➀ Apple's next-gen M5 series processors are in the prototype phase using TSMC's N3P node; ➁ Mass production expected in 2025 and 2026 for M5, M5 Pro, M5 Max, and M5 Ultra; ➂ Server-grade SoIC packaging and separate CPU and GPU designs for improved yields and thermal performance.

➀ Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025; ➁ Apple will use TSMC's 3nm process and SoIC technology for the M5 chips; ➂ The new M5 chips are expected to enhance AI capabilities in consumer devices and cloud services.

1、TSMC的3D堆叠SoIC包装技术正在快速发展，计划2027年达到3μm间距。 2、TSMC的SoIC-X技术将在2027年实现A16和N2两代芯片的堆叠。 3、TSMC还将推出两种新的.packaging技术：SoIC-X和SoIC-P，适用于不同性能和 APPLICATION场景。