonstrated through various development steps along the Technology Readiness Levels (TRL).
➀ The Enermax Revolution D.F. 12 750W PSU excels in power quality with impressive voltage regulation and ripple suppression.
➁ It offers a great balance between performance and thermal efficiency, with a hybrid fan mode and compact design.
➂ Despite its high price, the 10-year warranty and robust performance make it a reliable choice for enthusiasts and professionals.
➀ Rohm has expanded its general purpose chip resistors with the MCRx family;
➁ The MCRS series improves rated power and TCR characteristics;
➂ The series is available in various sizes and is compliant with the AEC-Q200 automotive reliability standard.
➀ Commercial APDs typically consist of InGaAs/InAlAs and InGaAs/InP, but they have high noise factors and require high-power lasers for long-range detection.
➁ Huawei has developed an APD structure with a 1.5μm InGaAs absorption layer and a 0.55μm Al0.85Ga0.15As0.56Sb0.44 layer on InP, achieving a 200 μm radius photosensitive area with an anti-reflection coating.
➂ AlGaAsSb APD demonstrates higher gain (127) and lower noise factor (4.0) compared to InP APD.
➃ AlGaAsSb APD has a sensitivity advantage of over 5dB at temperatures below 20°C and maintains a 2dB advantage at 105°C.
➄ In a laser radar system, AlGaAsSb APD provides four times the signal of InP APD, reducing the required laser power by 66%.
➅ AlGaAsSb APD passed reliability tests with a breakdown voltage decrease less than 1V and dark current increase less than 30% after 2000 hours of aging.
➀ Optical chips used in optical modules are made of various crystal materials and are very delicate.
➁ The packaging technology for different types of chips varies.
➂ The continuous advancement of AI's computing power drives the industry towards high-speed optical modules and raises market expectations.
➃ High-speed optical modules have characteristics such as high speed, large bandwidth, high power consumption, and increased attention to reliability due to internal temperature rise.
➄ Some processes affect both bandwidth and reliability.
➅ Packaging technology is a crucial part of the entire industry chain.
➀ Huawei has grown single-mode FP quantum dot lasers on (100) silicon substrates with a power of 33mW at 25℃ and 120mA;
➁ The final LI curve shows threshold currents of 18 mA and 30 mA at 25C and 85C, respectively, with an output power of 70 mW at 85℃ and 300 mA without any obvious rollover phenomenon;
➂ The reliability test shows that the threshold current increased by 6% after 5000 hours, and the light power decayed by less than 5%, with no significant degradation trend observed throughout the process.