➀ Apple's next-gen M5 series processors are in the prototype phase using TSMC's N3P node; ➁ Mass production expected in 2025 and 2026 for M5, M5 Pro, M5 Max, and M5 Ultra; ➂ Server-grade SoIC packaging and separate CPU and GPU designs for improved yields and thermal performance.

➀ LB Semicon and its subsidiary LB Lusem are set to provide turn-key packaging services for power management chips used in AI data centers. ➁ They will handle both the front and back sides of wafers. ➂ The announcement was made on Wednesday.

➀ LB Semicon and its subsidiary LB Lusem will provide turn-key packaging services for power management chips used in AI data centers. ➁ The services will include processing for both the front and back sides of wafers. ➂ They will also offer testing for the chips.

➀ Samsung is conducting research to modify the packaging method for the LPDDR used in iPhones; ➁ The change is in response to Apple's request to convert the LPDDR IC into a discrete package; ➂ The new packaging will involve packaging the LPDDR separately.

➀ The Chips and Science Act allocates $11 billion for semiconductor R&D; ➁ The program targets five areas including advanced packaging and AI-driven design; ➂ Companies should apply now for funding opportunities.