<p>➀ Optical chips used in optical modules are made of various crystal materials and are very delicate.</p><p>➁ The packaging technology for different types of chips varies.</p><p>➂ The continuous advancement of AI's computing power drives the industry towards high-speed optical modules and raises market expectations.</p><p>➃ High-speed optical modules have characteristics such as high speed, large bandwidth, high power consumption, and increased attention to reliability due to internal temperature rise.</p><p>➄ Some processes affect both bandwidth and reliability.</p><p>➅ Packaging technology is a crucial part of the entire industry chain.</p>
Related Articles
- More capacitor help please6 months ago
- HM25: Smart Systems in Their Future Applications - Reliable, Trustworthy, and Secure8 months ago
- HM25: Dependable Smart Systems – Development Methods and Technology Transfer8 months ago
- Enermax Revolution D.F. 12 750W ATX 3.1 power supply review8 months ago
- Rohm adds to general purpose chip resistors9 months ago
- Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures9 months ago
- Philips sells MEMs foundry Xiver10 months ago
- Accelerating Automotive SoC Design with Chiplets10 months ago
- X-FAB upgrades its SiC process11 months ago
- Accelerating Electric Vehicle Development – Through Integrated Design Flow for Power Modules11 months ago